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NANOINDENTATION OF THIN-film-substrate system DETERMINATION OF film HARDNESS AND YOUNG'S MODULUS

Acta Mechanica Sinica 2004年第4期20卷 383-392页

作者：陈少华刘磊王自强 LNM Institute of MechanicsChinese Academy of SciencesBeijing 100080China

In the present paper,the hardness and Young's modulus of film-substrate systems are determined by means of nanoindentation experiments and modified *** film and two kinds of substrates,*** and silicon,are *** XP Ⅱ and continuous stiffness mode are used during the *** order to avoid the influence of the Oliver and Pharr method used in the experiments,the experiment data are analyzed with the constant Young's modulus assumption and the equal hardness *** volume fraction model(CZ model)proposed by Fabes et al.(1992)is used and modified to analyze the measured *** method proposed by Doerner and Nix(DN formula)(1986)is modified to analyze the measured Young's *** kinds of modified empirical formula are used to predict the present experiment results and those in the literature,which include the results of two kinds of systems,i.e.,a soft film on a hard substrate and a hard film on a soft *** the modified CZ model,the indentation influence angle,(?), is considered as a relevant physical parameter,which embodies the effects of the indenter tip radius, pile-up or sink-in phenomena and deformation of film and substrate.

关键词： nanoindentation hardness Young's modulus film-substrate system

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Experimental Research of Dynamic Response of Laser-Induced film-substrate system

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Journal of Materials Science and Chemical Engineering 2016年第3期4卷 42-53页

作者： Baoyi Cheng Aixin Feng Jiacheng Mao Yupeng Cao Hao Wu Xuhua Zhuang Ziqiang Li Huang Yu School of Mechanical Engineering Zhenjiang China School of Techtronic Engineering Wenzhou University Wenzhou China School of Mechanical Engineering Nantong University Nantong China

film-substrate’s interfacial bonding strength is closely related to film quality. An excellent interfacial bonding strength is the premise for the well use of film. The laser detecting technique of discrete scratches based on laser shockwave effect is a new method, which can measure interfacial bonding strength. With this technique, film-substrate system is of transient load of different laser energy, the relation between the dynamic response characteristics of such film-substrate system and film-substrate’s interfacial bonding strength is a core problem to be solved urgently. On this basis, this paper conducted research on the dynamic response characteristics of film-substrate system during laser loading process using detecting technique of PVDF patch sensor. Results show that under the irradiation of different laser energy, it can detect dynamic responses of theory models of different film-substrate system using PVDF patch sensor, wherein shockwave dynamic response and dynamic strain response are included. Laser energy and interfacial bonding strength are of a regular influence to the dynamic response of film-substrate system theory model.

关键词： film-substrate system Laser Shockwave Dynamic Response Interfacial Bonding Strength PVDF

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Research on Fracture Behavior of film-substrate system

Research on Fracture Behavior of Film-substrate System

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第一届工程科学与力学中的计算方法国际会议

作者： Baoliang Liu and Xianshun Bi Department of Mathematics and Mechanics Heilongjiang Institute of Science and Technology Harbin 150027 China

＜正＞The last decade has seen enormous progress in the area of integrated circuits, microelectronic, and micro-machined devices. These engineering systems typically consist of dissimilar materials joined together on a substrate, i.e. the film-substrate composite system. Owing to the high performance demands of engineering devices, film technology profoundly affects the lifetime of materials. In filming process, the thermal stress exists due to the difference among the thermal expansion coefficients of the film and the substrate, which may result in cracking of the films. Thus, the reliability of these systems often depends on the fracture behavior of the films comprising the device and a good understanding of the possible failure mechanisms makes it possible to design more reliable devices. This study gives the problem of a crack in the film oriented perpendicular to the film-substrate interface with the crack tip fully within the film. Based on Beuth’s theory, three-dimensional model is simplified to plane strain problems, which obtains fracture mechanisms of a cracked film-substrate system by applying the boundary element method（BEM）. The method aptly resolves the problem involving stress concentration The results indicate: the stress intensity factor is affected by the different elastic mismatches and the thickness ratio of the film and the substrate, and it has remarkable increased with the decrease of the thickness ratio of the film and the substrate. The effect of the fracture behavior of film is negligible when the thickness ratio of the film and the substrate is more than 10. The conclusion has theoretical significance for researching fracture behavior of film-substrate system by experimental mental method. What’s more, this paper studies the special condition of the film-substrate system, which is the analysis of the fracture of the absence of any elastic mismatch between the film and the substrate, i.e. α=β=0, and revision of the formula of Xia and Hutchinso

关键词： film-substrate system crack stress intensity factor boundary element method

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Asymptotic solutions for buckling delamination induced crack propagation in the thin film-compliant substrate system

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Theoretical & Applied Mechanics Letters 2014年第4期4卷 14-19页

作者： Tongqing Lu Tiejun Wang State Key Lab for Strength and Vibration of Mechanical Structures School of Aerospace Engineering Xi'an Jiaotong University

In a thin film-substrate system in-plane compressive stress is commonly generated in the film due to thermal mismatch in operation or fabrication process. If the stress exceeds a critical value, part of the film may buckle out of plane along the defective interface. After buckling delamination, the interface crack at the ends may propagate. In the whole process, the compliance of the substrate compared with the film plays an important role. In this work, we study a circular film subject to compressive stress on an infinitely thick substrate. We study the effects of compliance of the substrate by modeling the system as a plate on an elastic foundation. The critical buckling condition is formulated. The asymptotic solutions of post-buckling deformation and the corresponding energy release rate of the interface crack are obtained with perturbation methods. The results show that the more compliant the substrate is, the easier for the film to buckle and easier for the interface crack to propagate after buckling.

关键词： buckling delamination interface crack film-substrate system post-buckling

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