The long-term stability of a prestressed anchored slope might be influenced by the durability of the anchorage *** understand long-term stability of anchored rock slopes,the research presented herein evaluated the per...
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The long-term stability of a prestressed anchored slope might be influenced by the durability of the anchorage *** understand long-term stability of anchored rock slopes,the research presented herein evaluated the performance evolution of a prestressed anchored bedding slope system in a corrosive environment by model *** corrosion process in a prestressed anchor bar was monitored in terms of its open-circuit potential(OCP),corrosion current density(CCD),and electrochemical impedance spectroscopy(EIS).The stability of the prestressed anchored slope was evaluated by monitoring changes in anchorage force and *** experimental results show that prestress and oxygen could reduce the corrosion resistance of the anchor bar,and anchor bars in a chloride-rich environment are very susceptible to *** tendons in a corrosive environment suffer a loss of anchorage force,the prestress decreases rapidly after locking,and the rate thereof decreases until stabilising;in the later stage,corrosion leads to the reduction of the cross-sectional area of the steel bar which may cause the reduction in anchorage force *** force controls the deformation and stability of the anchored slope,the prestress loss caused by later corrosion may lead to an increased rate of displacement and stability degradation of the prestressed anchored rock slope.
Benzotriazole(BTA), an anticorrosion agent of slurry, is the main organic pollutant remaining after CMP of multilayer copper wiring, and also the main removal object of post CMP cleaning. The adsorption of BTA onto th...
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Benzotriazole(BTA), an anticorrosion agent of slurry, is the main organic pollutant remaining after CMP of multilayer copper wiring, and also the main removal object of post CMP cleaning. The adsorption of BTA onto the copper could form a dense Cu-BTA film, which makes the copper surface strongly passivated. According to this characteristic, quantitative analysis of BTA residue after cleaning is carried out by contact angle measurement and electrochemical measurement in this paper. A scanning electron microscope(SEM) with EDX was used to observe and analyze the BTA shape and elements. The efficiencies of organic alkali and inorganic alkali on the removal of BTA were studied. The corresponding reaction mechanism was also analyzed. The results show that the adsorption structure of Cu(I)-BTA cannot be destroyed in an alkaline environment with a pH less than 10; the effect of BTA removal by inorganic alkali is worse than that of the organic amine alkali with the coordination structure under the same pH environment; the FA/O Ⅱ chelating agent with the fraction of 200 ppm can effectively remove BTA residue on the surface of copper wafer.
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