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Weakening of the anisotropy of surface roughness in ultra-precision turning of single-crystal silicon

Chinese Journal of Aeronautics 2015年第4期28卷 1273-1280页

作者： Wang Minghai Wang Ben Zheng Yaohui Key Laboratory of Fundamental Science for National Defense of Aeronautical Digital Manufacturing Process Shenyang Aerospace University School of Mechanical Engineering & Automation Beijing University of Aeronautics & Astronautics

Ultra-precision machining causes materials to undergo a greatly strained deformation process in a short period of *** effect of shear strain rates on machining quality, in particular on surface anisotropy, is a topic deserving of research that has thus far been *** study analyzes the impact of the strain rate during the ultra-precision turning of single-crystal silicon on the anisotropy of surface *** on the establishment of cutting models considering the tool rake angle and the edge radius, this is the first research that takes into account the strain rate dislocation emission criteria in studying the effects of the edge radius, the cutting speed, and the cutting thickness on the plastic deformation of single-crystal *** results of this study show that the uses of a smaller edge radius, faster cutting speeds, and a reduced cutting thickness can result in optimally uniform surface roughness, while the use of a very sharp cutting tool is essential when operating with smaller cutting thicknesses.A further finding is that insufficient plastic deformation is the major cause of increased surface roughness in the ultra-precision turning of brittle *** this basis, we propose that the capacity of single-crystal silicon to emit dislocations be improved as much as possible before brittle fracture occurs, thereby promoting plastic deformation and minimizing the anisotropy of surface roughness in the machined workpiece.

关键词： Anisotropy of surface roughness Cutting speed edge radius Single-crystal silicon Strain rate Ultra-precision turning Weakening

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