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A Dielectric Ink Combining Acrylate and cyanate Moieties for Inkjet 3D Printing with Good Thermal Stability

Chinese Journal of Polymer Science 2024年第6期42卷 766-774页

作者： Yi-Xuan Li Liang-Ying Wu Yan Yang Yao-Zhong Lu Zhong-Ying Ji Yu-Xiong Guo Xiao-Long Wang Qiao-Sheng Pu State Key Laboratory of Applied Organic Chemistry College of Chemistry and Chemical EngineeringLanzhou UniversityLanzhou730000China State Key Laboratory of Solid Lubrication Lanzhou Institute of Chemical PhysicsLanzhou730000China Lanzhou Traditional Chinese Medicine Hospital of Orthopedics and Traumatology Lanzhou730000China Shandong Laboratory of Advanced Materials and Green Manufacturing at Yantai Yantai Zhongke Research Institute of Advanced Materials and Green Chemical EngineeringYantai264006China

Inkjet 3D printing has potential in the additive manufacturing of electronic circuits and ***,inks that can be used for printing layers with T5%>300℃ or hardness>200 MPa have been rarely *** ester(CE)polymers have excellent thermal stability,high strength,and low shrinkage compared to other common dielectric inks for inkjet 3D printing,but cannot be quickly shaped by ultraviolet(UV)irradiation or thermal *** CEs with UV-curable monomers may be a possible way to accelerate crosslinking,but there are challenges from the adverse effects of the dilution of both *** this study,dielectric inks with acrylate and cyanate moieties were *** low viscosity and surface tension of the CE precursor(Bisphenol E cyanate ester)were combined with photocurable acrylate diluent monomers and cross-linker to realize an ink suitable for inkjet 3D *** internal dual three-dimensional cross-linked network structure resin was prepared by a combination of photocuring and thermal curing with T5%up to 326.69℃,hardness up to 431.84 MPa,dielectric constant of 2.70 at 8 GHz,and shrinkage of 1.64%.The developed dielectric inks can be applied to the 3D printing of printed circuit boards and other electronic devices that require dielectric properties.

关键词： Inkjet printing cyanate ester resin 3D doubly cross-linked network Good thermal stability

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Preparation and Properties of Nano-SiO_2/TDE-85/BMI/BAD Cy Composites

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Journal of Wuhan University of Technology(Materials Science) 2013年第2期28卷 261-264页

作者：吴广磊 KOU Kaichang CHAO Min ZHUO Longhai ZHANG Jiaoqiang School of Science Northwestern Polytechnical University

A new type of the nanometer particles and epoxy/bismaleimide-triazine nanocomposites were prepared using a nanometer silica （nano-SiO2）, a 4,5-epoxycyclohexane 1,2-dicarboxylic acid dilycidyl （TDE-85） epoxy resin, a 4,4＇-bismaleimidodiphenymethane （BMI） and a bisphenol a dicyanate （BADCy）. The properties of nano-SiOJTDE-85/BMI/BADCy composites, such as mechanical and thermal properties, were systemically investigated in detail by mechanical measurement, scanning electron microscope （SEM）, dynamic mechanical analysis （DMA） and thermogravimetric analysis （TGA）. The experimental results showed that the addition of the appropriate amount of nano-SiO： could improve the impact strength and the flexural strength of the nano- SiO2/TDE-85/BMI/BADCy composites. Simultaneously, the thermal stability of the blends was found to be higher than that of the TDE-85/BMI/BADCy copolymers.

关键词： nano-Si02 cyanate ester resin epoxy resin bismaleimide resin mechanical properties thermal properties

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