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Data mining to effect of key alloying elements on corrosion resistance of low alloy steels in Sanya seawater environmentAlloying Elements

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Journal of Materials Science & Technology 2021年第5期64卷 222-232页

作者： Xin Wei Dongmei Fu Mindong Chen Wei Wu Dequan Wu Chao Liu School of Automation and Electrical Engineering University of Science and Technology BeijingBeijing100083China Beijing Engineering Research Center of Industrial Spectrum Imaging University of Science and Technology BeijingBeijing 100083China SINOPEC Research Institute of Safety Engineering Qingdao266100China Beijing Advanced Innovation Center for Materials Genome Engineering Institute for Advanced Materials and TechnologyUniversity of Science and Technology BeijingBeijing100083China

In this paper,the relationship model between seawater environment,chemical composition and corrosion potential of low alloy steel is established and the distribution of corrosion potential of low alloy steel with changes in key alloying elements is excavated.The research was carried out with the following steps:Firstly,the relationship model between corrosion potential of low alloy steel and its influencing factors was established by data dimension reduction and artificial neural network(ANN).Secondly,key alloying elements of experimental steels were selected out by Pearson correlation analysis,then the corrosion resistance element model was visualized to show the effect of key alloying elements on corrosion potential of low alloy steel.Finally,corrosion potential of low alloy steel with the change of key alloying elements was classified and visualized by classification method.The mining results can reflect the validity of the proposed mining methods to a certain extent and provide an intuitive data basis for the development of high-quality and low-cost low alloy steels.

关键词： Low alloy steel corrosion potential Key alloying elements corrosion-resistant alloy Artificial neural network Data-driven model

Nickel multilayers and their effects on bend fatigue strength of leads

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Rare Metals 2004年第2期23卷 157-160页

作者： LIU Feihua WANG Zhanhua SHEN Zhuoshen School of Material Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China School of Material Science and Engineering University of Science and Technology Beijing 北京 100083

Nickel is commonly coated on the outer leads for T8 metal package. The leadselectrodeposited by conventional dull or bright nickel over 5μm at direct current from Watt bathare hard to pass the bend fatigue test for three times. Nickel electrodeposited at multi waveformcurrent including direct current, single and double pulse from sulfamate bath can improve the bendfatigue strength of leads. Such nickel plating has a multilayer structure, its morphology ofsublayers can be clearly seen in its cross section with SEM. The electrochemical study shows thatthese sublayers have different corrosion potentials. The bend fatigue test of leads with suchplating for T8 metal package shows that the number of bend increases with the decrease of averagecurrent density of multi waveform, which can be attributed to the reduction of every sublayerthickness and the increase of layer numbers under the same condition of total thickness.

关键词： electroplating nickel multilayers multi waveform current bend fatiguestrength corrosion potential metal package

Effect of Ni Content on Mechanical Properties and corrosion Behavior of Al/Sn－9Zn－xNi/Cu Joints

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Journal of Materials Science & Technology 2012年第9期28卷 844-852页

作者： M.L.Huang N.Kang Q.Zhou Y.Z.Huang Key Laboratory of Liaoning Advanced Welding and Joining Technology School of Materials Science&EngineeringDMian University of TechnologyDalian 116024China

The effects of Ni content on the microstructure and the wetting behavior of Sn-9Zn-xNi solders on Al and Cu substrates, as well as the mechanical properties and electrochemical corrosion behavior of Al/Sn-9Zn-xNi/Cu solder joints, were investigated. The microstructure of Sn-gZn-xNi revealed that tiny Zn and coarsened Ni5Zn21 phases dispersed in theβ-Sn matrix. The wettability of Sn-9Zn-xNi solders on Al substrate was much better than that on Cu substrate. With increasing Ni content, the wettability on Cu substrate was slightly improved but became worse on Al substrate. In the Al/Sn-9Zn-xNi/Cu joints, an Al4.2Cu3.2Zn0.7 intermetallic compound （IMC） layer formed at the Sn-gZn-xNi/Cu interfaces, while an Al-Zn-Sn solid solution layer formed at the Sn-9Zn-xNi/Al interface. The mixed compounds of Ni3Sna and Al3Ni dispersed in the solder matrix and coarsened with increasing Ni content, thus leading to a reduction in shear strength of the Al/Sn-9Zn- xNi/Cu joints. Al particles were segregated at both interfaces in the solder joints. The corrosion potentials of Sn-9Zn-xNi solders continuously increased with increasing Ni content. The Al/Sn-9Zn-0.25Ni/Cu joint was found to have the best electrochemical corrosion resistance in 5% NaCl solution.

关键词： Al-Cu disslmilar-metal solder joint Sn-9Zn-xNi Microstructure Mechanicalproperties Electrochemical corrosion corrosion potential