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Hybrid effect on mechanical properties and high-temperature performance of copper matrix composite reinforced with micro-nano dual-scale particles

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Journal of Materials Science & Technology 2024年第5期172卷 94-103页

作者： Xingde Zhang Yihui Jiang Fei Cao Tian Yang Fan Gao Shuhua Liang School of Materials Science and Engineering Xi’an University of TechnologyXi’an 710048China Engineering Research Center of Conducting Materials and composite Technology Ministry of EducationXi’an University of TechnologyXi’an 710048China Shaanxi Province Key Laboratory of Electrical Materials and Infiltration Technology Xi’an University of TechnologyXi’an 710048China

A dual-scale hybrid HfB_(2)/Cu-Hf composite with HfB_(2) microparticles and Cu_(5) Hf nanoprecipitates was designed and *** contribution of the hybrid effect to the mechanical properties and high-temperature performances was studied from macro and micro perspectives,*** hybrid of dual-scale particles can make the strain distribution of the composite at the early deformation stage more uniform and delay the strain concentration caused by the HfB_(2) *** dislocation pinning of HfB_(2) particles and the coherent strengthening of Cu_(5) Hf nanoprecipitates simultaneously play a strengthening role,but the strength of the hybrid composite is not a simple superposition of two strengthening *** addition,both Cu_(5) Hf nanoprecipitates and HfB_(2) microparticles contribute to the high-temperature performance of the composite,the growth and phase transition of nanoprecipitates at high temperature will reduce their contribution to strength,while the stable HfB_(2) particles can inhibit the coarsening of matrix grains and maintain the high-density geometrically necessary dislocations(GNDs)in the matrix,which ensures more excellent high-temperature resistance of the hybrid *** a result,the hy-brid structure can simultaneously possess the advantages of multiple reinforcements and make up for the shortcomings of each ***,a copper matrix composite with high strength,high conductivity,and excellent high-temperature performance is displayed.

关键词： copper matrix composite HfB 2 particles Hybrid effect High strength and high conductivity High-temperature performance

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Thermal expansion behavior of a β-LiAlSiO_4/Cu composite

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Rare Metals 2009年第1期28卷 82-85页

作者： WANG Lidong XUE Zongwei LIU Zhe FEI Weidong School of Materials Science and Engineering Harbin Institute of Technology Harbin 150001 China

A copper matrix composite reinforced by β-LiAlSiO4 with negative thermal expansion coefficient was fabricated using vacuum hot-pressed sintering technique. The thermal expansion behavior of the composite was investigated, and the average residual stress in the matrix was analyzed by a simple model. The results indicate that the residual stress in the matrix affects the thermal expansion properties. After heat treatment, the coefficient of thermal expansion （CTE） of the composite decreases greatly. The CTE of the composite after thermal cycling between 50-350°C is the lowest.

关键词： copper matrix composite β-eucryptite thermal expansion residual stress

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Tribological behavior of self lubricating Cu/MoS_2 composites fabricated by powder metallurgy

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Transactions of Nonferrous Metals Society of China 2018年第5期28卷 946-956页

作者： Mohammad MOAZAMI-GOUDARZI Aram NEMATI Department of Materials Engineering Science and Research Branch Islamic Azad University

The effects of MoS2 content on microstructure, density, hardness and wear resistance of pure copper were studied. copper-based composites containing 0-10%（mass fraction） MoS2 particles were fabricated by mechanical milling and hot pressing from pure copper and MoS2 powders. Wear resistance was evaluated in dry sliding condition using a pin on disk configuration at a constant sliding speed of 0.2 m/s. Hardness measurements showed a critical MoS2 content of 2.5% at which a hardness peak was attained. Regardless of the applied normal load, the lowest coefficient of friction and wear loss were attained for Cu/2.5 MoS2 composite. While coefficient of friction decreased when the applied normal load was raised from 1 to 4 N at any reinforcement content, the wear volume increased with increasing normal load. SEM micrographs from the worn surfaces and debris revealed that the wear mechanism was changed from mainly adhesion in pure copper to a combination of abrasion and delamination in Cu/MoS2 composites.

关键词： copper matrix composite microstxucture coefficient of friction wear mechanism

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Microstructural characterization and dry sliding wear behavior of spark plasma sintered Cu-YSZ composites

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Transactions of Nonferrous Metals Society of China 2016年第7期26卷 1745-1754页

作者： Jafar MIRAZIMI Parvin ABACHI Kazem PURAZRANG Department of Materials Science and Engineering Sharif University of Technology

In the present study, yttria stabilized zirconia （YSZ） reinforced Cu matrix composite specimens were produced by spark plasma sintering （SPS）. For comparison, pure Cu specimen was also produced in the same conditions. The effect of particles content on microstructure, relative density, electrical conductivity, and Vickers hardness was evaluated. The pin-on-disk test was also performed to determine dry sliding wear behavior of specimens under different wear conditions. After sliding wear tests, the worn surfaces were examined by field emission scanning electron microscopy （FE-SEM）. Microstructural study showed satisfactory distribution of reinforcement particles in copper matrix. The relative density up to 95%was obtained for all specimens. By increasing YSZ content from 0 to 5% （volume fraction）, the electrical conductivity of specimens decreased from 99.2%IACS to 65%IACS, correspondingly. The hardness of Cu-5%YSZ composite specimen was two times greater than that of pure copper. The volume loss and wear rate of pure Cu specimen were 1.48 mm^3 and 1.5±10^-3 mm^3/m under 50 N applied load and 1000 m sliding distance. However, for composite containing 5% YSZ particles, these values dropped to 0.97 mm^3 and 0.9±10^-3 mm^3/m, respectively. Moreover, the friction coefficient of specimens was changed from 0.6 to 0.4. The worn surface and debris observation indicate local plastic deformation and delamination as dominant wear mechanisms for pure copper, while oxidation and ploughing for composite specimen. Accordingly, it can be concluded that the Cu-YSZ composite could be a good candidate for the electrical contact applications in relays, contactors, switches and circuit breakers requiring good electrical and thermal conductivity and capability to resist wearing.

关键词： copper matrix composite spark plasma sintering microstructure electrical conductivity sliding wear

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Researches for higher electrical conductivity copper-based materials

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cMat 2024年第1期1卷 92-107页

作者： Wen-Jing Zhang Lue Huang Xu-Jun Mi Hao-Feng Xie Xue Feng Jee Hyuk Ahn State Key Laboratory of Nonferrous Metals and Processes GRINM Group Co.Ltd.BeijingChina GRIMAT Engineering Institute Co. Ltd.BeijingChina General Research Institute for Nonferrous Metals BeijingChina School of Materials Science and Engineering South China University of TechnologyGuangzhouChina Extreme Materials Institute Korea Institute of Materials and ScienceChangwonKorea

copper and copper-based materials are widely used in power electronics,auto-mobiles,mechanical manufacturing and high-tech manufacturing fields such as aerospace,telecommunications and integrated circuits owing to their compre-hensive advantages in mechanical,electrical conductivity and processing *** the rapid development of technology,many emerging technical fields have introduced more challenging requirements for the electrical conductivity of *** article reviews the research status of high-conductivity copper-based materials and introduces three methods to improve electrical conductivity,including purification,alloying and addition of nanocarbon *** sum-marise the advantages,disadvantages and future development trends of methods for improving copper *** key to producing high-conductivity copper-based materials is development of low-cost,continuous and stable processes.

关键词： copper matrix composite high-strength and high-electrical-conductivity copper alloy higher electrical conductivity pure copper material

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