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Effect of backing films on the transdermal delivery of cyclobenzaprine patch

Asian Journal of Pharmaceutical Sciences 2016年第6期11卷 780-783页

作者： Siji Lv Peng Quan Xiaochang Liu Liang Fang Department of Pharmaceutical Sciences Shenyang Pharmaceutical University

The aim of this study was to investigate the effect of backing films on transdermal delivery of cyclobenzaprine patch. Different backing films were chosen to prepare the cyclobenzaprine transdermal patch. The cumulative amount of cyclobenzaprine released from different patches was evaluated in vitro. To investigate the interaction between cyclobenzaprine and backing films, the partitioning experiments and attenuated total reflectance Fourier transform infrared(ATR-FTIR) spectroscopy were performed. The cumulative amount of cyclobenzaprine released from the patch with Cotran? 9700 as backing film was less than that of other patches with different backing films. Furthermore, the cumulative amount of cyclobenzaprine released from the patch with Cotran? 9700 as backing film decreased significantly after 7 d storage at room condition. The partitioning experiments indicated a strong adsorption of cyclobenzaprine onto the Cotran? 9700, which could explain the decrease of cumulative amount of cyclobenzaprine released from the patch with Cotran? 9700 as backing film. According to the ATR-FTIR results, there was no interaction between Cotran? 9700 and cyclobenzaprine. The effect of backing films on the release behavior of cyclobenzaprine transdermal patch was attributed to the adsorption of cyclobenzaprine onto the Cotran? 9700.

关键词： Transdermal patch backing film Release Cyclobenzaprine Partitioning experiment

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Mechanism analysis of free formation of backing weld by the pulsed MAG-TIG double arc tandem welding

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China Welding 2019年第4期28卷 8-15页

作者： Liu Liming Zhou Yanbin School of Materials Science and Engineering Dalian University of TechnologyDalian 116024China

Because of the presence of lower-level automation and efficiency in the backing welding of medium–thick plates,pulse-metalactive-gas–metal-inert-gas(MAG–MIG)dual-arc welding was applied to backing welding of 24-mm-thick Q235-B plate and the process and mechanism of root welding with back formation were *** heating position of the MAG-arc at the front of the molten pool could be adjusted by using the electromagnetic force between the MAG-arc and the MIG-arc,and part of the arc energy could work on the root face *** combining the arc-discharge behaviour and analysis of flow in the molten pool,the shear stress of a tungsten inert gas(TIG)arc to the molten pool could make the liquid metal flow ***,the quality of the front and bottom liquid metal were reduced,which favored the balance and *** and stable back formation with uniform penetration could be achieved by using the pulse MAG–TIG dual-arc welding technology.

关键词： pulse MAG–TIG dual arc backing weld one-side welding with back formation high-efficiency welding mechanism analysis

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维普期刊数据库

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Characteristics of backing impacts on the performance of the thickness mode piezoelectric transducer

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Chinese Journal of Acoustics 2019年第1期38卷 73-84页

作者： FU Lin GAO Yongkang GAO Jingmin Beijing Information Science & Technology University National Demonstration Center for Experimental Electronic Information & Control Education State Key Laboratory of Acoustics Institute of Acoustics Chinese Academy of Sciences

The impacts of the thickness, the specific acoustic impedance and the mechanical loss factor of the backing on the performance of the thickness mode piezoelectric transducer are systemically studied, which are focused on the effective electromechanical coupling coefficient and the mechanical quality factor near the center frequency. The results show that with contin?uous increasing of the backing thickness, the effective electromechanical coupling coefficient and the mechanical quality factor are found rapidly declined by oscillation way. With the increase of the difference value of the acoustic impedance between the backing material and the piezoelec?tric material, the effective electromechanical coupling coefficient deceases and the mechanical quality factor increases. Under condition that the thickness of the piezoelectric material is fixed, the effective electromechanical coupling coefficient is found declined with the increase of the mechanical loss factor by monotonous way. The mechanical quality factor has minimum value and the electric characteristic curve tends to be smooth in a given frequency range. The equivalent circuit theory result is in good agreement with the ones by finite element method and the experimental results. The work mentioned above provides a theoretical guidance for the design and experimental fabrication of the thickness mode piezoelectric transducer.

关键词： thickness mode piezoelectric transducer Characteristics of backing impacts specific acoustic impedance

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