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Effect of Low-temperature Imidization on Properties and aggregation structures of Polyimide Films with Different Rigidity

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Chinese Journal of Polymer Science 2024年第8期42卷 1134-1146页

作者： Yan Jia Lei Zhai Song Mo Yi Liu Li-Xin Liu Xin-Yu Du Min-Hui He Lin Fan Key Laboratory of Science and Technology on High-tech Polymer Materials Institute of ChemistryChinese Academy of SciencesBeijing 100190China School of Chemical Sciences University of Chinese Academy of SciencesBeijing 100049China

The traditional high-temperature preparation process of polyimide can cause many problems and limits the wider application in extreme *** important challenge to be solved urgently is the reduction of imidization *** this work,twelve kinds of polyimide films with different chain rigidity were prepared at low temperature of 200℃,in the absence or presence of imidazole used as the *** molecular rigidity and free volume were theoretically calculated,and relationship between structure and properties were systematically *** results show that imidization reaction under low temperatures is significantly affected by the rigidity of molecula r *** rigid structure of polyimide is not conducive to the low-temperature imidization,but this adverse effect can be eliminated by adding catalyst,resulting the notably increased imidization *** optical and thermal properties can be improved to a certain extent for the chemically catalyzed system,resulting in relatively higher heat resistance and thermal *** the mechanical performance could be determined by com plicating factors,greatly different from polyimide films prepa red by high temperature *** investigate aggregation structures of film s,the effect of chain rigidity and catalyst on the stacking or orientation of molecular chains was further *** wo rk can contribute to the understanding of chemically catalyzed imidization that is rarely reported in the existing research,and will provide guidance for the low-temperature preparation of high-performance polyimides.

关键词： Polyimide Imidization Catalyst Structure and properties aggregation structures

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Thermal Expansion Behavior of Poly(amide-imide)Films with Ultrahigh Tensile Strength and Ultralow CTE

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Chinese Journal of Polymer Science 2020年第7期38卷 748-758,I0007页

作者： Lan Bai Lei Zhai Min-Hui He Chang-Ou Wang Song Mo Lin Fan Laboratory of Advanced Polymer Materials Institute of ChemistryChinese Academy of SciencesBeijing 100190China School of Chemistry and Chemical Engineering University of Chinese Academy of SciencesBeijing 100049China

A series of novel poly(amide-imide)(PAl)films with different amide contents were prepared from pyromellitic dianhydride and four amide-containing *** PAl films exhibited excellent mechanical and thermal properties with tensile strength of 203.7-297.4 MPa and Tg above 407℃.The rigid backbone structures combined with strong intermolecular interactions provided PAl films with ultralow in-plane CTE values from-4.17 ppm/℃to-0.39 ppm/℃in the temperature range of 30-300℃.The correlation between thermal expansion behavior and aggregation structures of PAl film was *** results suggested that hydrogen bonding interactions could be maintained even at high temperature,thus resulting in good dimension reversibility of films in multiple heating-cooling *** is demonstrated that dimensional stabilities of PAl films are determined by the rigidity,orientation,and packing of molecular ***-resistant PAl films with ultralow CTE can be developed as flexible substrates by regulating backbones and aggregation structures for optoelectronic application.

关键词： Poly(amide-imide)s Thermal expansion behavior aggregation structures

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