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FDTD technique based crosstalk analysis of bundled SWCNT interconnects

Journal of Semiconductors 2015年第5期36卷 90-98页

作者： yograj singh duksh Brajesh Kumar Kaushik Rajendra P.Agarwal Department of Electronics and Instrumentation Engineering Mahatma Jyotiba Phule Rohilkhand University Department of Electronics and Communication Engineering Indian Institute of Technology Shobhit University

The equivalent electrical circuit model of a bundled single-walled carbon nanotube based distributed RLC interconnects is employed for the crosstalk analysis. The accurate time domain analysis and crosstalk effect in the VLSI interconnect has emerged as an essential design criteria. This paper presents a brief description of the numerical method based finite difference time domain （FDTD） technique that is intended for estimation of voltages and currents on coupled transmission lines. For the FDTD implementation, the stability of the proposed model is strictly restricted by the Courant condition. This method is used for the estimation of crosstalk induced propagation delay and peak voltage in lossy RLC interconnects. Both functional and dynamic crosstalk effects are analyzed in the coupled transmission line. The effect of line resistance on crosstalk induced delay, and peak voltage under dynamic and functional crosstalk is also evaluated. The FDTD analysis and the SPICE simulations are carried out at 32 nm technology node for the global interconnects. It is observed that the analytical results obtained using the FDTD technique are in good agreement with the SPICE simulation results. The crosstalk induced delay, propagation delay, and peak voltage obtained using the FDTD technique shows average errors of 4.9%, 3.4% and 0.46%, respectively, in comparison to SPICE.

关键词： FDTD SWCNT bundle interconnects crosstalk delay peak voltage coupled transmission lines

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