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Leakage pressures for gasketless superhydrophobic fluid interconnects for modular lab-on-a-chip systems

Microsystems & Nanoengineering 2021年第5期7卷 213-226页

作者： Christopher R.Brown Xiaoxiao Zhao Taehyun Park Pin-Chuan Chen Byoung Hee You Daniel S.Park steven a.soper Alison Baird Michael C.Murphy Center for Bio-Modular Multi-Scale Systems Louisiana State UniversityBaton RougeLA 70803USA Department of Mechanical&Industrial Engineering Louisiana State UniversityBaton RougeLA 70803USA Department of Mechanical and Industrial Engineering University of TorontoTorontoON M5S 3GBCanada School of Mechanical Engineering Kyungnam UniversityChangwonSouth Korea Department of Engineering Technology Texas State UniversitySan MarcosTX 78666USA Department of Mechanical Engineering The University of KansasLawrenceKS 66045USA Department of Chemistry The University of KansasLawrenceKS 66045USA SUNY Downstate Stroke Center University Hospital of BrooklynBrooklynNY 11203USA

Chip-to-chip and world-to-chip fluidic interconnections are paramount to enable the passage of liquids between component chips and to/from microfluidic ***,most interconnect designs add additional physical constraints to chips with each additional interconnect leading to over-constrained microfluidic *** competing constraints provided by multiple interconnects induce strain in the chips,creating indeterminate dead volumes and misalignment between chips that comprise the microfluidic system.A novel,gasketless superhydrophobic fluidic interconnect(GSFI)that uses capillary forces to form a liquid bridge suspended between concentric through-holes and acting as a fluid passage was *** GSFI decouples the alignment between component chips from the interconnect function and the attachment of the meniscus of the liquid bridge to the edges of the holes produces negligible dead *** passive seal was created by patterning parallel superhydrophobic surfaces(water contact angle>150°)around concentric microfluidic ports separated by a *** relative position of the two polymer chips was determined by passive kinematic constraints,three spherical ball bearings seated in v-grooves.A leakage pressure model derived from the Young-Laplace equation was used to estimate the leakage pressure at failure for the liquid ***-molded,Cyclic Olefin Copolymer(COC)chip assemblies with assembly gaps from 3 to 240μm were used to experimentally validate the *** maximum leakage pressure measured for the GSFI was 21.4 kPa(3.1 psig),which corresponded to a measured mean assembly gap of 3μm,and decreased to 0.5 kPa(0.073 psig)at a mean assembly gap of 240μ*** effect of radial misalignment on the efficacy of the gasketless seals was tested and no significant effect was *** may be a function of how the liquid bridges are formed during the priming of the chip,but additional research is required to test that hypothesis.

关键词： passive interconnection fluid

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光敏化选择性化学镀法在毛细管电泳电化学检测高聚物芯片上制作集成化金微电极的研究

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第三届全国微全分析系统学术会议

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＜正＞本文在前人工作的基础上,开发了一种光敏化选择性化学镀技术在聚碳酸酯（PC）芯片上制作金微电极的方法。以该方法为基础,研制了带有集成化金微工作电极的毛细管电泳-安培检测（CE-ED）聚碳酸酯芯片,应用该芯片成功地分离检测了多巴胺和儿茶酚。

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