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Ultra-broadband polarisation beam splitters and rotators based on 3D-printed waveguides

Light(Advanced Manufacturing) 2023年第3期4卷 251-262页

作者： Aleksandar Nesic Matthias Blaicher Pablo Marin-Palomo Christoph Füllner sebastian randel Wolfgang Freude Christian Koos Institute of Photonics and Quantum Electronics(IPQ) Karlsruhe Institute of Technology(KIT)KarlsruheGermany Institute of Microstructure Technology(IMT) Karlsruhe Institute of Technology(KIT)Eggenstein-LeopoldshafenGermany Vanguard Automation GmbH KarlsruheGermany

Multi-photon lithography has emerged as a powerful tool for photonic integration,allowing to complement planar photonic circuits by 3D-printed freeform structures such as waveguides or micro-optical *** structures can be fabricated with a high precision on the facets of optical devices and enable highly efficient package-level chip-chip connections in photonic ***,plain light transport and efficient coupling is far from exploiting the full geometrical design freedom offered by 3D laser ***,we extended the functionality of 3D-printed optical structures to manipulation of optical polarisation *** demonstrate compact ultra-broadband polarisation beam splitters(PBSs)that can be combined with polarisation rotators and mode-field adapters into a monolithic 3D-printed structure,fabricated directly on the facets of optical *** a proof-of-concept experiment,we demonstrate measured polarisation extinction ratios beyond 11 dB over a bandwidth of 350 nm at near-infrared telecommunication wavelengths around 1550 *** demonstrate the viability of the device by receiving a 640 Gbit/s dual-polarisation data signal using 16-state quadrature amplitude modulation(16QAM),without any measurable optical-signal-to-noise-ratio penalty compared to a commercial PBS.

关键词： Photonic integration Additive laser manufacturing Multi-photon lithography Polarisation splitter/rotator

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Hybrid multi-chip assembly of optical communication engines by in situ 3D nanolithography

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Light(Science & Applications) 2020年第1期9卷 1340-1350页

作者： Matthias Blaicher Muhammad Rodlin Billah Juned Kemal Tobias Hoose Pablo Marin-Palomo Andreas Hofmann Yasar Kutuvantavida Clemens Kieninger Philipp-Immanuel Dietrich Matthias Lauermann Stefan Wolf Ute Troppenz Martin Moehrle Florian Merget sebastian Skacel Jeremy Witzens sebastian randel Wolfgang Freude Christian Koos Institute of Photonics and Quantum Electronics(IPQ) Karlsruhe Institute of Technology(KIT)Engesserstraße 576131 KarlsruheGermany Institute for Microstructure Technology(IMT) KITHermann-von-Helmholtz-Platz 176344 Eggenstein-LeopoldshafenGermany Institute for Automation and Applied Informatics(IAI) KITHermann-von-Helmholtz-Platz 176344 Eggenstein-LeopoldshafenGermany Vanguard Automation GmbH Gablonzer StraBe 1076185 KarlsruheGermany Fraunhofer Institute for Telecommunications Heinrich Hertz Institute(HHI)Einsteinufer 3710587 BerlinGermany Institute of Integrated Photonics(IPH) RWTH AachenSommerfeldstraße 18/2452074 AachenGermany

Three-dimensional(3D)nano-printing of freeform optical waveguides,also referred to as photonic wire bonding,allows for efficient coupling between photonic chips and can greatly simplify optical system *** a key advantage,the shape and the trajectory of photonic wire bonds can be adapted to the mode-field profiles and the positions of the chips,thereby offering an attractive alternative to conventional optical assembly techniques that rely on technically complex and costly high-precision ***,while the fundamental advantages of the photonic wire bonding concept have been shown in proof-of-concept experiments,it has so far been unclear whether the technique can also be leveraged for practically relevant use cases with stringent reproducibility and reliability *** this paper,we demonstrate optical communication engines that rely on photonic wire bonding for connecting arrays of silicon photonic modulators to InP lasers and single-mode *** a first experiment,we show an eight-channel transmitter offering an aggregate line rate of 448 Gbit/s by low-complexity intensity modulation.A second experiment is dedicated to a four-channel coherent transmitter,operating at a net data rate of 732.7 Gbit/s-a record for coherent silicon photonic transmitters with co-packaged *** dedicated test chips,we further demonstrate automated mass production of photonic wire bonds with insertion losses of(0.7±0.15)dB,and we show their resilience in environmental-stability tests and at high optical *** results might form the basis for simplified assembly of advanced photonic multi-chip systems that combine the distinct advantages of different integration platforms.

关键词： communication lithography bonding

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