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Cutting edge preparation of microdrills by shear thickening polishing for improved hole quality in electronic PCBs

Frontiers of Mechanical Engineering 2024年第2期19卷 99-107页

作者： Jiahuan WANG Mingfeng KE Jiepei LIAO Yu ZHOU saurav goel Jaya VERMA Xu WANG Weigang GUO Julong YUAN Binghai LYU College of Mechanical Engineering Zhejiang University of TechnologyHangzhou 310000China Ultra-precision Machining Center Key Laboratory of Special Purpose Equipment and Advanced Manufacturing TechnologyZhejiang University of TechnologyHangzhou 310000China School of Engineering London South Bank UniversityLondon SE10AAUK Shenzhen Jinzhou Precision Technology Corporation Shenzhen 518116China Department of Mechanical Engineering University of Petroleum and Energy StudiesDehradun 248007India Special Equipment Institute Hangzhou Vocational&Technical CollegeHangzhou 310018China

Printed circuit boards(PCBs)are representative composite materials,and their high-quality drilling machining remains a persistent challenge in the *** finishing of the cutting edge of a microdrill is crucial to drill performance in machining fine-quality holes with a prolonged tool *** miniature size involving submicron scale geometric dimensions,a complex flute shape,and low fracture toughness makes the cutting edge of microdrills susceptible to breakage and has been the primary limiting factor in edge preparation for *** this study,a newly developed cutting edge preparation method for microdrills was tested experimentally on electronic printed circuit *** proposed method,namely,shear thickening polishing,limited the cutting edge burrs and chipping on the cutting edge,and this in turn transformed the cutting edge’s radius from being sharp to ***,the edge–edge radius could be regulated by adjusting the processing *** drilling experiments were conducted to investigate the influence of different cutting edge radii on wear,hole position accuracy,nail head value,and hole wall *** proposed approach showed 20%enhancement in hole position accuracy,33%reduction in the nail head value,and 19%reduction in hole wall roughness compared with the original ***,a threshold is needed;without it,excessive shear thickening polishing will result in a blunt edge,which may accelerate the wear of the *** was identified as the primary factor that reduced hole *** study indicates that in printed circuit board machining,microdrills should effectively eliminate grinding defects and maintain the sharpness of the cutting edge as much as possible to obtain excellent drilling ***,shear thickening polishing is a promising method for cutting edge preparation of *** research and optimization can lead to additional improvements in microdrill performance and contribute to the conti

关键词： microdrill shear thickening polishing cutting edge preparation electronic printed circuit boards hole quality

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Atomic-Scale Friction Studies on Single-Crystal Gallium Arsenide Using Atomic Force Microscope and Molecular Dynamics Simulation

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Nanomanufacturing and Metrology 2022年第1期5卷 39-49页

作者： Pengfei Fan saurav goel Xichun Luo Hari M.Upadhyaya Centre for Precision Manufacturing DMEMUniversity of StrathclydeGlasgowUK School of Engineering London South Bank University103 Borough RoadLondon SE10AAUK School of Aerospace Transport and ManufacturingCranfield UniversityBedfordshire MK430ALUK Department of Mechanical Engineering Shiv Nadar UniversityGautam Buddh Nagar 201314India

This paper provides a fresh perspective and new insights into nanoscale friction by investigating it through molecular dynamics(MD)simulation and atomic force microscope(AFM)nanoscratch *** work considered gallium arsenide,an importantⅢ-Ⅴdirect bandgap semiconductor material residing in the zincblende structure,as a reference sample material due to its growing usage in 5G communication *** the simulations,the scratch depth was tested as a variable in the fine range of 0.5-3 nm to understand the behavior of material removal and to gain insights into the nanoscale *** force,normal force,and average cutting forces were extracted from the simulation to obtain two scalar quantities,namely,the scratch cutting energy(defined as the work performed to remove a unit volume of material)and the kinetic coefficient of friction(defined as the force ratio).A strong size effect was observed for scratch depths below 2 nm from the MD simulations and about 15 nm from the AFM experiments.A strong quantitative corroboration was obtained between the specific scratch energy determined by the MD simulations and the AFM experiments,and more qualitative corroboration was derived for the pile-up and the kinetic coefficient of *** conclusion suggests that the specific scratch energy is insensitive to the tool geometry and the scratch speed used in this ***,the pile-up and kinetic coefficient of friction are dependent on the geometry of the tool tip.

关键词： AFM nanoscratching Molecular dynamic(MD)simulation Single-crystal gallium arsenide Friction

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Recent progress and perspective on batteries made from nuclear waste

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Nuclear Science and Techniques 2023年第3期34卷 1-8页

作者： Nirmal Kumar Katiyar saurav goel School of Engineering London South Bank UniversityLondonSE10 AAUK University of Petroleum and Energy Studies Dehradun248007India

Sustainable energy sources are an immediate need to cope with the imminent issue of climate change the world is facing *** particular,the long-lasting miniatured power sources that can supply energy continually to power handheld gadgets,sensors,electronic devices,unmanned airborne vehicles in space and extreme mining are some of the examples where this is an acute *** is known from basic physics that radioactive materials decay over few years and some nuclear materials have their half-life until thousands of *** past five decades of research have been spent harnessing the decay energy of the radioactive materials to develop batteries that can last until the radioactive reaction ***,an emergent opportunity of industrial symbiosis to make use of nuclear waste by using radioactive waste as raw material to develop bat-teries with long shelf life presents a great opportunity for sustainable energy resource ***,the current canon of research on this topic is *** perspective draws fresh discussions on the topic while highlighting future directions in this wealthy arena of *** abstract A long-lasting miniaturised nuclear battery utilising 14C radioactive isotope as fuel.

关键词： Sustainable energy Nuclear waste battery Nano-diamond

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Surface defects incorporated diamond machining of silicon

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International Journal of Extreme Manufacturing 2020年第4期2卷 57-73页

作者： Neha Khatri Borad M Barkachary B Muneeswaran Rajab Al-Sayegh Xichun Luo saurav goel Optical Devices&System Division CSIR-CSIOSector 30Chandigarh160030India Department of Mechanical Engineering Jorhat Institute of Science&TechnologyJorhat Assam 785010India Fenner Conveyor Belting Pvt.Ltd. Dindigul Road NagriMaduraiVadipatti Taluk 625221India College of Engineering Northern Border UniversityArar 91431Saudi Arabia Centre for Precision Manufacturing DMEMUniversity of StrathclydeGlasgow G11XQUnited Kingdom School of Engineering London South Bank University103 Borough RoadLondon SE10AAUnited Kingdom EPSRC Centre for Doctoral Training in Ultra-Precision Engineering University of Cambridge and Cranfield UniversityCranfieldUnited Kingdom School of Aerospace Transport and ManufacturingCranfield UniversityBedfordshire MK430ALUnited Kingdom Department of Mechanical Engineering Shiv Nadar UniversityGautam Budh Nagar 201314India

This paper reports the performance enhancement benefits in diamond turning of the silicon wafer by incorporation of the surface defect machining(SDM)*** hybrid micromachining methods usually require additional hardware to leverage the added advantage of hybrid technologies such as laser heating,cryogenic cooling,electric pulse or ultrasonic elliptical *** SDM method tested in this paper does not require any such additional baggage and is easy to implement in a sequential micro-machining *** paper made use of Raman spectroscopy data,average surface roughness data and imaging data of the cutting chips of silicon for drawing a comparison between conventional single-point diamond turning(SPDT)and SDM while incorporating surface defects in the(i)circumferential and(ii)radial *** 3D finite element analysis(FEA)was performed to analyse the cutting forces and the evolution of residual stress on the machined *** was found that the surface defects generated in the circumferential direction with an interspacing of 1 mm revealed the lowest average surface roughness(Ra)of 3.2 nm as opposed to 8 nm Ra obtained through conventional SPDT using the same cutting *** observation of the Raman spectroscopy performed on the cutting chips showed remnants of phase transformation during the micromachining process in all *** was used to extract quantifiable information about the residual stress as well as the sub-surface integrity and it was discovered that the grooves made in the circumferential direction gave the best machining *** information being reported here is expected to provide an avalanche of opportunities in the SPDT area for low-cost machining solution for a range of other nominal hard,brittle materials such as SiC,ZnSe and GaAs as well as hard steels.

关键词： surface defect machining silicon finite element analysis surface roughness

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