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Precision micro-mechanical components in single crystal diamond by deep reactive ion etching

Microsystems & Nanoengineering 2018年第1期4卷 278-285页

作者： Adrien Toros Marcell Kiss Teodoro Graziosi Hamed Sattari Pascal Gallo niels quack EPFL STI IMT GR-quack Station 11CH-1015 LausanneSwitzerland LakeDiamond SA Rue Galilée 7CH-1400 Yverdon-les-BainsSwitzerland

The outstanding material properties of single crystal diamond have been at the origin of the long-standing interest in its exploitation for engineering of high-performance micro-and *** particular,the extreme mechanical hardness,the highest elastic modulus of any bulk material,low density,and the promise for low friction have spurred interest most notably for micro-mechanical and MEMS *** reactive ion etching of diamond has been reported previously,precision structuring of freestanding micro-mechanical components in single crystal diamond by deep reactive ion etching has hitherto remained elusive,related to limitations in the etch processes,such as the need of thick hard masks,micromasking effects,and limited etch *** this work,we report on an optimized reactive ion etching process of single crystal diamond overcoming several of these shortcomings at the same time,and present a robust and reliable method to produce fully released micro-mechanical components in single crystal *** an optimized Al/SiO_(2) hard mask and a high-intensity oxygen plasma etch process,we obtain etch rates exceeding 30μm/h and hard mask selectivity better than 1:*** demonstrate fully freestanding micro-mechanical components for mechanical watches made of pure single crystal *** components with a thickness of 150μm are defined by lithography and deep reactive ion etching,and exhibit sidewall angles of 82°–93°with surface roughness better than 200 nm rms,demonstrating the potential of this powerful technique for precision microstructuring of single crystal diamond.

关键词： exceeding diamond shortcomings

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Wafer-level hermetically sealed silicon photonic MEMS

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Photonics Research 2022年第2期10卷 I0001-I0008页

作者： Gaehun Jo Pierre Edinger Simon J.Bleiker Xiacxjing Wang Alain Yuji Takabayashi Hamed Sattari niels quack Moises Jezzini Jun Su Lee Peter Verheyen Iman Zand Umar Khan Wim Bogaerts Göran Stemme Kristinn B.Gylfason Frank Niklaus Division of Micro and Nanosystems KTH Royal Institute of Technology11428 StockholmSweden École Polytechnique Federate de Lausanne(EPFL) 1015 LausanneSwitzerland Tyndall National Institute Lee Maltings Complex Dyke ParadeT12 R5CP CorkIreland imec vzw.3DSIP Department Si Photonics GroupKapeldreef 753001 LeuvenBelgium Department of Information Technology Photonics Research GroupGhent University-IMEC9052 GentBelgium

The emerging fields of silicon(Si) photonic micro–electromechanical systems(MEMS) and optomechanics enable a wide range of novel high-performance photonic devices with ultra-low power consumption, such as integrated optical MEMS phase shifters, tunable couplers, switches, and optomechanical resonators. In contrast to conventional SiO;-clad Si photonics, photonic MEMS and optomechanics have suspended and movable parts that need to be protected from environmental influence and contamination during operation. Wafer-level hermetic sealing can be a cost-efficient solution, but Si photonic MEMS that are hermetically sealed inside cavities with optical and electrical feedthroughs have not been demonstrated to date, to our knowledge. Here, we demonstrate wafer-level vacuum sealing of Si photonic MEMS inside cavities with ultra-thin caps featuring optical and electrical feedthroughs that connect the photonic MEMS on the inside to optical grating couplers and electrical bond pads on the outside. We used Si photonic MEMS devices built on foundry wafers from the iSiPP50G Si photonics platform of IMEC, Belgium. Vacuum confinement inside the sealed cavities was confirmed by an observed increase of the cutoff frequency of the electro-mechanical response of the encapsulated photonic MEMS phase shifters, due to reduction of air damping. The sealing caps are extremely thin, have a small footprint, and are compatible with subsequent flip-chip bonding onto interposers or printed circuit boards. Thus, our approach for sealing of integrated Si photonic MEMS clears a significant hurdle for their application in high-performance Si photonic circuits.

关键词： sealed sealing bonding

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Integrated silicon ohotonic MEMS

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Microsystems & Nanoengineering 2023年第2期9卷 227-248页

作者： niels quack Alain Yuji Takabayashi Hamed Sttari Pieirre Edinger Gaehun Jo Simon JBleker Carlos Errando-Herranz Kristinn BGylfason Frank Niklaus Umar Khan Peter Verheyen Arun Kumar Malik Jun Su Lee Moises Jezzini Padraic Morrissey Cleitus Antony Peter O'Brien Wim Bogaertso Ecole Polytechnique Federale de Lausanne(EPFL) 1015 LausanneSwitzerland school of Aerospace Mechanical and Mechatronic EngineeringThe University of SydneyCamperdownNSW 2006Australia swiss Center for Electronics and Microtechnology(CSEM) 2002 NeuchatelSwitzerland Division of Micro and Nanosystems KTH Royal Institute of Technology11428 StockholmSweden Department of Information Technology Photonics Research GroupGhent University-IMECTechnologiepark-Zwijnaarde 1269052 GentBelgium imec vzw.3DSIP Department Si Photonics GroupKapeldreef 753001 LeuvenBelgium Tyndall National Institute Lee Maltings Complex Dyke ParadeCork T12 R5CPIreland

Silicon photonics has emerged as a mature technology that is expected to play a key role in critical emerging applications,including very high data rate optical communications,distance sensing for autonomous vehicles,photonic-accelerated computing,and quantum information *** success of silicon photonics has been enabled by the unique combination of performance,high yield,and high-volume capacity that can only be achieved by standardizing manufacturing ***,standardized silicon photonics technology platforms implemented by foundries provide access to optimized library components,including low-loss optical routing,fast modulation,continuous tuning,high-speed germanium photodiodes,and high-effciency optical and electrical ***,silicon's relatively weak electro-optic effects result in modulators with a significant footprint and thermo-optic tuning devices that require high power consumption,which are substantial impediments for very large-scale integration in silicon *** systems(MEMS)technology can enhance silicon photonics with building blocks that are compact,low-loss,broadband,fast and require very low power ***,we introduce a silicon photonic MEMS platform consisting of high-performance nano-opto-electromechanical devices fully integrated alongside standard silicon photonics foundry components,with wafer-level sealing for long-term reliability,flip-chip bonding to redistribution interposers,and fibre-array attachment for high port count optical and electrical *** experimental demonstration of fundamental silicon photonic MEMS circuit elements,including power couplers,phase shifters and wavelength-division multiplexing devices using standardized technology lifts previous impediments to enable scaling to very large photonic integrated circuits for applications in telecommunications,neuromorphic computing,sensing,programmable photonics,and quantum computing.

关键词： tuning sealing photonics

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