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Drying-Mediated Self-Assembly of Graphene for Inkjet Printing of High-Rate Micro-supercapacitors

Nano-Micro Letters 2020年第3期12卷 155-168页

作者： Szymon Sollami Delekta Mika‑matti Laurila matti mantysalo Jiantong Li School of Electrical Engineering and Computer Science KTH Royal Institute of TechnologyElectrum 22916440 KistaSweden Laboratory for Future Electronics Faculty of Information Technology and Communication SciencesTampere University33720 TampereFinland

Scalable fabrication of high-rate micro-supercapacitors(MSCs)is highly desired for on-chip integration of energy storage *** virtue of the special self-assembly behavior of 2D materials during drying thin films of their liquid dispersion,a new inkjet printing technique of passivated graphene micro-flakes is developed to directly print MSCs with 3D networked porous *** presence of macroscale through-thickness pores provides fast ion transport pathways and improves the rate capability of the devices even with solid-state *** multiple-pass printing,the porous microstructure effectively absorbs the successively printed inks,allowing full printing of 3D structured MSCs comprising multiple vertically stacked cycles of current collectors,electrodes,and sold-state *** all-solid-state heterogeneous 3D MSCs exhibit excellent vertical scalability and high areal energy density and power density,evidently outperforming the MSCs fabricated through general printing techniques.

关键词： High-rate micro-supercapacitor 3D micro-supercapacitor Drying-mediated self-assembly Graphene Inkjet printing

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The Effect of Laser Sintering Process Parameters on Cu Nanoparticle Ink in Room Conditions

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Optics and Photonics Journal 2013年第4期3卷 40-44页

作者： Eerik Halonen Esa Heinonen matti mantysalo Department of Electronics and Communications Engineering Tampere University of TechnologyTampereFinland Center of Microscopy and Nanotechnology CNMT University of OuluOuluFinland

Copper is an interesting material for printed electronics inks because, for example, of its good conductivity and lower raw material price compared to silver. However, post-processing Cu inks is challenging because of non-conductive copper oxide. In this work, inkjet-printed Cu nanoparticle structures were sintered on a polyimide substrate with a continuous-wave 808-nm diode laser. Laser sintering was tested by varying the sintering parameters (optical power and scanning velocity), and the electrical resistance of the samples was measured. A minimum sheet resistance of approx.90 mΩ/□ was obtained. All tests were run in room conditions. Sintered structures were then analyzed from SEM images. Results showed that laser sintering produces good repeatability, that a scanning velocity increment positively affects the process window, and that multiple sintering cycles do not increase conductivity.

关键词： Nanoparticles Electrical Properties Laser Processing Microstructure Sintering Thin Films

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