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高温高压合成掺杂金刚石研究进展

人工晶体学报 2024年第2期53卷 194-209页

作者：郝敬林邓丽芬王凯悦宋惠江南西村一仁太原科技大学材料科学与工程学院太原030024 中国科学院宁波材料技术与工程研究所海洋材料及相关技术重点实验室浙江省海洋材料与防护技术重点实验室宁波315201

金刚石具有超高热导率、宽禁带等优点,通过掺杂引入电子和空穴等缺陷,提升载流子浓度,可以使金刚石具有适合半导体应用的电导率,被称为第三代终极宽禁带半导体材料。本文首先介绍了金刚石单晶的高温高压合成方法,接着系统综述了基于高... 详细信息

金刚石具有超高热导率、宽禁带等优点,通过掺杂引入电子和空穴等缺陷,提升载流子浓度,可以使金刚石具有适合半导体应用的电导率,被称为第三代终极宽禁带半导体材料。本文首先介绍了金刚石单晶的高温高压合成方法,接着系统综述了基于高温高压法的金刚石掺杂研究现状和发展,然后分析了N、B、P和S等单元素掺杂及多元素共掺杂对金刚石晶体生长和电学性能的影响,并且对第一性原理计算研究金刚石掺杂进行了分析总结。高温高压退火可以有效改变金刚石中掺杂元素与空位等缺陷组合和分布状态,本文明晰了金刚石中含氮色心形成的原因及高温高压退火对色心的调控机制。最后对金刚石掺杂以及掺杂后金刚石的光学性能和电学性能研究前景进行了展望,指出可进一步探索多元素共掺杂的理论与实验方法,对提升掺杂金刚石性能具有重要意义。

关键词：金刚石高温高压掺杂含氮色心退火第一性原理计算

A Spiral Graphene Framework Containing Highly Ordered Graphene Microtubes for Polymer Composites with Superior Through-Plane Thermal Conductivity

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Chinese Journal of Chemistry 2022年第3期40卷 329-336页

作者： Jinrui Gong Xue Tan Qilong Yuan Zhiduo Liu Junfeng Ying Le Lv Qingwei Yan Wubo Chu Chen Xue Jinhong Yu kazuhito nishimura Nan Jiang Cheng-Te Lin Wen Dai Key Laboratory of Marine Materials and Related Technologies Zhejiang Key Laboratory of Marine Materials and Protective TechnologiesNingbo Institute of Materials Technology and Engineering(NIMTE)Chinese Academy of SciencesNingboZhejiang 315201China Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of SciencesBejjing 100049China Centre for Quantum Physics Key Laboratory of Advanced Optoelectronic Quantum Architecture and Measurement(MOE)Beijing Key Lab of Nonophotonics&Ultrafine Optoelectronic SystemsSchool of PhysicsBeijing Institute of TechnologyBeijing 100081China College of Materials Science and Engineering Hunan UniversityChangshaHunan 410082China Advanced Nano-processing Engineering Lob Mechanical Systems EngineeringKogakuin UniversityTokyo 192-0015Japan

As the power density of electronic devices increases,there has been an urgent demand to develop highly conductive polymer composites to address the accompanying thermal management *** to the ultra-high intrinsic thermal conductivity,graphene is considered a very promising filler to improve the thermal conductivity of ***,graphene-based polymer composites prepared by the conventional mixing method generally have limited thermal conductivity,even under high graphene loading,due to the failure to construct efficient heat transfer pathways in the polymer ***,a spiral graphene framework(SGF)containing continuous and highly ordered graphene microtubes was developed based on a modified CVD *** embedding into the epoxy(EP)matrix,the graphene microtubes can act as efficient heat pathways,endowing the SGF/EP composites with a high through-plane thermal conductivity of 1.35 W·m^(-1)·K^(-1) at an ultralow graphene loading of 0.86 wt%.This result gives a thermal conductivity enhancement per 1 wt%filler loading of 710%,significantly outperforming various graphene structures as *** addition,we demonstrated the practical application of the SGF/EP composite as a thermal interface material for efficient thermal man-agement of the light-emitting diode(LED).

关键词： Graphene Chemical vapor deposition Polymer Thermal conductivity Thermal management material

Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction

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Nano-Micro Letters 2023年第1期15卷 183-196页

作者： Wen Dai Xing-Jie Ren Qingwei Yan Shengding Wang Mingyang Yang Le Lv Junfeng Ying Lu Chen Peidi Tao Liwen Sun Chen Xue Jinhong Yu Chengyi Song kazuhito nishimura Nan Jiang Cheng-Te Lin Key Laboratory of Marine Materials and Related Technologies Zhejiang Key Laboratory of Marine Materials and Protective TechnologiesNingbo Institute of Materials Technology and Engineering(NIMTE)Chinese Academy of SciencesNingbo 315201People’s Republic of China Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of SciencesBeijing 100049People’s Republic of China Institute of Advanced Technology Shandong UniversityJinan 250100People’s Republic of China Ningbo Institute of Materials Technology and Engineering(NIMTE) Chinese Academy of SciencesNingbo 315201People’s Republic of China The State Key Laboratory of Metal Matrix Composites School of Materials Science and EngineeringShanghai Jiao Tong University800 Dong Chuan RoadShanghai 200240People’s Republic of China Advanced Nano-Processing Engineering Lab Mechanical Systems EngineeringKogakuin UniversityTokyo 192-0015Japan

Developing advanced thermal interface materials(TIMs)to bridge heat-generating chip and heat sink for constructing an efficient heat transfer interface is the key technology to solve the thermal management issue of high-power semiconductor *** on the ultra-high basal-plane thermal conductivity,graphene is an ideal candidate for preparing high-performance TIMs,preferably to form a vertically aligned structure so that the basal-plane of graphene is consistent with the heat transfer direction of ***,the actual interfacial heat transfer efficiency of currently reported vertically aligned graphene TIMs is far from *** addition to the fact that the thermal conductivity of the vertically aligned TIMs can be further improved,another critical factor is the limited actual contact area leading to relatively high contact thermal resistance(20-30 K mm^(2) W^(−1))of the“solid-solid”mating interface formed by the vertical graphene and the rough chip/heat *** solve this common problem faced by vertically aligned graphene,in this work,we combined mechanical orientation and surface modification strategy to construct a three-tiered TIM composed of mainly vertically aligned graphene in the middle and micrometer-thick liquid metal as a cap layer on upper and lower *** on rational graphene orientation regulation in the middle tier,the resultant graphene-based TIM exhibited an ultra-high thermal conductivity of 176 W m^(−1) K^(−1).Additionally,we demonstrated that the liquid metal cap layer in contact with the chip/heat sink forms a“liquid-solid”mating interface,significantly increasing the effective heat transfer area and giving a low contact thermal con-ductivity of 4-6 K mm^(2) W^(−1) under packaging *** finding provides valuable guidance for the design of high-performance TIMs based on two-dimensional materials and improves the possibility of their practical application in electronic thermal management.

关键词： Vertically aligned graphene Liquid metal Surface modification Thermal interface materials

Enhancement of in-plane thermal conductivity of flexible boron nitride heat spreaders by micro/nanovoid filling using deformable liquid metal nanoparticles

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Rare Metals 2023年第11期42卷 3662-3672页

作者： Pei-Di Tao Shao-Gang Wang Lu Chen Jun-Feng Ying Le Lv Li-Wen Sun Wu-Bo Chu kazuhito nishimura Li Fu Yue-Zhong Wang Jin-Hong Yu Nan Jiang Wen Dai Yao-Kang Lv Cheng-Te Lin Qing-Wei Yan College of Chemical Engineering Zhejiang University of TechnologyHangzhou310058China Qianwan Institute Ningbo Institute of Materials Technology and Engineering(NIMTE)Chinese Academy of SciencesNingbo315201China Key Laboratory of Marine Materials and Related Technologies Zhejiang Key Laboratory of Marine Materials and Protective TechnologiesNingboInstitute of Materials Technology and Engineering(NIMTE)Chinese Academy of SciencesNingbo315201China Shenyang National Laboratory for Materials Science Institute of Metal ResearchChinese Academy of SciencesShenyang110016China Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of SciencesBeijing100049China Advanced Nano-Processing Engineering Lab Mechanical Systems EngineeringKogakuin UniversityTokyo192-0015Japan College of Materials and Environmental Engineering Hangzhou Dianzi UniversityHangzhou310018China

With the fast development of integrated circuit devices as well as batteries with high energy densities,the thermal management of electronic components is becoming increasingly crucial to maintaining their reliable *** nitride nanosheets(BNNS),which have superhigh thermal conductivity along the in-plane direction while remaining electrically insulating,were widely regarded as an ideal filler for preparing high-performance polymer composites to address the‘‘thermal failure''***,due to the instinctive rigidity of BNNS,the nanosheets are unable to form a tightly interfacial contact between the adjoining fillers,resulting in some micro-and nanovoids within the heat transfer pathways and severely limiting further thermal conductivity enhancement for BNNS-based ***,soft and deformable liquid metal(eutectic gallium-indium,EGaIn)nanoparticles were employed to fill the gaps between the adjacent BNNS with a rational design of mass ratios of BNNS and EGaIn,leading to a strongly synergistic effect with BNNS on thermal conductivity *** a result,the composite film(BNNS:63 wt%and EGaIn:7 wt%)employing cellulose nanofibers(CNF:30 wt%)as the polymer matrix achieves superhigh thermal conductivity along the in-plane direction of up to(90.51±6.71)W·m^(-1)·K^(-1),showing the highest value among the BNNSbased composites with a bi-filler system as far as we ***,the film can work as a heat spreader for the heat dissipation of high-power light emitting diodes,outperforming tin foil in cooling efficiency.

关键词： Boron nitride nanosheet Liquid metal Eutectic gallium-indium In-plane thermal conductivity Heat spreader

半导体用大尺寸单晶金刚石衬底制备及加工研究现状

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人工晶体学报 2023年第10期52卷 1733-1744页

作者：刘俊杰关春龙易剑宋惠江南西村一仁河南工业大学材料科学与工程学院郑州450001 中国科学院宁波材料技术与工程研究所海洋材料及相关技术重点实验室浙江省海洋材料与防护技术重点实验室宁波315201

单晶金刚石具有超宽的禁带宽度、低的介电常数、高的击穿电压、高的热导率、高的本征电子和空穴迁移率,以及优越的抗辐射性能,是目前已知的最有前景的宽禁带高温半导体材料,被誉为“终极半导体”。但单晶金刚石在半导体上的大规模应用... 详细信息

单晶金刚石具有超宽的禁带宽度、低的介电常数、高的击穿电压、高的热导率、高的本征电子和空穴迁移率,以及优越的抗辐射性能,是目前已知的最有前景的宽禁带高温半导体材料,被誉为“终极半导体”。但单晶金刚石在半导体上的大规模应用还有很多技术难题急需解决。本文聚焦大尺寸(英寸级)单晶金刚石衬底的化学气相沉积合成、剥离切片及研磨抛光技术,通过对近年来的相关文献进行整理,综述了相关方面的国内外研究现状。在此基础上,对未来单晶金刚石半导体材料的制备、剥离和研磨抛光进行了展望。

关键词：单晶金刚石大尺寸沉积剥离研磨抛光半导体

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915 MHz高功率MPCVD设备生长8-inch金刚石外延膜

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硬质合金 2023年第2期40卷 98-104页

作者：杨国永杨明阳王博王跃忠鲁云祥宋惠易剑西村一仁江南中国科学院宁波材料技术与工程研究所海洋材料及相关技术重点实验室浙江省海洋材料与防护技术重点实验室浙江宁波315201

金刚石外延膜具有良好的热学、光学和化学稳定性,同时能够满足大尺寸的制备需求,是红外窗口和散热应用中理想的材料。受限于目前金刚石应用中尺寸较小等问题,制备大尺寸高质量的金刚石一直是人们追求的目标。本文采用自行研制的915 MHz/... 详细信息

金刚石外延膜具有良好的热学、光学和化学稳定性,同时能够满足大尺寸的制备需求,是红外窗口和散热应用中理想的材料。受限于目前金刚石应用中尺寸较小等问题,制备大尺寸高质量的金刚石一直是人们追求的目标。本文采用自行研制的915 MHz/75 kW的微波等离子体化学气相沉积(MPCVD)设备,研究了不同沉积温度对直径8 inch(1 inch=25.4 mm)的金刚石膜沉积的影响,并通过SEM和Raman对其进行表征分析。结果表明,沉积温度会影响金刚石膜的晶体取向和结晶质量,过低的温度不利于金刚石膜规则地取向生长;而过高的温度会产生sp2石墨相,降低金刚石膜的结晶质量和取向生长。本文最终在1000°C的沉积温度和1.0%的甲烷浓度(甲烷与氢气流量之比为0.01)下成功制备了具有良好的结晶质量和厚度均匀的8 inch(111)取向的金刚石外延膜,该外延膜具有较低的氮杂质含量,生长表面均匀,无生长裂纹产生,晶粒尺寸在3~5 mm。红外透过测试结果表明12μm处的透过率达到了67.8%,8~12μm之间的平均透过率为67.3%。

关键词：金刚石外延膜大尺寸 MPCVD 红外窗口材料 915 MHz