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第11届国际模糊系统协会世界大会

作者： eiichiro takahagi Visiting Fellow University of BristolUK （Until August 2005） School of CommerceSenshu UniversityJapan

＜正＞ In this paper, we introduce logical Choquet integrals which represent logical input-output relations and show some examples to understand the difference from ordinal Choquet integrals. Next, we propose the identification method of extended fuzzy measures like regression analysis and the interpretation of the extended fuzzy measure.

关键词： Logical Choquet Integral Extended Fuzzy Measure Regression Analysis Interpretation of Fuzzy Measure Monotonicity

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Exome-wide variation in a diverse barley panel reveals genetic associations with ten agronomic traits in Eastern landraces

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Journal of Genetics and Genomics 2023年第4期50卷 241-252页

作者： June-Sik Kim Kotaro takahagi Komaki Inoue Minami Shimizu Yukiko Uehara-Yamaguchi Asaka Kanatani Daisuke Saisho Ryuei Nishii Alexander ELipka Takashi Hirayama Kazuhiro Sato Keiichi Mochida Bioproductivity Informatics Research Team RIKEN Center for Sustainable Resource ScienceYokohama 230-0045Japan Institute of Plant Science and Resources Okayama UniversityKurashiki 710-0046Japan Kihara Institute for Biological Research Yokohama City UniversityYokohama 244-0813Japan Graduate School of Nanobioscience Yokohama City UniversityYokohama 236-0027Japan School of Information and Data Sciences Nagasaki UniversityNagasaki 852-8521Japan Department of Crop Sciences University of IllinoisUrbanaIL 61801USA Microalgae Production Control Technology Laboratory RIKEN Baton Zone ProgramRIKEN Cluster for ScienceTechnology and Innovation HubYokohama 230-0045Japan

Barley(Hordeum vulgare ***)is one of the first crops to be domesticated and is adapted to a wide range of *** barley germplasm collections possess valuable allelic variations that could further improve barley *** barley genomics has offered a global picture of allelic variation among varieties and its association with various agronomic traits,polymorphisms from East Asian varieties remain *** this study,we analyze exome polymorphisms in a panel of 274 barley varieties collected worldwide,including 137 varieties from East Asian countries and *** reveal the underlying population structure and conduct genome-wide association studies for 10 agronomic ***,we examin genome-wide associations for traits related to grain size such as awn length and glume *** results demonstrate the value of diverse barley germplasm panels containing Eastern varieties,highlighting their distinct genomic signatures relative to Western subpopulations.

关键词： Barley Exome-seq Genome-wide association study(GWAS) Population structure Allelic variation

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An autopsy case of metastatic extramammary Paget’s disease treated with multimodality treatment including anti-HER2 therapy: What is the clinical and pathological significance of trastuzumab to the patient?

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Modern Chemotherapy 2013年第4期2卷 66-68页

作者： Noriko Yoshimura Koji Arihiro Shunsuke takahagi Michihiro Hide Department of Dermatology Hiroshima University Hospital Hiroshima Japan Department of Pathology Hiroshima University Hospital Hiroshima Japan Department of Surgery Hiroshima General Hospital Hiroshima Japan

Advanced Extramammary Paget’s disease (AEMPD) shows a poor prognosis despite multimodality therapy. In recent years, it is suggested that anti-HER2 therapy may be promising for HER2-positive AEMPD. We herein present an autopsy case of a patient with AEMPD treated with multimodality treatment including anti-HER2 therapy. A 78-year-old man who diagnosed with AEMPD died after surgery and systemic chemotherapy including anti-HER2 therapy (trastuzumab). The metastatic skin lesions were immnohistologically HER2-positive. While the patients were administrated trastuzumab plus taxan (docetaxel, and paclitaxel) regimen, the metastatic skin lesion decreased, however, brain metastases were found in his brain and trastuzumab is discontinued. The skin metastasis rapidly spread over his body, leading to weakness, and he eventually died. At autopsy, the lesions of EMPD were extended distant organs including brain, although each metastasis was small and asymptomatic. The wide lesion of skin metastasis was exacerbated after discontinuation of trastuzumab, and transudate was observed due to the extensive necrosis and erosion. Our autopsy findings showed one progressive pattern of AEMPD, and indicated what is the clinical and pathological significance of anti HER2 therapy for HER2-positive AEMPD.

关键词： Extramammary Paget’s Disease HER2 Autopsy

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Formation of 10nm Continuous Cu Film in a Fine Hole by Eiectroless Plating for Seed Layer Application

Formation of 10nm Continuous Cu Film in a Fine Hole by Eiect...

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2005年上海市电镀与表面精饰学术年会

作者： Hiroyuki Sakaue Takayuki takahagi Shoso Shingubara Graduate School of Advanced Science of Matter Hiroshima University1-3-1 KagamiyamaHigashi-Hiroshima 739-8530Japan Graduate School f Advanced Science of Matter Hiroshima University1-3-1 KagamiyamaHigashi-Hiroshima 739-8530Japan

＜正＞A continuous electroless-plated Cu film of only 10 nm in thickness was successfully deposited on a TaN barrier over a 1 nm-thick Pd catalytic layer formed by ionized cluster beam *** electrical resistivity of the Cu interconnecfion was found to decrease as the Pd layer thickness was reduced,to as low as 2.11 μΩ·cm at a Pd thickness of 1 ***,the deposited film has adhesion strength as high as that of sputtered Cu on TaN,even for the case of the 1 nm-thick Pd catalyst layer. A uniform and continuous 10 nm-thick Cu seed layer was formed by electroless plating over a 1 nm-thick Pd layer,and subsequent Cu electroplating filled all high aspect ratio via-holes without the appearance of voids.

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Bottom-up Fill of Copper in High Aspect Ratio Via Holes by Electroless Plating

Bottom-up Fill of Copper in High Aspect Ratio Via Holes by E...

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2004年全国电子电镀学术研讨会

作者： Osamu Yaegashil Hiroyuki Sakaue Takayuki takahagi Shoso Shingubara Graduate School of Advanced Science of Matter Hiroshima University 1-3-1 KagamiyamaHigashi-Hiroshima 739-8530Japan

A uniform and continuous 10 nm-thick Cu seed layer was formed by electroless plating over a 1 nm-thick Pd catalytic layer formed by ionized cluster beam *** electrical resistivity of the Cu interconnection was found to decrease as the Pd layer thickness was reduced,to as low as 2.1 ???cm at a Pd thickness of 1 ***,the deposited film has adhesion strength as high as that of sputtered Cu on *** bottom-up fill of copper in fine via holes was first reported in electroless copper plating with addition of bis(3-sulfopropyl) disulfide(SPS).The ratio of Cu thickness at bottom of hole(Tb) to that at the surface(Ts),called the bottom-up ratio,increases with SPS concentration and decreases with an increase in hole diameter.

关键词： Electroless Copper plating bottom-up filling adhesion strength damascene copper interconnections

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