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Design of ultrasonic elliptical vibration cutting system for tungsten heavy alloy

Frontiers of Mechanical Engineering 2022年第4期17卷 163-180页

作者： Sen YIN Yan BAO Yanan PAN Zhigang DONG zhuji jin Renke KANG Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education School of Mechanical EngineeringDalian University of TechnologyDalian 116024China

Nanoscale surface roughness of tungsten heavy alloy components is required in the nuclear industry and precision instruments.In this study,a high-performance ultrasonic elliptical vibration cutting(UEVC)system is developed to solve the precision machining problem of tungsten heavy alloy.A new design method of stepped bending vibration horn based on Timoshenko’s theory is first proposed,and its design process is greatly simplified.The arrangement and working principle of piezoelectric transducers on the ultrasonic vibrator using the fifth resonant mode of bending are analyzed to realize the dual-bending vibration modes.A cutting tool is installed at the end of the ultrasonic vibration unit to output the ultrasonic elliptical vibration locus,which is verified by finite element method.The vibration unit can display different three-degree-of-freedom(3-DOF)UEVC characteristics by adjusting the corresponding position of the unit and workpiece.A dual-channel ultrasonic power supply is developed to excite the ultrasonic vibration unit,which makes the UEVC system present the resonant frequency of 41 kHz and the maximum amplitude of 14.2μm.Different microtopography and surface roughness are obtained by the cutting experiments of tungsten heavy alloy hemispherical workpiece with the UEVC system,which validates the proposed design’s technical capability and provides optimization basis for further improving the machining quality of the curved surface components of tungsten heavy alloy.

关键词： tungsten heavy alloy ultrasonic elliptical vibration cutting Timoshenko’s theory resonant mode of bending finite element method

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Prediction of the Interface Temperature Rise in Tribochemical Polishing of CVD Diamond

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Chinese Journal of Mechanical Engineering 2017年第2期30卷 310-320页

作者： Zewei YUAN Yan HE zhuji jin Peng ZHENG Qiang LI School of Mechanical Engineering Shenyang University of Technology Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education Dalian University of Technology

Tribochemcial polishing is one of the most efficient methods for polishing CVD （Chemical Vapor Deposition） diamond film due to the use of catalytic metal. However the difficulty to control the interface temperature during polishing process often results in low material removal because of the unstable contact process. So this research investigates the contact process in the tribo- chemical polishing of CVD diamond film and proposes a dynamic contact model for predicting the actual contact area, the actual contact pressure, and the interface tem- perature in the polishing process. This model has been verified by characterizing surface metrology of the CVD diamond with Talysurf CLI2000 3D Surface Topography and measuring the polishing temperature. The theoretical and experimental results shows that the height distribution of asperities on diamond film surface in the polishing process is well evaluated by combining the height distribution of original and polished asperities. The modeled surface asperity height distribution of diamond film agrees with the actual surface metrology in polishing process. The actual contact pressure is very large due to the small actual contact area. The predicted interface temperature can reach the catalytic reaction temperature between diamond and polishing plate when the lowest rotation speed and load are 10 000 r/min and 50 N, respectively, and diamond material is significantly removed. The model may provide effective process theory for tribochemcial polishing.

关键词： CVD diamond · Tribochemical polishing · Interface temperature · Prediction

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用于金刚石摩擦化学抛光的Ni-W合金盘制备

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金刚石与磨料磨具工程 2024年第1期44卷 39-49页

作者：牛昊金洙吉沈煜杨辉鹏大连理工大学精密与特种加工教育部重点实验室辽宁大连116024

为探究镀液成分、工艺条件等因素对Ni-W合金镀层的影响,制备出低内应力、高硬度的Ni-W合金盘,用于金刚石的摩擦化学抛光。采用单一性实验分别探究络合剂浓度、溶液pH、糖精钠浓度对镀层内应力、钨含量、硬度以及沉积速率的影响,并探究... 详细信息

为探究镀液成分、工艺条件等因素对Ni-W合金镀层的影响,制备出低内应力、高硬度的Ni-W合金盘,用于金刚石的摩擦化学抛光。采用单一性实验分别探究络合剂浓度、溶液pH、糖精钠浓度对镀层内应力、钨含量、硬度以及沉积速率的影响,并探究不同添加剂对镀层表面整平的效果。最终选用水杨醛为整平剂,并采用反向脉冲电流降低了镀层表面粗糙度,制备出硬度达HV 713,镀层厚度约为0.66 mm的Ni-W合金盘。使用合金盘对金刚石进行摩擦化学抛光,并探究合适的抛光工艺参数。在合金盘转速为8000 r/min,压力为40 N时,金刚石的抛光效果较好,其材料去除率为5.56μm/min,磨削比达0.394,金刚石表面粗糙度Sa为3.7 nm。使用传统铸铁盘对金刚石进行摩擦化学抛光,通过对比磨损参数发现,Ni-W合金盘能够达到更好的抛光效果。

关键词：金刚石 Ni-W合金镀层内应力摩擦化学抛光

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金刚石高效超低损伤加工机理与工艺研究现状

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机械工程学报 2024年第3期60卷 337-353页

作者：袁菘郭晓光金洙吉康仁科郭东明大连理工大学高性能精密制造全国重点实验室大连116024

随着电子器件向高频高压、大功率方向发展,对半导体器材的性能提出了更高的要求。单晶金刚石具有高热导、耐高温、超宽禁带、击穿电压高等特性,被视为终极半导体材料。若要充分发挥金刚石的性能,其表面需要具有超光滑和近乎无损伤的表... 详细信息

随着电子器件向高频高压、大功率方向发展,对半导体器材的性能提出了更高的要求。单晶金刚石具有高热导、耐高温、超宽禁带、击穿电压高等特性,被视为终极半导体材料。若要充分发挥金刚石的性能,其表面需要具有超光滑和近乎无损伤的表面。然而,金刚石不仅硬度大、化学性质稳定、难去除,而且脆性大、断裂性韧性低、极易产生加工损伤,这严重制约了金刚石在半导体领域的应用。有关金刚石高效超低损伤的加工机理和工艺,国内外学者展开了大量研究。但到目前为止,并没有一套适合于金刚石高效超低损伤的加工理论和工艺。在介绍了金刚石现有加工方法及其优缺点的基础上,概述了金刚石加工工艺的研究现状,并从实验表征和模拟计算两方面系统地总结了有关金刚石高效超低损伤加工机理以及相关的工艺研究进展,最后分析了目前实现金刚石高效超低损伤加工面临的问题、难点及未来发展趋势,为今后金刚石半导体器件的制造技术及理论提供借鉴。分析表明,机理方面,实验表征与模拟计算相结合是获得更多的动态原子细节信息的有效方式,是未来在原子尺度阐明加工机理的发展方向。工艺方面,化学机械抛光方法可以用于平坦化大尺寸材料加工,同时也可以获得具有超光滑超低损伤表面的金刚石,但去除率低是限制该方法应用的瓶颈问题,通过金刚石磨粒+强氧化剂+外部能场辅助的加工方法是实现金刚石高效超低损伤加工的发展方向。

关键词：金刚石高效超低损伤半导体材料工艺与机理

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Advances in molecular dynamics simulation of ultra-precision machining of hard and brittle materials

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Frontiers of Mechanical Engineering 2017年第1期12卷 89-98页

作者： Xiaoguang GUO Qiang LI Tao LIU Renke KANG zhuji jin Dongming GUO Key Laboratory for Precision & Non-traditional Machining of Ministryof Education Dalian University of Technology Dalian 116024 China

Hard and brittle materials, such as silicon, SiC, and optical glasses, are widely used in aerospace, military, integrated circuit, and other fields because of their excellent physical and chemical properties. However, these materials display poor machinability because of their hard and brittle properties. Damages such as surface micro-crack and subsurface damage often occur during machining of hard and brittle materials. Ultra-precision machining is widely used in processing hard and brittle materials to obtain nanoscale machining quality. However, the theoretical mechanism underlying this method remains unclear. This paper provides a review of present research on the molecular dynamics simulation of ultra-precision machining of hard and brittle materials. The future trends in this field are also discussed.

关键词： MD simulation ultra-precision machining,hard and brittle materials machining mechanism review

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A review of low-temperature plasma-assisted machining:from mechanism to application

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Frontiers of Mechanical Engineering 2023年第1期18卷 35-53页

作者： Jiyu LIU Yuheng LI Yang CHEN Yuyang ZHOU Shuaishuai WANG Zizhen YUAN zhuji jin Xin LIU Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education Dalian University of TechnologyDalian 116024China

Materials with high hardness,strength or plasticity have been widely used in the fields of aviation,aerospace,and military,among others.However,the poor machinability of these materials leads to large cutting forces,high cutting temperatures,serious tool wear,and chip adhesion,which affect machining quality.Low-temperature plasma contains a variety of active particles and can effectively adjust material properties,including hardness,strength,ductility,and wettability,significantly improving material machinability.In this paper,we first discuss the mechanisms and applications of low-temperature plasma-assisted machining.After introducing the characteristics,classifications,and action mechanisms of the low-temperature plasma,we describe the effects of the low-temperature plasma on different machining processes of various difficult-to-cut materials.The low-temperature plasma can be classified as hot plasma and cold plasma according to the different equilibrium states.Hot plasma improves material machinability via the thermal softening effect induced by the high temperature,whereas the main mechanisms of the cold plasma can be summarized as chemical reactions to reduce material hardness,the hydrophilization effect to improve surface wettability,and the Rehbinder effect to promote fracture.In addition,hybrid machining methods combining the merits of the low-temperature plasma and other energy fields like ultrasonic vibration,liquid nitrogen,and minimum quantity lubrication are also described and analyzed.Finally,the promising development trends of low-temperature plasma-assisted machining are presented,which include more precise control of the heat-affected zone in hot plasma-assisted machining,cold plasma-assisted polishing of metal materials,and further investigations on the reaction mechanisms between the cold plasma and other materials.

关键词： low-temperature plasma difficult-to-cut material machinability hydrophilization effect Rehbinder effect

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Smoothed-Particle Hydrodynamics Investigation on Brittle-Ductile Transition of Quartz Glass in Single-Grain Grinding Process

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Nanomanufacturing and Metrology 2020年第4期3卷 299-306页

作者： Xiaoguang Guo Ming Li Xichun Luo Ruifeng Zhai Renke Kang zhuji jin Dongming Guo Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education Dalian University of TechnologyDalian 116024China Centre for Precision Manufacturing Department of DesignManufacture and Engineering ManagementUniversity of StrathclydeGlasgow G11XJUK

The smoothed-particle hydrodynamics(SPH)method was introduced to simulate the quartz glass grinding process with a single grain under micrp-nano scale.To investigate the mechanism of brittle-ductile transition,such factors as the machin-ing depth,grinding force,maximum equivalent stress,and residual stress were analyzed.The simulation results indicate that quartz glass can be machined in a ductile mode under a certain condition.In this paper,the occurrence and propaga-tion of cracks in quartz glass at different grinding depths(0.1-1μm)are observed,and the critical depth of brittle-ductile transformation is 0.36 pum.At different grinding depths,the grinding force ratio is greater than 1.When the cutting depth is 0.4 um,the crack propagation depth is about 1.2μm,which provides a basis for the prediction of subsurface damage depth.In addition,the correctness of the simulation result was verified by carrying out scratch experiments of varying cutting depth on optical quartz glass.

关键词： Quartz glass Brittle ductile transition Ultra precision grinding Smoothed particle hydrodynamics

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Theoretical and experimental investigation of chemical mechanical polishing of W–Ni–Fe alloy

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International Journal of Extreme Manufacturing 2021年第2期3卷 125-137页

作者： Jiang Guo Xiaolin Shi Chuanping Song Lin Niu Hailong Cui Xiaoguang Guo Zhen Tong Nan Yu zhuji jin Renke Kang Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education Dalian University of TechnologyDalianPeople’s Republic of China EPSRC Hub in Future Metrology Centre for Precision TechnologiesUniversity of HuddersfieldHuddersfieldUnited Kingdom Institute for Materials and Processes School of EngineeringSanderson BuildingUniversity of EdinburghEH93FB ScotlandUnited Kingdom

Fine finishing of tungsten alloy is required to improve the surface quality of molds and precision instruments. Nevertheless, it is difficult to obtain high-quality surfaces as a result of grain boundary steps attributed to differences in properties of two-phase microstructures. This paper presents a theoretical and experimental investigation on chemical mechanical polishing of W–Ni–Fe alloy. The mechanism of the boundary step generation is illustrated and a model of grain boundary step formation is proposed. The mechanism reveals the effects of mechanical and chemical actions in both surface roughness and material removal. The model was verified by the experiments and the results show that appropriately balancing the mechanical and chemical effects restrains the generation of boundary steps and leads to a fine surface quality with a high removal rate by citric acid-based slurry.

关键词： chemical mechanical polishing W–Ni–Fe alloy grain boundary step modelling mechanism

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Atomistic understanding of interfacial processing mechanism of silicon in water environment:A ReaxFF molecular dynamics simulation

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Frontiers of Mechanical Engineering 2021年第3期16卷 570-579页

作者： Song YUAN Xiaoguang GUO Penghui LI Shuohua ZHANG Ming LI zhuji jin Renke KANG Dongming GUO Fumin LIU Lemin ZHANG Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education Dalian University of TechnologyDalian 116024China Beijing Institute of Aerospace Control Device Beijing 100854China

The interfacial wear between silicon and amorphous silica in water environment is critical in numerous applications.However,the understanding regarding the micro dynamic process is still unclear due to the limitations of apparatus.Herein,reactive force field simulations are utilized to study the interfacial process between silicon and amorphous silica in water environment,exploring the removal and damage mechanism caused by pressure,velocity,and humidity.Moreover,the reasons for high removal rate under high pressure and high velocity are elucidated from an atomic perspective.Simulation results show that the substrate is highly passivated under high humidity,and the passivation layer could alleviate the contact between the abrasive and the substrate,thus reducing the damage and wear.In addition to more Si-O-Si bridge bonds formed between the abrasive and the substrate,new removal pathways such as multibridge bonds and chain removal appear under high pressure,which cause higher removal rate and severer damage.At a higher velocity,the abrasive can induce extended tribochemical reactions and form more interfacial Si-O-Si bridge bonds,hence increasing removal rate.These results reveal the internal cause of the discrepancy in damage and removal rate under different conditions from an atomic level.

关键词： silicon ReaxFF molecular dynamics friction damage

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Effects of Chloride Ion on the Texture of Copper and Cu-ZrB_(2) Coatings Electrodeposited from Copper Nitrate Solution in Different Plating Modes

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Journal of Materials Science & Technology 2006年第5期22卷 643-646页

作者： Dongming GUO Min ZHANG zhuji jin Renke KANG Key laboratory for Precision ＆ Non-traditional Machining of Ministry of Education Dalian University of TechnologyDalian 116023 China

For the first time, the texture of copper and Cu-ZrB2 coatings produced from copper nitrate solution was studied. Chloride ion shows different effects on the deposit texture under direct current （DC） and pulse current （PC） conditions. Copper deposits are strongly 〈220〉 textured in DC plating with and without chloride ion. While in PC condition, the predominant texture shifts from 〈220〉 to 〈200〉 as the chloride ion concentration exceeds 20 mg/l. The addition of ZrB2 particles enhances the cathodic polarization of copper deposition, which improves the growth of （111） plane. However, this improvement can be eliminated by further addition of chloride ion.

关键词： Texture Chloride ion Pulse plating Coatings

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