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Hybrid multi-chip assembly of optical communication engines by in situ 3D nanolithography

Light(Science & Applications) 2020年第1期9卷 1340-1350页

作者： Matthias Blaicher Muhammad Rodlin Billah Juned Kemal Tobias Hoose Pablo Marin-Palomo Andreas Hofmann yasar kutuvantavida Clemens Kieninger Philipp-Immanuel Dietrich Matthias Lauermann Stefan Wolf Ute Troppenz Martin Moehrle Florian Merget Sebastian Skacel Jeremy Witzens Sebastian Randel Wolfgang Freude Christian Koos Institute of Photonics and Quantum Electronics(IPQ) Karlsruhe Institute of Technology(KIT)Engesserstraße 576131 KarlsruheGermany Institute for Microstructure Technology(IMT) KITHermann-von-Helmholtz-Platz 176344 Eggenstein-LeopoldshafenGermany Institute for Automation and Applied Informatics(IAI) KITHermann-von-Helmholtz-Platz 176344 Eggenstein-LeopoldshafenGermany Vanguard Automation GmbH Gablonzer StraBe 1076185 KarlsruheGermany Fraunhofer Institute for Telecommunications Heinrich Hertz Institute(HHI)Einsteinufer 3710587 BerlinGermany Institute of Integrated Photonics(IPH) RWTH AachenSommerfeldstraße 18/2452074 AachenGermany

Three-dimensional(3D)nano-printing of freeform optical waveguides,also referred to as photonic wire bonding,allows for efficient coupling between photonic chips and can greatly simplify optical system *** a key advantage,the shape and the trajectory of photonic wire bonds can be adapted to the mode-field profiles and the positions of the chips,thereby offering an attractive alternative to conventional optical assembly techniques that rely on technically complex and costly high-precision ***,while the fundamental advantages of the photonic wire bonding concept have been shown in proof-of-concept experiments,it has so far been unclear whether the technique can also be leveraged for practically relevant use cases with stringent reproducibility and reliability *** this paper,we demonstrate optical communication engines that rely on photonic wire bonding for connecting arrays of silicon photonic modulators to InP lasers and single-mode *** a first experiment,we show an eight-channel transmitter offering an aggregate line rate of 448 Gbit/s by low-complexity intensity modulation.A second experiment is dedicated to a four-channel coherent transmitter,operating at a net data rate of 732.7 Gbit/s-a record for coherent silicon photonic transmitters with co-packaged *** dedicated test chips,we further demonstrate automated mass production of photonic wire bonds with insertion losses of(0.7±0.15)dB,and we show their resilience in environmental-stability tests and at high optical *** results might form the basis for simplified assembly of advanced photonic multi-chip systems that combine the distinct advantages of different integration platforms.

关键词： communication lithography bonding

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