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Influences of Ag and Au Additions on Structure and Tensile Strength of Sn-5Sb Lead Free Solder Alloy

Journal of Materials Science & Technology 2008年第6期24卷 921-925页

作者： A.A.El-Daly y.swilem A.E.Hammad Physics Department Faculty of ScienceZagazig UniversityZagazigEgypt

It is important, for electronic application, to decrease the melting point of Sn-5Sb solder alloy because it is relatively high as compared with the most popular eutectic Pb-Sn solder alloy. Adding Au or Ag can decrease the onset melting temperature （233℃） of this alloy to 203,5℃ and 216℃, respectively. The results indicate that the Sn-5Sb-i.5Au alloy has very good ultimate tensile strength （UTS）, ductility, and fusion heat, which are better than both those of the *** and Sn-5Sb alloys. The formation of intermetallic compounds （IMCs） AuSn4 and Ag3Sn enhanced the SbSn precipitates in the solidification microstructure microstructure stability, while retained the formation of thus significantly improved the strength and ductility For all alloys, both UTS and yield stress （σy） increase with increasing strain rate and decrease with increasing temperature in tensile tests, but changes of ductility are generally small with inconsistent trends.

关键词： Sn-Sb solder Lead-free solder Melting temperature Tensile strength

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Indentation Creep Behavior and Microstructure of Cu-Ge Ferrites

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Materials Sciences and Applications 2011年第8期2卷 1076-1082页

作者： Hesham Mohaned Zaki Ali Mohamed Abdel-Daiem yahia Ibrahim swilem Farid El-Tantawy Fahad Masoud Al-Marzouki Ahmed Abdallah Al-Ghamdi Saleh Al-Heniti Farag Said Al-Hazmi Talal Sadaka Al-harbi 不详

Cu-Ge ferrite was prepared using the standard ceramic method. The creep rate of polycrystalline Cu1+xGexFe2-2xO4 ferrite has been measured as a function of time at room temperature. It is found that the indentation length increases with the increase of both time and applied load. A regime of individual creep curves is observed for the first and second stages. It is not possible to record the third stage of the curve as usually happened in an ordinary creep test, because fracture of the samples does not occur. The slope is found to increase with increasing germanium and copper content in the steady state region. The high value of n (stress exponent factor) indicates that the dislocation creep is the dominate mechanism. The porosity arrangements developed within the specimens were examined using optical microscope. The results are discussed with regard to models describing the role of the steady state creep rate of metals. The morphology of the samples shows that the porosity is increased by increasing both copper and germanium ions.

关键词： Ferrites Indentation Creep Microstructure

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