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Anand Parameters Determination for SnAgCu Solder Bearing Micro-amounts Rare Earth Ce

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Chinese Journal of Mechanical Engineering 2010年第2期23卷 257-262页

作者： ZHANG Liang xue songbai GAO Lili CHEN Yan YU Shenglin SHENG Zhong College of Materials Science and Technology Nanjing University of Aeronautics and Astronautics Nanjing 210016 China Harbin Welding Institute Harbin 150080 China The 14th Research Institute China Electronics Technology Group Corporation Nanjing 210013 China

SnAgCu solder system with the addition of rare earth Ce, which has better thermo-mechanical properties compared to those of SnPb solder, is regarded as one of the promising candidates for electronic assembly. Moreover, the SnAgCuCe solder alloys can provide good quality joints with Cu substrates. However, there is few report of the constitutive model for SnAgCu solder bearing micro-amounts rare earth Ce. In this paper, the unified viscoplastic constitutive model, Anand equations, is used to represent the inelastic deformation behavior for SnAgCu and SnAgCuCe solders. In order to obtain the acquired data for the fitting of the material parameters of this unified model, a series of experiments of constant strain rate test were conducted under isothermal conditions at different temperatures. The Anand parameters of the constitutive equations for SnAgCu and SnAgCuCe solder were determined from separated constitutive relations and experimental results. Nonlinear least-square fitting was selected to determine the model constants. And the simulated results were then compared with experimental measurements of the stress-inelastic strain curves： excellent agreement was found. The model accurately predicted the overall trend of steady-state stress-strain behavior of SnAgCu and SnAgCuCe solders for the temperature ranges from 25℃ to 150 ℃, and the strain rate ranges from 0.01 s^-1 to 0.001 s ^-1. It is concluded that the Anand model can be applied for representing the inelastic deformation behavior of solders at high homologous temperature and can be recommended for finite element simulation of the stress-strain response of lead free soldered joints. Based on the Anand model, the investigations of thermo-mechanical of SnAgCu and SnAgCuCe soldered joints in fine pitch quad flat package by finite element code were done under thermal cyclic loading, it is found that the reliability of SnAgCu soldered joints can be improved remarkably with addition of rare earth Ce. The results may provide a theory guide for developing constitu

关键词： Anand equations constitutive relations SnAgCuCe solders rare earth reliability

Effect of Thermal Cycling on Properties and Microstructure of SnAgCuCe Soldered Joints in QFP Devices

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Chinese Journal of Mechanical Engineering 2011年第4期24卷 561-566页

作者： ZHANG Liang xue songbai GAO Lili ZENG Guang YU Shenglin SHENG Zhong College of Materials Science and Technology Nanjing University of Aeronautics and Astronautics Nanjing 210016 China School of Mechanical ＆ Electrical Engineering Xuzhou Normal University Xuzhou 221116 China The 14th Research Institute China Electronics Technology Group Corporation Nanjing 210013 China

Increasing global concern about the environment is bringing regulatory （European directives） and consumer （＂green products＂） pressure on the electronics industry in Europe and Japan to reduce or completely eliminate the use of lead （Pb） in products. Among all lead-free solder alloys, SnAgCu solder system, which has better thermo-mechanical properties compared with those of SnPb solder, is proven to be one of the promising candidates for electronic assembly. Previous work also revealed that adding a small amount of rare earth Ce into SnAgCu solder can visibly improve the properties and inhibit the excessive growth of the intermetallic compound layer. Thermal fatigue properties of SnAgCuCe soldered joints in QFP devices under thermal conditions have been investigated by finite element method and experiments. Based on creep model of low stress and high stress, corresponding creep subroutine was established for simulating the stress and strain response of SnAgCuCe soldered joint from -55 ℃ to 125 ℃, and fatigue life was calculated using creep fatigue life prediction equation. Moreover, thermal cycling experiments were conducted, the experimental results were found to be close to the simulated results. In addition, the tensile force of SnAgCuCe soldered joints decreased with increasing number of thermal cycles, and the fracture mechanism transformed from toughness fracture to brittle intergranular fracture. Moreover the tensile force changes and fracture microstructure evolution could benefit the quantitative evaluations of the mechanical performances of lead-free soldered joints under thermal cycling loadings.

关键词： finite element method creep equation thermal cycling fatigue life

Sn和Ce元素复合添加对BAg5CuZn钎料钎缝组织与性能影响

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焊接学报 2024年第4期45卷 101-108,I0009页

作者：胡岭余丁坤卜永周罗庆澄薛松柏杭州华光焊接新材料股份有限公司杭州311107 南京航空航天大学材料科学与技术学院南京210016

研究了Sn和Ce元素复合添加对低银BAg5CuZn钎料熔化特性、铺展性能、钎缝组织及钎焊接头力学性能的影响.结果表明,随着低银钎料中Sn和Ce元素的复合添加,钎料的固、液相线温度显著降低,钎料在母材上的铺展面积增大,但当添加的Ce元素含量高... 详细信息

研究了Sn和Ce元素复合添加对低银BAg5CuZn钎料熔化特性、铺展性能、钎缝组织及钎焊接头力学性能的影响.结果表明,随着低银钎料中Sn和Ce元素的复合添加,钎料的固、液相线温度显著降低,钎料在母材上的铺展面积增大,但当添加的Ce元素含量高于0.15%(质量分数)时,Ce元素会恶化钎料的铺展性能.适量的Sn和Ce元素的添加可以显著改善BAg5CuZn钎料钎缝的显微组织,当添加Sn和Ce元素含量分别达到2%和0.15%时,钎缝组织明显细化且分布最为均匀.然而,钎料中Ce元素添加量过多时,会倾向于Ag和Sn元素形成复杂的金属间化合物,并在组织晶界处析出,而使得钎缝组织的均匀性显著恶化.当钎料中的Sn和Ce元素含量分别为2%和0.15%时,其钎焊接头抗剪强度达到最大值495 MPa,相比于BAg5CuZn钎料钎焊的接头抗剪强度提高了23.1%.

关键词：低银钎料显微组织熔化特性铺展性能力学性能

Effects of Ga,Al,Ag,and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solder

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Rare Metals 2009年第6期28卷 600-605页

作者： WANG Hui xue songbai ZHAO Feng CHEN Wenxue College of Materials Science and Technology Nanjing University of Aeronautics andAstronautics Nanjing 210016 China Department of Materials Loughborough University Leicestershire LEII 3TU UK

An orthogonal method was used to evaluate the effects of Ga, Al, Ag, and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solders by wetting balance method. The results show that the optimal loading of Ga, Al, Ag, and Ce was 0.2 wt.%, 0.002 wt.%, 0.25 wt.%, and 0.15 wt.%, respectively. Intermetallic compounds （IMCs） formed at the interface between Sn-9Zn-0.2Ga-0.002Al-0.25Ag- 0.15Ce solder and Cu substrate were investigated by scanning electron microscope （SEM） and energy dispersive spectroscopy （EDS） analysis. The SEM images illustrate that the IMCs can be divided into two portions from the substrate side to the solder side： a planar CusZns layer and an additional continuous scallop-like AgZn3 layer. The EDS analysis also shows that Ga segregates in the solder abutting upon the interface. X-ray photoelectron spectroscopy （XPS） and Auger electron spectroscopy （AES） of the surface components of Sn-9Zn-0.2Ga-0.002Al- 0.25Ag-0.15Ce solder indicate that Al aggregates at the surface in the form of Al203 protective fdm, which prevents the further oxidation of the solder surface. On the other hand, Ce aggregates at the subsurface, which may reduce the surface tension of the solder and improve the wettability in consequence.

关键词： metallography lead-free solder wetting balance method wettability intermetallic compounds

Ag-CuO-NiO-LiAlSiO_(4)复合钎料空气反应钎焊GH3128/Al_(2)O_(3)接头组织及性能

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材料导报 2024年第2期38卷 157-162页

作者：陈恩光苏新清薛松柏陈旭东傅仁利张笑天程波王长虹王明伟南京航空航天大学材料科学与技术学院南京211106 上海无线电设备研究所上海200090 中国电子科技集团公司第四十九研究所哈尔滨150000

以Ag-CuO-NiO-LiAlSiO_(4)复合钎料对GH3128高温合金与Al_(2)O_(3)陶瓷进行空气反应钎焊(RAB)连接,研究了NiO和LiAlSiO_(4)添加量对钎焊接头显微结构和力学性能的影响,分析了接头的界面微观结构及其形成机制。结果表明,钎焊过程中,GH312... 详细信息

以Ag-CuO-NiO-LiAlSiO_(4)复合钎料对GH3128高温合金与Al_(2)O_(3)陶瓷进行空气反应钎焊(RAB)连接,研究了NiO和LiAlSiO_(4)添加量对钎焊接头显微结构和力学性能的影响,分析了接头的界面微观结构及其形成机制。结果表明,钎焊过程中,GH3128合金表面生成了包括CuCrO_(4)内氧化层和NiO外氧化层的复合氧化反应层,Al_(2)O_(3)陶瓷表面生成了以CuAl_(2)O_(4)为主要成分的界面层。NiO的添加明显改善了复合钎料在合金侧的润湿性,而锂霞石(LiAlSiO_(4))的添加减小了钎缝与母材间的热失配,极大地改善了键合接头的连接性能。最终,使用含0.3%NiO(质量分数)和4%LiAlSiO_(4)(质量分数)的Ag-10%CuO复合钎料钎焊GH3128合金和Al_(2)O_(3)陶瓷,获得了61.8 MPa的最大剪切强度。此时,接头界面结构为GH3128/CuCrO_(4)+CrNi3+NiO+CuO/Ag+CuO+LiAlSiO_(4)/CuAl_(2)O_(4)/Al_(2)O_(3)。

关键词：空气反应钎焊氧化铝陶瓷 GH3128合金复合钎料界面组织力学性能

Mechanical Properties of QFP Joints Soldered with SnAgCu and SnPb Solders

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Chinese Journal of Mechanical Engineering 2011年第4期24卷 596-600页

作者： xue Peng xue songbai ZENG Guang ZHANG Liang DAI Wei College of Materials Science and Technology Nanjing University of Aeronautics and Astronautics Nanjing 210016 China

With the development of lead-free solder alloys, the investiagtion focusing on the relibility of lead-free solders are essential. Since the reliability database of lead-free solder joints needs to be further supplied, the creep behavior of SnAgCu soldered joints on Quad Flat Package （QFP） devices under thermo cycling load are studied in this paper, compared to conventional SnPb solder, by finite element simulation based on Garofalo-Arrhenius creep model. Meanwhile, the mechanical properties of SnAgCu and SnPb soldered joints in the pitches of QFP devices are also carried out by means of tensile test. The results indicate that the values of strain and stress of SnAgCu soldered joints were all smaller than those of SnPb under thermal cycling, and the tensile strength of the joints soldered with SnAgCu solder was higher than that of SnPb, which means the reliability of the joints soldered with SnAgCu solder is better than SnPb soldered joints. As the fracture surface morphology of the soldered joints compared, SnAgCu soldered joint presented ductile fracture, while the fracture mechanism of SnPb solder joints displayed both brittle and ductile fracture. Above all, the experimental results is in accord with that of simulation, which will provide guidance for reliability study and application of lead-free solders.

关键词： creep model finite element analysis Quad flat package （QFP） devices mechanical properties

Effect　of　chemical　metallurgical　factors　on　contents　of　S　and　P　in　weld　metal　during　SAW

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China Welding 1996年第1期5卷 22-27页

作者： xue songbai YE Donglin HAO Heming and LIU Wei(sineior engineer,Harbin Research Institute of Welding. Harbin. 150080.) *** Harbin Research Institute of Welding Harbin 150080

The mechanism of dephosphization. and desulphurization in melting pool during submerged are welding has been investigated by experiments and theoretical analyses. it is found that the dephosphorization and desulphurization are mainly done by the metallurgical reactions of forming phosphates and sulphates respectively.and there is a limit for the dephosphorization and desulphurization in the melting pool. The limit value depends on the basicity of flux as well as the contents of phosphorus and sulphur in the wire and the base metal. For high basicity fluxes of B1≥2.5, the limit value of sulphur in weld metal can be lower than in the wire or can be close tO that in the flux according to the content of sulphur in wire or flux. and the limit value of phosphorus is about 0.010% ±0. 002.

关键词： submerged are welding flux. metallurgy dephosphorization. Desulfurization

EFFECTS OF LEAD WIDTHS AND PITCHES ON RELIABILITY OF QUAD FLAT PACKAGE(QFP)SOLDERED JOINTS

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Chinese Journal of Mechanical Engineering 2007年第4期20卷 40-43页

作者： xue songbai WU Yuxiu HAN Zongjie WANG Jianxin College of Materials Science and Technology Nanjing University of Aeronautics and Astronautics Nanjing 210016 China

The finite element method（FEM） is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum simulation for QFP devices is also researched. The results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths, while the reliability of the soldered joints reduces. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn＇t decrease completely with the increasing of lead pitches, a minimum value of the maximum equivalent stress values exists in all the curves. Under this condition the maximum equivalent stress of the soldewed joints is relatively the least, the reliability of soldered joints is high and the assembly is excellent. The simulating results indicate the best parameter： The lead width is 0.2 mm and lead pitch is 0.3 mm （the distance between two leads is 0.1 mm）, which are benefited for the micromation of QFP devices now. The minimum value of the maximum equivalent stress of soldered joints exists while lead width is 0.25 mm and lead pitch is 0.35 mm （the distance between two leads is 0.1 mm）, the devices can serve for a long time and the reliability is the highest, the assembly is excellent. The simulating results also indicate the fact that the lead width is 0.15 mm and lead pitch is 0.2 mm maybe the limit of QFP, which is significant for the high lead count and micromation of assembly.

关键词： Quad flat package （QFP） Maximum equivalent stress Soldered joints Assembly optimization Finite element method

Reliability Evaluation of QFN Devices Soldered Joints with Creep Model

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Chinese Journal of Mechanical Engineering 2011年第3期24卷 428-432页

作者： JI Feng xue songbai ZHANG Liang GAO Lili SHENG Zhong DAI Wei College of Materials Science and Technology Nanjing University of Aeronautics and Astronautics Nanjing 210016 China

The solder joint reliability of quad flat non-lead （QFN） package,which has become very popular over the past few years,has received intense interest.The finite element method （FEM） is essential to evaluate the reliability of QFN device.In this paper,Garofalo-Arrheninus model was implemented to simulate the deformation of QFN soldered joints.Equivalent creep strain of the soldered joints was calculated by means of finite element analyses,and was used to evaluate the reliability of QFN packages.It is found that the critical soldered joint of QFN is located the package corner while the maximum creep strain is obtained at the top interface of peripheral soldered joint.The creep strain is provided with periodicity and additivity as the thermal cycling.Nonlinear analysis of QFN package with different lead counts was presented as well,in which the phenomenon that the value of induced creep strain arise as the package size decreasing is noted.Moreover,SnPb and two lead-free solders,namely,Sn3.5Ag/Sn3.8Ag0.7Cu,were both taken into consideration.Simulated results indicate that the creep strain value of lead-free soldered joints is lower than that of SnPb soldered joints,which can be attributed to the difference of stiffness and coefficient of thermal expansion among three solders.Garofalo-Arrheninus model is used to calculate the creep strain of the QFN device for the first time in this study.The results provide an important basis for evaluating the reliability of QFN package.

关键词： finite element analyses reliability lead-free solder creep strain