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Influence of the Trajectory of the Abrasive Pin on the Grinding Process of Glassy Ceramics

材料科学与工程（中英文版） 2010年第4期4卷 19-29页

作者： Fabio Jose Pinheiro Sousa Jan Christian Aurich Orestes Estevam Alarcon walter lindolf weingartner Department of Mechanical and Process Engineering The Institute for Manufacturing Technology and Production Systems University of Kaiserslautern Kaiserslautern D-67653 Germany Department of Mechanical Engineering Federal University of Santa Catarina Florianopolis CEP 88040-900 SC Brazil

This study addresses the effect of the radius along which abrasive particles scratch the surface on the removal rate during the polishing process of two different commercial glassy materials: a float glass and a porcelain stoneware tile. In both case a cylindrical pin containing particles of aluminium oxide was used as abrasive and abundant tap water was used lubricant. An epitrochoid curve was selected to be performed by the abrasive pin. Along the trajectory the scratching radius has continuously varied from 33 up to 46 cm in a periodic fashion. The occurrence of scratches having a particular scratching radius could be quantitatively estimated with the aid of computational simulations, which were in turn based on the kinematic parameters adopted for the polishing process. A very similar pattern was attained between the measured profiles of removal depth measured by profilometry and the simulated profiles of cumulative number of abrasive contacts, and this similarity was evaluated considering the damaged area close to the scratching edges.

关键词：磨料磨削工艺陶瓷弹道影响半径抛光工艺计算模拟剖面测量

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