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Repair of automotive bumpers and bars with modified friction stir welding

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Journal of Central South University 2020年第8期27卷 2239-2248页

作者： ranvijay kumar Rupinder SINGH I P S AHUJA University Center for Research and Development Chandigarh UniversityMohali 140413India Department of Production Engineering Guru Nanak Dev Engineering CollegeLudhiana 141106India Department of Mechanical Engineering Punjabi UniversityPatiala 147002India Department of Mechanical Engineering National Institute of Technical Teachers Training and ResearchChandigarh 160019India

This study reports the investigations for repair of thermoplastic based automotive bumpers and bars with modified friction stir welding(MFSW)*** MFSW,consumable tool of polyamide6(PA6)composite has been used for joining of acrylonitrile butadiene styrene(ABS)*** dissimilar thermoplastics were processed for maintaining a useful range of melt flow properties followed by preparation of feed stock filament for fused deposition modeling(FDM)process through screw ***,3D printed PA6 based consumable rapid tool(RT)was prepared for *** joints prepared were subjected to flexural,hardness,morphological and thermal *** study has suggested the that maximum mechanical strength was obtained for sample welded at 1400 r/min,50 mm/min transverse speed and 3 mm plunge depth,whereas the minimum mechanical strength was obtained for sample welded at 1000 r/min,30 mm/min transverse speed and 2 mm plunge *** results are also supported with thermal analysis and photomicrographs.

关键词： dissimilar thermoplastics flexural properties modified FSW thermal imaging

Rheological,mechanical,thermal,tribological and morphological properties of PLA-PEKK-HAp-CS composite

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Journal of Central South University 2021年第6期28卷 1615-1626页

作者： GURCHETAN Singh ranvijay kumar RUPINDER Singh MD MUSTAFIZUR Rahman SEERAM Ramakrishna Department of Production Engineering Guru Nanak Dev Engineering CollegeLudhiana 141106India Department of Mechanical Engineering University Center for Research and DevelopmentChandigarh UniversityMohali 140413India Department of Mechanical Engineering National Institute of Technical Teachers Training and ResearchChandigarh 160019India Department of Mechanical Engineering Universiti Malaysia PahangPahang 26600Malaysia Department of Mechanical Engineering National University of Singapore119077Singapore

The present study reports investigations on rheological,mechanical,thermal,tribological and morphological properties of feedstock filaments prepared with polylactic acid-polyether ketone ketone-hydroxyapatite-chitosan(PLA-PEKK-HAp-CS)composite for 3D printing of functional *** study consists of a series of melt processing operations on melt flow index(MFI)setup as per ASTM D-1238 for melt flow certainty followed by fixation of reinforcement composition/proportion as 94%PEKK-4%HAp-2%CS(B)by mass in PLA matrix(A).The blending of reinforcement and preparation of feedstock filament for fused deposition modeling(FDM)set up has been performed on commercial twin screw extruder(TSE).The results of study suggest that feedstock filaments prepared with blend of 95%A-5%B(by mass)at 200℃processing temperature and 100 r/min rotational speed on TSE resulted into better tensile properties(35.9 MPa peak strength and 32.3 MPa break strength)with 6.24%surface porosity,42.67 nm surface roughness(R_(a))and acceptable heat capacity(2.14 J/g).However as regards to tribological behavior,the minimum wear of 316μm was observed for sample with poor tensile *** regards to crash application for scaffolds the maximum toughness of 1.16 MPa was observed for 85%A-15%B(by mass)at 200℃processing temperature and 150 r/min rotational speed on TSE.

关键词： polylactic acid-polyether ketone ketone-hydroxyapatite-chitosan(PLA-PEKK-HAP-CS) twin screw extruder(TSE) differential scanning calorimetry(DSC) melt flow index(MFI) wear test

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金砖国家合作机制与中印关系

南亚研究 2011年第3期 86-99,124页

作者：辛仁杰孙现朴云南大学国际关系研究院

进入21世纪以来,金砖国家经济发展迅猛,特别是金融危机后,金砖国家经济的强势崛起对世界经济政治产生了重要影响,随着金砖国家合作逐渐机制化,它必将对国际政治格局产生深远影响。本文分析了金砖国家机制的特点和西方国家对金砖国家合... 详细信息

进入21世纪以来,金砖国家经济发展迅猛,特别是金融危机后,金砖国家经济的强势崛起对世界经济政治产生了重要影响,随着金砖国家合作逐渐机制化,它必将对国际政治格局产生深远影响。本文分析了金砖国家机制的特点和西方国家对金砖国家合作机制的态度,在此基础上对印度支持金砖国家机制的缘由进行了阐述,最后分析了金砖国家机制对中印关系的促进作用。

关键词：金砖国家印度中印关系

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印度科技外交模式、特点和启示

南亚研究 2019年第1期 82-100,147,148页

作者：孙海燕辛仁杰云南大学国际关系研究院云南省科学技术院云南民族大学

科技对国际关系的作用和影响可以追溯到18世纪,以科技为内容的国际合作经历了技术扩散期、技术援助期、技术转移期、国际科技合作期和科技外交期。科技外交是21世纪科技和国际关系持续发生作用的新概念,包括"服务外交的科技合作"以及"... 详细信息

科技对国际关系的作用和影响可以追溯到18世纪,以科技为内容的国际合作经历了技术扩散期、技术援助期、技术转移期、国际科技合作期和科技外交期。科技外交是21世纪科技和国际关系持续发生作用的新概念,包括"服务外交的科技合作"以及"服务科技合作的外交",具有外交功能和创新功能。本文重点研究分析科技外交的外交功能,以为改善中印关系提供参考。对于如何推动中印科技外交,本文通过研究分析印度科技外交的模式与特点得出以下几点启示:一是如果实施针对南亚地区的公共治理和技术援助,将会满足印度维护国家安全、稳定南亚的需求,并推进中国"一带一路"倡议在南亚的发展;二是如果积极推进中印低技术领域的技术转移和社会民生领域的技术协同,将会受到印度官方和民间的欢迎,有助于改善两国关系;三是印度具有通过科技人员交流改善外交关系的经验和基础,将其应用到中印关系治理中将能够增进两国人民的理解和互信,可为加强两国关系提供民众基础。

关键词：印度科技外交中印关系国际科技合作