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Optimal Feature Extraction Using Greedy Approach for Random Image Components and Subspace Approach in Face Recognition

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Journal of Computer Science & Technology 2013年第2期28卷 322-328页

作者： Mathu Soothana S.Kumar Retna Swami muneeswaran karuppiah Department of Information Technology Noorul Islam University Department of Computer Science and Engineering Mepco Schlenk Engineering College

An innovative and uniform framework based on a combination of Gabor wavelets with principal component analysis （PCA） and multiple discriminant analysis （MDA） is presented in this paper. In this framework, features are extracted from the optimal random image components using greedy approach. These feature vectors are then projected to subspaces for dimensionality reduction which is used for solving linear problems. The design of Gabor filters, PCA and MDA are crucial processes used for facial feature extraction. The FERET, ORL and YALE face databases are used to generate the results. Experiments show that optimal random image component selection （ORICS） plus MDA outperforms ORICS and subspace projection approach such as ORICS plus PCA. Our method achieves 96.25%, 99.44% and 100% recognition accuracy on the FERET, ORL and YALE databases for 30% training respectively. This is a considerably improved performance compared with other standard methodologies described in the literature.

关键词： face recognition multiple discriminant analysis optimal random image component selection principal com- ponent analysis recognition accuracy

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Evaluation of the Capacitance and Charge Distribution for Conducting Bodies by Circuit Modelling

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Circuits and Systems 2016年第4期7卷 280-291页

作者： Dhamodaran muneeswaran Dhanasekaran Raghavan Department of Electronics and Communication Engineering Syed Ammal Engineering College Ramanathapuram India Department of Electrical and Electronics Engineering Syed Ammal Engineering College Ramanathapuram India

This paper presents a numerical analysis for computation of free space capacitance of different arbitrarily shaped conducting bodies based on the finite element method with triangular subsection modeling. Evaluation of capacitance of different arbitrary shapes is important for the electrostatic analysis. Capacitance computation is an important step in the prediction of electrostatic discharge which causes electromagnetic interference. We specifically illustrated capacitance computation of electrostatic models like unit cube, rectangular plate, triangular plate, T-shaped plate, sphere and two touching spheres. Numerical data on the capacitance of conducting objects are presented. The results are compared with other available results in the literature. We used the COMSOL Multiphysics software for the simulation. The models are designed in three-dimensional form using electrostatic environment and can be applied to any spacecraft circuit modeling design. The findings of this study show that the finite element method is a more accurate method and can be applied to any circuit modeling design.

关键词： Capacitance Spacecraft Circuit Modeling Electrostatic Analysis Electrostatic Discharge Finite Element Method

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Surface defects incorporated diamond machining of silicon

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International Journal of Extreme Manufacturing 2020年第4期2卷 57-73页

作者： Neha Khatri Borad M Barkachary B muneeswaran Rajab Al-Sayegh Xichun Luo Saurav Goel Optical Devices&System Division CSIR-CSIOSector 30Chandigarh160030India Department of Mechanical Engineering Jorhat Institute of Science&TechnologyJorhat Assam 785010India Fenner Conveyor Belting Pvt.Ltd. Dindigul Road NagriMaduraiVadipatti Taluk 625221India College of Engineering Northern Border UniversityArar 91431Saudi Arabia Centre for Precision Manufacturing DMEMUniversity of StrathclydeGlasgow G11XQUnited Kingdom School of Engineering London South Bank University103 Borough RoadLondon SE10AAUnited Kingdom EPSRC Centre for Doctoral Training in Ultra-Precision Engineering University of Cambridge and Cranfield UniversityCranfieldUnited Kingdom School of Aerospace Transport and ManufacturingCranfield UniversityBedfordshire MK430ALUnited Kingdom Department of Mechanical Engineering Shiv Nadar UniversityGautam Budh Nagar 201314India

This paper reports the performance enhancement benefits in diamond turning of the silicon wafer by incorporation of the surface defect machining(SDM)*** hybrid micromachining methods usually require additional hardware to leverage the added advantage of hybrid technologies such as laser heating,cryogenic cooling,electric pulse or ultrasonic elliptical *** SDM method tested in this paper does not require any such additional baggage and is easy to implement in a sequential micro-machining *** paper made use of Raman spectroscopy data,average surface roughness data and imaging data of the cutting chips of silicon for drawing a comparison between conventional single-point diamond turning(SPDT)and SDM while incorporating surface defects in the(i)circumferential and(ii)radial *** 3D finite element analysis(FEA)was performed to analyse the cutting forces and the evolution of residual stress on the machined *** was found that the surface defects generated in the circumferential direction with an interspacing of 1 mm revealed the lowest average surface roughness(Ra)of 3.2 nm as opposed to 8 nm Ra obtained through conventional SPDT using the same cutting *** observation of the Raman spectroscopy performed on the cutting chips showed remnants of phase transformation during the micromachining process in all *** was used to extract quantifiable information about the residual stress as well as the sub-surface integrity and it was discovered that the grooves made in the circumferential direction gave the best machining *** information being reported here is expected to provide an avalanche of opportunities in the SPDT area for low-cost machining solution for a range of other nominal hard,brittle materials such as SiC,ZnSe and GaAs as well as hard steels.

关键词： surface defect machining silicon finite element analysis surface roughness

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