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载脂蛋白B48残余脂蛋白与青少年心脏代谢风险增加相关

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中华高血压杂志 2020年第5期28卷 414-414页

作者：周卫(译) 叶鹏(审校) Krysa JA Vine DF Beilin LJ Burrows S Huang RC mori ta Proctor SD 不详

心血管病通常始发于青年,并因肥胖和代谢综合征而加重。而载脂蛋白B(apolipoprotein B,apoB)-残余胆固醇被认为是导致心血管病的一个主要因素。空腹血浆apoB48可用作肠道残余胆固醇以及餐后血脂异常的生物标志物。成年人的空腹血浆apoB4... 详细信息

心血管病通常始发于青年,并因肥胖和代谢综合征而加重。而载脂蛋白B(apolipoprotein B,apoB)-残余胆固醇被认为是导致心血管病的一个主要因素。空腹血浆apoB48可用作肠道残余胆固醇以及餐后血脂异常的生物标志物。成年人的空腹血浆apoB48升高与心脏代谢风险因素和肥胖密切相关,而在青少年中,相关数据则较少。本研究旨在通过测量空腹血浆apoB48探究其与青少年心脏代谢危险因素的关系。

关键词：心脏代谢心血管病载脂蛋白B 餐后血脂代谢综合征残余胆固醇生物标志物代谢危险因素

载脂蛋白B48残余脂蛋白与青少年心脏代谢风险增加相关

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中华高血压杂志 2020年第6期28卷 543-543页

作者：周卫(译) 叶鹏(摘/审校) Krysa JA Vine DF Beilin LJ Burrows S Huang RC mori ta Proctor SD 不详

心血管病通常始发于青年,并因肥胖和代谢综合征而加重。而载脂蛋白B(apolipoprotein B,apoB)残余胆固醇被认为是导致心血管病的一个主要因素。空腹血浆apoB48可用作肠道残余胆固醇以及餐后血脂异常的生物标志物。成年人的空腹血浆apoB4... 详细信息

心血管病通常始发于青年,并因肥胖和代谢综合征而加重。而载脂蛋白B(apolipoprotein B,apoB)残余胆固醇被认为是导致心血管病的一个主要因素。空腹血浆apoB48可用作肠道残余胆固醇以及餐后血脂异常的生物标志物。成年人的空腹血浆apoB48升高与心脏代谢风险因素和肥胖密切相关,而在青少年中,相关数据则较少。本研究旨在通过测量空腹血浆apoB48并探究其与青少年心脏代谢危险因素的关系。

关键词：心脏代谢心血管病载脂蛋白B 餐后血脂代谢综合征残余胆固醇生物标志物代谢危险因素

补充墨蝶呤和一氧化氮合酶抑制物对糖皮质激素诱导的高血压的影响

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中华高血压杂志(中英文) 2010年第8期18卷 797-797页

作者： Thida M Earl J Zhao Y Wang H Tse CS Vickers JJ Sutton M Ong SL mori ta Croft KD Whitworth JA Zhang Y 黄晓斌

Cytomegalovirus-associated gastric ulcer:A side effect of steroid injections for pyloric stenosis

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World Journal of Gastroenterology 2013年第7期19卷 1143-1146页

作者： Hirohito mori Shintaro Fujihara Noriko Nishiyama Hideki Kobara Makoto Oryu Kiyohito Kato Kazi Rafiq Tsutomu Masaki Departments of Gastroenterology and Neurology Kagawa Medical University School of MedicineKagawa 761-0793Japan Departments of Pharmacology Kagawa Medical University School of MedicineKagawa 761-0793Japan

The local injection of triamcinolone acetonide(ta) is effective in preventing pyloric stenosis and deformity following large endoscopic submucosal dissection(ESD).However,because of its long-acting nature,ta can induce long-term local immunosuppression and subsequent adverse *** report a case of a cytomegalovirus(CMV) ulcer that formed only at the ta local injection site.A 68-year-old man underwent ESD to treat early gastric cancer that formed over the *** lesion extended to the duodenum,and an artificial ulcer covered more than two-thirds of the circumference of the *** prevent pyloric stenosis,ta was locally injected into the ulcer *** day 12,a deeper ulcer 10 mm in diameter was discovered in the center of the post-ESD *** revealed large cells with intranuclear inclusion bodies,which stained positive for the anti-CMV *** ta injections are useful,however,CMV ulcer might occur as adverse events.

关键词： Pyloric stenosis Local triamcinolone acetonide injection Local immunosuppression Cytomegalovirus-associated ulcer Adverse events

IMPROVEMENT IN PARAMETRIC AND RELIABILITY PERFORMANCE OF 90NM DUAL-DAMASCENE INTERCONNECTS USING AR+PUNCHTHRU PVD BARRIER PROCESS Reprinted with permission as presented at SEMICON China 2005

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集成电路应用 2005年第9期22卷 43-49页

作者： N.Kumar S.Chu D.L.Diehl K.Maekawa K.mori K.Kobayashi M.Yoneda Applied Materials Inc. Thin Films Group Applied Materials Japan Inc. Thin Films Group Process Development Department Process Technology Development DivisionProduction and Technology UnitRenesas Technology Corp.

As interconnects shrink beyond 90nm node, the presence of etch residues can createhigh via resistance and void nucleation during stress migration (SM) testing. Physical Ar+ preclean is effectivein removing residues, but early SM failures have been seen due to Cu resputter from underlying *** preclean methods show promise in reducing CuOx and cleaning Si, N, F, C,O etch residues inpresence of H+, H* species. In this paper, reactive preclean and PVD PunchThru process (deposit-etch-deposit) is proposed as solution to conventional *** PunchThru process reduces via resistance, improves SM and protects dual-damascene beveland unlanded vias from Cu diffusion by presence of thin ta deposition step. In addition, the U-shaped interface,which minimizes electron crowding and localized heating effects, increases the mean time to failureby electromigration. Consistent, repeatable blanket film property and good parametric electrical test resultshave proven the production worthiness of this process.

关键词：集成电路芯片制造工艺封装技术