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24th International Papillomavirus Conference and Clinical Workshop

作者： Johanna Kullander martin forsberg Joakim Dillner Lund University Lund University Lund University

＜正＞A novel HPV type,FA137,was isolated from a squamous cell carcinoma（SCC）with multiple displacement amplification（MDA） using primers generic to any HPV The complete genome of FA137 was 7346 bp with a typical genomic organization The most closely related type was HPV4,but with only 64.4% similarity in the ***,FA137 belongs to a new species within the genus Gamma.

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Integrating MEMS and ICs

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Microsystems & Nanoengineering 2015年第1期1卷 165-180页

作者： Andreas C.Fischer Fredrik forsberg martin Lapisa Simon J.Bleiker Göran Stemme Niclas Roxhed Frank Niklaus Department of Micro and Nanosystems School of Electrical EngineeringKTH Royal Institute of TechnologySE-10044 StockholmSweden

The majority of microelectromechanical system(MEMS)devices must be combined with integrated circuits(ICs)for operation in larger electronic *** MEMS transducers sense or control physical,optical or chemical quantities,ICs typically provide functionalities related to the signals of these transducers,such as analog-to-digital conversion,amplification,filtering and information processing as well as communication between the MEMS transducer and the outside ***,the vast majority of commercial MEMS products,such as accelerometers,gyroscopes and micro-mirror arrays,are integrated and packaged together with *** are a variety of possible methods of integrating and packaging MEMS and IC components,and the technology of choice strongly depends on the device,the field of application and the commercial *** this review paper,traditional as well as innovative and emerging approaches to MEMS and IC integration are *** include approaches based on the hybrid integration of multiple chips(multi-chip solutions)as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration *** are important technological building blocks for the‘More-Than-Moore’paradigm described in the International Technology Roadmap for *** this paper,the various approaches are categorized in a coherent manner,their merits are discussed,and suitable application areas and implementations are critically *** implications of the different MEMS and IC integration approaches for packaging,testing and final system costs are reviewed.

关键词： cofabrication platforms integrated circuits(ICs) microelectromechanical system(MEMS) More-Than-Moore multichip modules(MCMs) system-in-package(SiP) system-on-chip(SoC) three-dimensional(3D)heterogeneous integration

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