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Analysis, Implementation, and Application of Acoustic and Seismic Arrays

自动化学报 2006年第6期32卷 929-937页

作者： STAfSUDD J Z ASGARI S ALI A M CHEN C E HUDSON R E lorenzelli f YAO K TACIROGLU E Electrical Engineering Department Los Angeles CA 90095 USA Civil and Environmental Engineering Department Los Angeles CA 90095 USA

In this paper, we consider the analysis, implementation, and application of wideband sources using both seismic and acoustic sensors. We use the approximate maximum likelihood (AML) algorithm to perform acoustic direction of arrival (DOA). for non-uniform noise spectra, whitening filtering was applied to the received acoustic signals before the AML operation. for short-range seismic DOA applications, one method was based on eigen-decomposition of the covariance matrix and a second method was based on surface wave analysis. Two well-known optimization schemes were used to estimate the source locations from the estimated DOAs at sensors of known locations. Experimental estimation of the DOAs and resulting localizations using the acoustic and seismic signals generated by striking a heavy metal plate by a hammer were reported.

关键词： Acoustic array seismic array beamforming DOA localization

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Ultra-thin chips for high-performance flexible electronics

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npj flexible Electronics 2018年第1期2卷 50-66页

作者： Shoubhik Gupta William Taube Navaraj Leandro lorenzelli Ravinder Dahiya Bendable Electronics and Sensing Technologies(BEST)Group University of GlasgowGlasgow G128QQUK Micro-Systems Technology Group Fondazione Bruno KesslerTrento 38123Italy

flexible electronics has significantly advanced over the last few years,as devices and circuits from nanoscale structures to printed thin films have started to ***,the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic *** is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics,which is currently the industry standard for high-performance,is planar and the brittle nature of silicon makes bendability *** this reason,the ultra-thin chips from silicon is gaining *** review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon *** comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical,thermal,optical and mechanical properties,stress modelling,and packaging *** underpinning advances in areas such as sensing,computing,data storage,and energy have been discussed along with several emerging applications(e.g.,wearable systems,m-Health,smart cities and Internet of Things etc.)they will *** paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon;but it can be of broad interest to everyone working in the field of flexible electronics.

关键词： performance electronics everyone

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