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Additive direct-write microfabrication for MEMS： A review

Frontiers of Mechanical Engineering 2017年第4期12卷 490-509页

作者： kwok siong teh School of Engineering San Francisco State University San FranciscoCA 94132 USA

Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from compu- ter-generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techni- ques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept- to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the maker movement. The technological premises of all direct-write additive manufacturing are identical--converting computer generated three-dimen- sional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into three- dimensional solid objects in key differences between the a layer-by-layer format. The various additive manufactur- ing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry--in terms of cost, time and training--for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equip- ment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to- prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive manufacturingtechnologies, it is possible to fa

关键词： direct-write additive manufacturing micro-fabrication MEMS

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Noninvasive fluid bubble detection based on capacitive micromachined ultrasonic transducers

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Microsystems & Nanoengineering 2023年第1期9卷 115-126页

作者： Jiawei Yuan Zhikang Li Qi Ma Jie Li Zixuan Li Yihe Zhao Shaohui Qin Xuan Shi Libo Zhao Ping Yang Guoxi Luo Xiaozhang Wang kwok siong teh Zhuangde Jiang State Key Laboratory for Manufacturing Systems Engineering International Joint Laboratory for Micro/Nano Manufacturing and Measurement TechnologiesXi’an Jiaotong University(Yantai)Research Institute for Intelligent Sensing Technology and SystemsXi’an Jiaotong University710049Xi’anChina School of Mechanical Engineering Xi’an Jiaotong University710049Xi’anChina Shandong Laboratory of Yantai Advanced Materials and Green Manufacturing 265503YantaiChina School of Mechanical and Electrical Engineering Shaanxi University of Science and TechnologyXi’an710049Xi’anChina School of Engineering San Francisco State UniversitySan FranciscoCA94132USA

Ultrasonic fluid bubble detection is important in industrial controls,aerospace systems and clinical medicine because it can prevent fatal mechanical failures and threats to life.However,current ultrasonic technologies for bubble detection are based on conventional bulk PZT-based transducers,which suffer from large size,high power consumption and poor integration with ICs and thus are unable to implement real-time and long-term monitoring in tight physical spaces,such as in extracorporeal membrane oxygenation(ECMO)systems and dialysis machines or hydraulic systems in aircraft.This work highlights the prospect of capacitive micromachined ultrasonic transducers(CMUTs)in the aforementioned application situations based on the mechanism of received voltage variation caused by bubble-induced acoustic energy attenuation.The corresponding theories are established and well validated using finite element simulations.The fluid bubbles inside a pipe with a diameter as small as 8 mm are successfully measured using our fabricated CMUT chips with a resonant frequency of 1.1 MHz.The received voltage variation increases significantly with increasing bubble radii in the range of 0.5–2.5 mm.Further studies show that other factors,such as bubble positions,flow velocities,fluid medium types,pipe thicknesses and diameters,have negligible effects on fluid bubble measurement,demonstrating the feasibility and robustness of the CMUT-based ultrasonic bubble detection technique.

关键词： bubble negligible mentioned

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