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Influence of processing history on microstructure， mechanical properties， and electrical conductivity of Cu-0.7Mg alloy

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Transactions of Nonferrous Metals Society of China 2024年

作者： Alireza KALHOR kinga rodak Marek TKOCZ Bartosz CHMIELA Ivo SCHINDLER ?ukasz POLOCZEK Krzysztof RADWA?SKI Hamed MIRZADEH Marian KAMPIK Faculty of Materials Engineering Silesian University of Technology V?B – Technical University of Ostrava Faculty of Materials Science and Technology Materials Research Group ?ukasiewicz Upper Silesian Institute of Technology School of Metallurgy and Materials Engineering College of Engineering University of Tehran Faculty of Electrical Engineering Silesian University of Technology

The effects of forward extrusion as well as extrusion combined with reversible torsion (KoBo extrusion)， followed by additional deformation via the MaxStrain module of the Gleeble thermomechanical simulator， on the microstructure， mechanical properties， and electrical conductivity of a Cu-0.7Mg (wt.%) alloy， were investigated in this work. The simulation results highlighted the critical influence of processing history in determining the equivalent strain distribution. The sample subjected to forward extrusion at 400 ℃and subsequent MaxStrain processing (FM sample)， possessed 76% lower grain size compared to the sample processed solely with MaxStrain (AM sample). Likewise， the KoBo-extruded and MaxStrain-processed sample (KM sample) exhibited 66% smaller grain size compared to the AM sample. Tensile test results revealed that the AM， FM， and KM samples， respectively， possessed 251%， 288%， and 360% higher yield strength， and 95%， 121%， and 169% higher tensile strength compared to the initial annealed alloy， as a result of grain refinement as well as deformation strengthening. Finally， the electrical conductivity measurements revealed that AM， FM， and KM samples， respectively， possessed electrical conductivity values of 37.9， 35.6， and 32.0 (MS/m)， which， considering their mechanical properties， makes them eligible to be categorized as high-strength and high-conductivity copper alloys.

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Effect of Compression with Oscillatory Torsion Processing on Structure and Properties of Cu

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Journal of Materials Science & Technology 2011年第11期27卷 1083-1088页

作者： kinga rodak Jacek Pawlicki Department of Materials Science Silesian University of Technology Department of Materials Technology Silesian University of Technology

The results presented in this study were concerned with microstructures and mechanical properties of poly- crystalline Cu subjected to plastic deformation by a compression with oscillatory torsion process. Different deformation parameters of the compression with oscillatory torsion process were adopted to study their effects on the microstructure and mechanical properties. The deformed microstructure was characterized quantitatively by electron backscattered diffraction （EBSD） and scanning transmission electron microscopy （STEM）. Mechanical properties were determined on an MTS QTest/10 machine equipped with digital image correlation. From the experimental results, processes performed at high compression speed and high torsion frequency are recommended for refining the grain size. The size of structure elements, such as average grain size （D） and subgrain size （d）, reached 0.42 μm and 0.30 μm, respectively, and the fraction of high angle boundaries was 35% when the sample was deformed at a torsion frequency f = 1.6 Hz and compression rate v= 0.04 mm/s. These deformation parameters led to an improvement in the strength properties. The material exhibited an ultimate tensile strength （UTS） of 434 MPa and a yield strength （YS） of 418 MPa. These values were about two times greater than those of the initial state.

关键词： Severe plastic deformation Copper Fine-grained microstructure Electronbackscattered diffraction (EBSD) Scanning transmission electronmicroscopy (STEM)

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