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Melting behavior and globular microstructure formation in semi-solid CoCrCuxFeNi high-entropy alloys

Journal of Materials Science & Technology 2020年第17期52卷 207-217页

作者： kaio niitsu campo Caio Chaussêde Freitas Leonardo Fanton Rubens Caram University of Campinas School of Mechanical EngineeringSPBrazil

High-entropy alloys can be compelling raw materials for semi-solid *** the present study,the influence of the Cu content on the melting behavior and semi-solid microstructure of CoCrCuxFeNi(x=0,1,2,3)alloys was ***-melted samples were cross-rolled at room temperature and then isothermally treated at 1175℃in the semi-solid state for 300 *** characterization showed that the alloys containing Cu were formed by two fcc ***,the increase in Cu content also led to an increase in the volumetric fraction of the Cu-rich *** solidification,this phase,which is the last to form,nucleates and epitaxially grows on the Cu-lean *** the studied CoCrCuFeNi alloys exhibited the same melting *** Cu-rich phase melts at approximately 1120℃,whereas the Culean phase melts at approximately 1350℃,providing a suitable processing temperature range of more than 200℃.The semi-solid microstructures were considerably refined and globular regardless of the alloy composition,being suitable for semi-solid ***,each fcc phase exhibited roughly the same composition under the different processing *** Cu content in the Cu-lean phase was approximately 10 at.%,while Co,Cr,Fe,and Ni were in an approximately equiatomic ***,the Cu content was between 80 at.%and 86 at.%in the Cu-rich *** isothermal treatment of the CoCrCu3FeNi alloy at a higher temperature(1300℃)only caused the globules to *** conclusion,this work showed that these alloys can be potential candidates for semi-solid processing.

关键词： Semi-solid processing Thixoforming High-entropy alloys Microstructure

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Microstructure and mechanical behavior of Ti−Cu alloys produced by semisolid processing

引用

Transactions of Nonferrous Metals Society of China 2022年第11期32卷 3578-3586页

作者： kaio niitsu campo Caio Chaussêde FREITAS Éder Sócrates Najar LOPES Suk-Chun MOON Rian DIPPENAAR Rubens CARAM School of Mechanical Engineering University of CampinasCampinasSPBrazil School of Mechanical MaterialsMechatronic and Biomedical EngineeringUniversity of WollongongWollongongNSWAustralia

The mechanical properties of Ti−Cu alloys processed via thixoforming were ***−Cu(25,27,and 29 wt.%Cu)ingots were produced via arc melting,homogenization at 950℃ for 24 h,and hot-forging at 900℃,followed by thixoforming at a speed of 8 mm/s after isothermal heat treatment at 1035℃ for 300 *** thixoformed alloys exhibited good mechanical strength,limited plasticity under tensile loading,and reasonable plasticity under compressive *** mechanical strength and plasticity decreased as the Cu content increased as a result of the increasing volume fraction of the peritectic Ti_(2)Cu phase(transformed liquid),which exhibited a lower strength and plasticity than theα+Ti_(2)Cu regions(transformed solid).These findings indicated that the trade-off between the mechanical properties and semisolid processability is largely governed by the Cu content.

关键词： semisolid processing thixoforming Ti−Cu alloys microstructure mechanical properties

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