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Processing of high-precision ceramic balls with a spiral V-groove plate

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Frontiers of Mechanical Engineering 2017年第1期12卷 132-142页

作者： Ming FENG Yongbo WU julong yuan Zhao PING Department of Machine InteUigence & Systems Engineering AkitaPrefectural University Akita 015-0055 Japan Ultra-Precision Machining Center Zhejiang University of TechnologyHangzhou 310014 China

As the demand for high-performance bearings gradually increases, ceramic balls with excellent proper- ties, such as high accuracy, high reliability, and high chemical durability used, are extensively used for high- performance bearings. In this study, a spiral V-groove plate method is employed in processing high-precision ceramic balls. After the kinematic analysis of the ball-spin angle and enveloped lapping trajectories, an experimental rig is constructed and experiments are conducted to confirm the feasibility of this method. Kinematic analysis results indicate that the method not only allows for the control of the ball-spin angle but also uniformly distributes the enveloped lapping trajectories over the entire ball surface. Experimental results demonstrate that the novel spiral V- groove plate method performs better than the conventional concentric V-groove plate method in terms of roundness, surface roughness, diameter difference, and diameter decrease rate. Ceramic balls with a G3-1evel accuracy are achieved, and their typical roundness, minimum surface roughness, and diameter difference are 0.05, 0.0045, and 0.105 μm, respectively. These findings confirm that the proposed method can be applied to high-accuracy and high-consistency ceramic ball processing.

关键词： bearing ceramic ball spiral V-groove,kinematic analysis trajectory

Optimization experiment on eccentric lapping of cylindrical rollers

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Nanotechnology and Precision Engineering 2018年第3期1卷 197-204页

作者： Jia Su julong yuan Sen Zhang Binghai Lv Ultra-Precision Machining Research Centre Zhejiang University of Technology

Cylindrical rollers are important elements of bearings,and their machining accuracy and consistency affect the bearing *** a GCr15 cylindrical roller ofФ11×12 as the processing object in this study,the effects of loading pressure,abrasive concentration,and speed combination on cylindrical roller machining precision were investigated using the orthogonal experimental design method on a double-side eccentric pendulum lapping and polishing *** machining parameters of the lapping stage were optimized,and the lapping optimal process parameters were determined by S/N response analysis and analysis of variance(ANOVA).The results show that when the experiment was optimized using loading pressure of 10 N/roller,abrasive concentrationof 20.0 wt%,and rotational speed combination,the material removal rate(MRR)of cylindrical roller reached 0.0896μm/min;the average roughness of the batch decreased from 0.056μm to 0.027μm,51.8%lower than the original batch average roughness,and the deviation decreased from the initial 0.022μm to 0.014μm;the batch average roundness error decreased from 0.47μm to 0.28μm,40.4%lower than the original batch average roundness error,and the deviation decreased from the initial 0.19μm to 0.038μm;and the batch average diameter variation decreased from 4.5μm to about 3.6μm,20%lower than the original batch average diameter *** double-side eccentric lapping of cylinder rollers does not only lead to improvement in the surface quality and shape accuracy of rollers,but also improvement in the batch consistency.

关键词： Cylindrical roller Eccentric pendulum type Orthogonal experiment Lapping Batch consistency

Edge preparation methods for cutting tools:a review

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Frontiers of Mechanical Engineering 2023年第4期18卷 49-77页

作者： Yu ZHOU Wei FANG Lanying SHAO Yanfei DAI Jiahuan WANG Xu WANG julong yuan Weigang GUO Binghai LYU College of Mechanical Engineering Zhejiang University of TechnologyHangzhou 310023China Key Laboratory of Special Purpose Equipment and Advanced Processing Technology(Ministry of Education and Zhejiang Province) Zhejiang University of TechnologyHangzhou 310023China Special Equipment Institute Hangzhou Vocational&Technical CollegeHangzhou 310018China

Edge preparation can remove cutting edge defects,such as burrs,chippings,and grinding marks,generated in the grinding process and improve the cutting performance and service life of *** edge preparation methods have been proposed for different tool matrix materials,geometries,and application *** study presents a scientific and systematic review of the development of tool edge preparation technology and provides ideas for its future ***,typical edge characterization methods,which associate the microgeometric characteristics of the cutting edge with cutting performance,are briefly ***,edge preparation methods for cutting tools,in which materials at the cutting edge area are removed to decrease defects and obtain a suitable microgeometry of the cutting edge for machining,are *** edge preparation methods are explored on the basis of existing processing technologies,and the principles,advantages,and limitations of these methods are systematically summarized and *** preparation methods are classified into two categories:mechanical processing methods and nontraditional processing *** methods are compared from the aspects of edge consistency,surface quality,efficiency,processing difficulty,machining cost,and general *** this manner,a more intuitive understanding of the characteristics can be ***,the future development direction of tool edge preparation technology is prospected.

关键词： edge preparation method preparation principle cutting edge geometry edge characterization tool performance

Cutting edge preparation of microdrills by shear thickening polishing for improved hole quality in electronic PCBs

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Frontiers of Mechanical Engineering 2024年第2期19卷 99-107页

作者： Jiahuan WANG Mingfeng KE Jiepei LIAO Yu ZHOU Saurav GOEL Jaya VERMA Xu WANG Weigang GUO julong yuan Binghai LYU College of Mechanical Engineering Zhejiang University of TechnologyHangzhou 310000China Ultra-precision Machining Center Key Laboratory of Special Purpose Equipment and Advanced Manufacturing TechnologyZhejiang University of TechnologyHangzhou 310000China School of Engineering London South Bank UniversityLondon SE10AAUK Shenzhen Jinzhou Precision Technology Corporation Shenzhen 518116China Department of Mechanical Engineering University of Petroleum and Energy StudiesDehradun 248007India Special Equipment Institute Hangzhou Vocational&Technical CollegeHangzhou 310018China

Printed circuit boards(PCBs)are representative composite materials,and their high-quality drilling machining remains a persistent challenge in the *** finishing of the cutting edge of a microdrill is crucial to drill performance in machining fine-quality holes with a prolonged tool *** miniature size involving submicron scale geometric dimensions,a complex flute shape,and low fracture toughness makes the cutting edge of microdrills susceptible to breakage and has been the primary limiting factor in edge preparation for *** this study,a newly developed cutting edge preparation method for microdrills was tested experimentally on electronic printed circuit *** proposed method,namely,shear thickening polishing,limited the cutting edge burrs and chipping on the cutting edge,and this in turn transformed the cutting edge’s radius from being sharp to ***,the edge–edge radius could be regulated by adjusting the processing *** drilling experiments were conducted to investigate the influence of different cutting edge radii on wear,hole position accuracy,nail head value,and hole wall *** proposed approach showed 20%enhancement in hole position accuracy,33%reduction in the nail head value,and 19%reduction in hole wall roughness compared with the original ***,a threshold is needed;without it,excessive shear thickening polishing will result in a blunt edge,which may accelerate the wear of the *** was identified as the primary factor that reduced hole *** study indicates that in printed circuit board machining,microdrills should effectively eliminate grinding defects and maintain the sharpness of the cutting edge as much as possible to obtain excellent drilling ***,shear thickening polishing is a promising method for cutting edge preparation of *** research and optimization can lead to additional improvements in microdrill performance and contribute to the conti

关键词： microdrill shear thickening polishing cutting edge preparation electronic printed circuit boards hole quality

Degradation of Azo dye direct black BN based on adsorption and microwave-induced catalytic reaction

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Frontiers of Environmental Science & Engineering 2018年第1期12卷 71-83页

作者： Shanshan Ding Wen Huang Shaogui Yang Danjun Mao julong yuan Yuxuan Dai Jijie Kong Cheng Sun Huan He Shiyin Li Limin Zhang State Key Laboratory of Pollution Control and Resource Reuse School of the Environment Nanjing University Nanjing 210023 China School of Environment Nanjing Normal University Nanjing 210023 China

The novel microwave catalyst MgFe204-SiC was synthesized via sol-gel method, to remove azo dye Direct Black BN （DB BN） through adsorption and microwave-induced catalytic reaction. Microwave- induced catalytic degradation of DB BN, including adsorption behavior and its influencing Factors of DB BN on MgFc204-SiC were investigated. According to the obtained results, il indicated thai the pseudo-second-order kinetics model was suitable fbr the adsorption of DB BN onto MgFc204-SiC. Besides, the consequence of adsorption isotherm depicted that the adsorption of DB BN was in accordance with the Langmuir isotherm, which verified that the singer layer adsorption of MgF%O4- SiC was dominant than the multi-layer one. The excellent adsorption capacities of MgFe204-SiC were kept in the range of initial pH from 3 to 7. In addition, it could be concluded that the degradation rate of DB BN decreased over ten percent after the adsorption equilibrium had been attained, and thc results from the result of comparative experiments manitbsted that the adsorption process was not conducive to the process of microwave-induced catalytic degradation. The degradation intermediates and products of DB BN were identified and determined by GC-MS and LC-MS. Furthermore, combined with the catalytic mechanism of MgFe204-SiC, the proposed degradation pathways of DB BN were the involution of microwave-induced OH and holes in this catalytic system the breakage of azo bond, hydroxyl substitution, hydroxyl addition, nitration reaction, dcamination reaction, dcsorbate reaction, dehydroxy group and ring-opening reaction.

关键词： AdsorptionMicrowave-induced catalytic degradationDirect black BNDegradation pathway

基于接触力控制的抛光轮磨损在线补偿策略研究

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仪器仪表学报 2010年第5期31卷 991-997页

作者：俞红祥徐洪袁巨龙浙江师范大学交通学院金华310004 国家精密高效磨削工程技术中心湖南大学长沙410082

提出了一种用于玻璃多面体磨削成形加工设备的抛光轮磨损在线补偿策略,由抛光接触力实时估算、抛光轮磨损预测算法和前馈-反馈混合方式接触力控制模块构成。该补偿策略无需采用精密测距传感器即可解决抛光轮长期运行磨损所导致的半径参... 详细信息

提出了一种用于玻璃多面体磨削成形加工设备的抛光轮磨损在线补偿策略,由抛光接触力实时估算、抛光轮磨损预测算法和前馈-反馈混合方式接触力控制模块构成。该补偿策略无需采用精密测距传感器即可解决抛光轮长期运行磨损所导致的半径参数持续漂移。文中详细论述了抛光轮磨损在线补偿策略的原理和实现方式,并在实验室构建了玻璃多面体精密高效磨削加工原型机,对该补偿策略进行了应用测试。从加工样本采集的测试数据与理论分析呈现了良好的一致性,验证了所提出方法的正确性和有效性,及其在玻璃多面体磨削成形加工应用中的广泛应用前景。

关键词：磨削成形抛光轮磨损补偿预测算法

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喷丸强化过程的有限元和离散元模拟

中国机械工程 2008年第11期19卷 1321-1325页

作者：洪滔王志伟袁巨龙浙江工业大学机械制造及自动化省部共建教育部重点实验室杭州310014

利用有限元法建立喷丸强化过程中单/多颗弹丸连续撞击靶材的数值分析模型,对于单弹丸撞击情况,探讨了弹丸参数(速度和角度)对靶材中残余应力场的影响,对于双弹丸连续撞击情况,探讨了第二颗弹丸速度对靶材中残余应力场的影响;建立了模拟... 详细信息

利用有限元法建立喷丸强化过程中单/多颗弹丸连续撞击靶材的数值分析模型,对于单弹丸撞击情况,探讨了弹丸参数(速度和角度)对靶材中残余应力场的影响,对于双弹丸连续撞击情况,探讨了第二颗弹丸速度对靶材中残余应力场的影响;建立了模拟喷丸强化过程的三维离散元模型并进行了数值试验研究,分析了喷丸强化过程的工艺参数(质量流速、初始速度、喷嘴攻角等)对颗粒流中弹丸间相互碰撞的影响;结合有限元和离散元计算结果,提出对喷丸强化工艺参数进行优化控制,提高喷丸强化的加工工艺水平,以实现更好的强化效果。

关键词：喷丸强化残余应力有限元法离散元法

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电极形状对介电泳抛光影响的仿真研究

华中科技大学学报（自然科学版） 2017年第2期45卷 55-60页

作者：赵天晨袁巨龙邓乾发杭伟浙江工业大学超精密加工研究中心浙江杭州310014

为了解决平面抛光加工中提高精度和效率的难题,根据中性微粒在非均匀电场中可以产生介电泳效应,提出了一种可以提高抛光均匀性和效率的介电泳抛光方法.讨论了介电泳理论及抛光原理,运用COMSOL软件仿真分析了不同电极的电场线分布.仿真... 详细信息

为了解决平面抛光加工中提高精度和效率的难题,根据中性微粒在非均匀电场中可以产生介电泳效应,提出了一种可以提高抛光均匀性和效率的介电泳抛光方法.讨论了介电泳理论及抛光原理,运用COMSOL软件仿真分析了不同电极的电场线分布.仿真结果表明:圆环70~90mm电极形状的电场线分布最不均匀.进行了相应电极的加工试验,试验结果表明:使用圆环70~90mm电极时材料去除率最大,达到0.573mg/min,相比传统CMP提升了19.9%.使用圆Φ60mm电极形状,工件材料去除最均匀、抛光效率最高,2.5h可以将Φ76.2mm硅片全部抛亮,比传统CMP提高了3.6倍,且最终表面粗糙度为0.97nm.在实际加工中,圆Φ60mm电极形状最适合Φ76.2mm硅片的介电泳抛光.

关键词：介电泳抛光电极形状效率均匀性仿真研究

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精密陶瓷球体研磨过程中材料去除模型的研究

华中科技大学学报（自然科学版） 2014年第2期42卷 74-76,90页

作者：郁炜吕冰海袁巨龙衢州学院电气与信息工程学院浙江衢州324001 浙江工业大学特种装备制造与先进加工技术重点实验室浙江杭州310014

为了解精密球体研磨过程中材料去除的原理,建立了一种基于三体磨损的磨损模型,用于预测材料去除率(MMRR).理论分析、仿真和实验结果表明:磨损中的精密球体材料去除率不仅与外加载荷和速率的过程参数有关,而且与球、研磨料浓度和加工机... 详细信息

为了解精密球体研磨过程中材料去除的原理,建立了一种基于三体磨损的磨损模型,用于预测材料去除率(MMRR).理论分析、仿真和实验结果表明:磨损中的精密球体材料去除率不仅与外加载荷和速率的过程参数有关,而且与球、研磨料浓度和加工机械的物理性质、几何参数有关.研究还发现:外加非线性负载时,每个球的材料去除与接触面积和磨料划痕有关,并且增加球体滑动对提高材料去除是很重要的.

关键词：陶瓷精密球体三体磨损磨损模型材料去除率