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Cu-Cu low-temperature diffusion bonding by spark plasma sintering:Void closure mechanism and mechanical properties

Journal of Materials Science & Technology 2023年第8期139卷 210-223页

作者： Wendi Li Yuxin Liang Yang Bai Tiesong Lin Bangsheng Li jicai feng School of Materials Science and Engineering Harbin Institute of TechnologyHarbin 150001China State Key Laboratory of Advanced Welding and Joining Harbin Institute of TechnologyHarbin 150001China National Key Laboratory for Precision Hot Processing of Metals Harbin Institute of TechnologyHarbin 150001China

In this study,combining the single point diamond turning(SPDT)and spark plasma sintering(SPS),we achieved high-strength diffusion bonding of copper at an ultra-low temperature of 202℃(0.35 T_(m),T_(m):absolute temperature of the melting point).Additionally,the closure mechanism of interfacial micro-and nano-voids during the Cu-Cu SPS diffusion bonding is systematically revealed for the first time.For micro-voids,the pulsed current is found to induce additional diffusion flux and plastic deformation,thereby facilitating the void closure.Molecular dynamics(MD)simulation revealed that at the atomic scale,high-energy Cu atoms induced by the pulsed current can significantly promote the diffusion of low-energy atoms in their vicinity and accelerate the void closure.This study also proposes a novel“evaporation-deposition”nano-void closure mechanism for the previously unstudied nano-void closure process.The results show that the synergistic effect of the pulsed current and nanoscale surface rough-ness can significantly improve joint strength.At a low temperature of 405℃(0.5 T_(m)),on combining the computerized numerical control(CNC)turning and SPS diffusion bonding,the joint strength can reach 212 MPa,while that for the joint obtained by traditional hot pressing diffusion bonding at the same tem-perature is only 47 MPa.We obtained an ultra-high joint strength of 271 MPa using the combined process of SPDT and SPS diffusion bonding at an ultra-low temperature of 202℃(0.35 T_(m)),which is approximately 600℃ lower than the traditional diffusion bonding process temperature of 800℃(0.79 T_(m)).To sum up,this study provides a novel method and theoretical support for realizing low-temperature high-strength diffusion bonding.

关键词： Spark plasma sintering Diffusion bonding Void closure mechanism Mechanical property Molecular dynamics

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Vacuum wetting of Ag/TA2 to develop a novel micron porous Ti with significant biocompatibility and antibacterial activity

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Journal of Materials Science & Technology 2022年第21期116卷 180-191页

作者： Guanpeng Liu Yulong Li Ming Yan jicai feng Jian Cao Min Lei Quanwen Liu Xiaowu Hu Wenqin Wang Xuewen Li Key Lab for Robot and Welding Automation of Jiangxi Province Mechanical and Electrical Engineering SchoolNanchang UniversityNanchang 330031China Jiangxi Provincial Key Laboratory of Interdisciplinary Science Nanchang UniversityNanchang 330031China Department of Materials Science and Engineering and Shenzhen Key Laboratory for Additive Manufacturing of High-Performance Materials Southern University of Science and TechnologyShenzhen 518055China State Key Lab of Advanced Welding and Joining Harbin Institute of TechnologyHarbin 150001China The National Engineering Research Center for Bioengineering Drugs and the Technologies Institute of Translational MedicineNanchang UniversityNanchang 330031China The Engineering Training Center of Nanchang University Mechanical and Electrical Engineering SchoolNanchang UniversityNanchang 330031China

Porous Ti with low modulus,excellent bio-corrosion resistance,biocompatibility,and antibacterial activity is highly pursued as advanced implant materials.In this work,a new approach to prepare micron porous structures on the surface layer of a grade 2 commercially-pure Ti(TA2)was proposed,which utilized a simple vacuum wetting process of pure Ag on the surface of TA2.The microstructure,corrosion resistance,biocompatibility,mechanical properties,antibacterial ability,and formation mechanism of the asfabricated porous Ti were studied.The results show that the pores(with average pore sizes of 0.5-5μm)are distributed on the surface layer of the TA2 with a depth of~10μm.In particular,a large number of silver nanoparticles(Ag NPs)form which are dispersed on the porous structures.The formation mechanisms of the porous structures and Ag NPs were elucidated,suggesting that the volatilization/sublimation of Ag in TA2 is crucial.The porous Ti possesses excellent bio-corrosion resistance,surface wettability,biocompatibility,antibacterial activity,and a relatively low elastic modulus of 40-55 GPa,which may have a promising future in the field of orthopedic implants.This work also provides a novel idea for the development of advanced porous Ti materials for orthopedic-related basic research and biomedical applications.

关键词： Porous titanium Biomaterials Vacuum wetting Porous surface Antibacterial activity

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Microstructure and Strength of Brazed Joints of Ti_(3)Al Base Alloy with Cu-P Filler Metal

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Journal of Materials Science & Technology 2005年第4期21卷 493-498页

作者： Peng HE jicai feng Heng ZHOU National Key Laboratory of Advanced Welding Production Technology Harbin Institute of Technology Harbin 15{}001 China

Brazing of Ti3Al alloys with the filler metal Cu-P was carried out at 1173-1273 K for 60-1800 s. When products are brazed, the optimum brazing parameters are as follows： brazing temperature is 1215-1225 K; brazing time is 250-300 s. Four kinds of reaction products were observed during the brazing of Ti3Al alloys with the filler metal Cu-P, i.e., Ti3Al phase with a small quantity of Cu （Ti3Al（Cu）） formed close to the Ti3Al alloy; the TiCu intermetallic compounds layer and the Cu3P intermetallic compounds layer formed between Ti3Al（Cu） and the filler metal, and a Cu-base solid solution formed with the dispersed Cu3P in the middle of the joint. The interracial structure of brazed Ti3Al alloys joints with the filler metal Cu-P is Ti3Al/Ti3Al（Cu）/TiCu/Cu3P/Cu solid solution （Cu3P）/Cu3P/TiCu/Ti3Al（Cu）/Ti3Al, and this structure will not change with brazing time once it forms. The thickness of TiCu＋Cu3P intermetallic compounds increases with brazing time according to a parabolic law. The activation energy Q and the growth velocity/to of reaction layer TiCu＋Cu3P in the brazed joints of Ti3Al alloys with the filler metal Cu-P are 286 kJ/mol and 0.0821 m2/s, respectively, and growth formula was y2=O.O821exp（-34421.59/T）t.Careful control of the growth for the reaction layer TiCu＋Cu3P can influence the final joint strength. The formation of the intermetallic compounds TiCu＋Cu3P results in embrittlement of the joint and poor joint properties. The Cu-P filler metal is not fit for obtaining a high-quality joint of Ti3Al brazed.

关键词： Brazed joints Microstructure Ti3Al base alloy

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Mechanical Properties and Microstructure of 6082-T6 Aluminum Alloy Joints by Self-support Friction Stir Welding

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Journal of Materials Science & Technology 2014年第12期30卷 1243-1250页

作者： Long Wan Yongxian Huang Weiqiang Guo Shixiong Lv jicai feng State Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology

The majority of this research has concentrated on developing the self-support friction stir welding（SSFSW） tool which consists of a big concave upper shoulder and a small convex lower shoulder, and procedures for making reliable welds in aluminum hollow extrusion. The 5-mm-thick 6082-T6 aluminum alloy was self-support friction stir welded at a constant tool rotation speed of 800 r/min. The effect of welding speed on microstructure and mechanical properties was investigated. The results of transverse tensile test indicated that the tensile strength of joints increased and the elongation decreased with increasing welding speed. The whole values of microhardness of SSFSW joints increased with increasing welding speed from 10 to 200 mm/min. The defectfree joints were obtained at lower welding speeds and the tensile fracture was located at the heat-affected zone（HAZ） adjacent to the thermo-mechanically affected zone（TMAZ） on the advancing side. The investigation of the flow pattern of the softened metal around the SSFSW tool revealed that the flow pattern of the softened metal was driven by two shoulders and the stir pin. The failure of specimens in tension presented the ductile fracture mode.

关键词： Self-support friction stir welding Aluminum alloy Welding speed Mechanical properties Microstructure Flow pattern

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Characterization,Removal and Evaluation of Oxide Film in the Diffusion Bonding of Zr_(55)Cu_(30)Ni_5Al_(10) Bulk Metallic Glass

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Journal of Materials Science & Technology 2014年第7期30卷 722-730页

作者： Haiyan Chen Jian Cao Xiaoguo Song Jiakun Liu jicai feng State Key Lab of Advanced Welding and Joining Harbin Institute of Technology School of Materials Science and Engineering Harbin Institute of Technology at Weihai

The composition of oxide film of ZrssCu3oNi5Al10 bulk metallic glass was identified by X-ray photoelectron spectroscopy. In addition, the relatively sound joints of bulk metallic glass without macroscopic deformation were obtained by removing the oxide film before diffusion bonding. The joint interfaces were observed by scanning electron microscopy and atomic force microscopy. The hardness of joints near the interface was higher than that far away from the interface, which is attributed to the difference of structural relaxation. According to the result of micro-focused X-ray diffractometry and transmission electron microscopy, the joints retained the amorphous structure when the holding time is less than 20 min. The surface area fraction of oxide film on the interface of joints was detected by ultrasonic inspection. Moreover, the surface area fraction of oxide film is in excellent agreement with the theoretical value calculated by shear strength. The result indicated that surface oxide film is the dominant barrier on the diffusion bonding of bulk metallic glass rather than low atomic diffusion coefficient.

关键词： Bulk metallie glass Diffusion Surface Diffusion bonding Oxide film

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Diffusion Bonding of Ti-6Al-4V to QAl 10-3-1.5 with Ni/Cu Interlayers

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Journal of Materials Science & Technology 2006年第6期22卷 817-820页

作者： Wei GUO Xihua ZHAO Minxia SONG jicai feng Biao YANG Key Laboratory of Automobile Materials （Jilin University） Ministry of Education Department of Materials Science and Engineering Jilin University Changchun 130025 China National Key Laboratory of Advanced Welding Production Technology Harbin Institute of Technology Harbin 150001 China

Ti-6Al-4V and QAl 10-3-1.5 diffusion bonding has been carried out with Ni/Cu interlayers. The diffusionbonded joints are evaluated by scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS） and microhardness test. Intermetallic compounds at the interface zone are detected by X-ray diffraction （XRD）. Interracial microstructure of TiNi＋CuTi3＋α-Ti forms at the Ni/Ti-6Al-4V transition zone and Cu （ss. Ni） solid solution forms between Ni/Cu interlayers. The thickness of reaction layer （TiNi） increases with bonding time by a parabolic law： y^2=Koexp（-150000/RT）t, and K0=2.g×10^-7 m^2/s is figured out from the experiment data.

关键词： Diffusion bonding Microstructure Interface Ni/Cu interlayers

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Residual stress distribution as a function of depth in graphite/copper brazing joints via X-ray diffraction

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Journal of Materials Science & Technology 2019年第11期35卷 2470-2476页

作者： Chun Li Xiaoqing Si Jian Cao Junlei Qi Zhibo Dong jicai feng State Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology

The residual stress distributions as a function of depth in three different graphite/copper brazing joints:with no interlayer,with a copper interlayer and with a niobium interlayer are measured via X-ray diffraction by transmission geometry.The residual stress in all the joints is found to be generally compressive and increasing from the surface to the interface.Copper and niobium interlayers are both effective in alleviating the residual stress in the joint and the stress value in the joint with a niobium interlayer appearing to be the lowest.The strength of the joint is demonstrated to be closely related to the residual stress and the fracture position of the joint corresponds well with the highest residual stress.

关键词： Brazing Residual stress XRD Graphite Copper

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Wettability and joining of SiC by Sn-Ti: Microstructure and mechanical properties

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Journal of Materials Science & Technology 2020年第5期40卷 15-23页

作者： Wei Fu Xiaoguo Song Ruichen Tian Yuzhen Lei Weimin Long Sujuan Zhong jicai feng State Key Laboratory of Advanced Welding and Joining Harbin Institute of TechnologyHarbin 150001China Shandong Provincial Key Laboratory of Special Welding Technology Harbin Institute of Technology at WeihaiWeihai 264209China State Key Laboratory of Advanced Brazing Filler Metals and Technology Zhengzhou Research Institute of Mechanical EngineeringZhengzhou 450001China

Reliable Si C/Sn-Ti/Si C joints were obtained by brazing(950?C/10 min)and soldering(250?C/2 min)following premetallization depend on the wettability of Sn-Ti on Si C.The microstructures of Sn-Ti/Si C interface were characterized by scanning electron microscopy,X-ray diffraction and transmission electron microscopy,and the mechanical properties of joints were evaluated by shear tests.Active Ti enhanced the wettability of Sn on Si C with the decrease of contact angle from 150?to 20?.Ti direct reacted with Si C to produce Ti C and combines with released Si forming Ti5Si3.Much lower Ti concentration per contacting area in brazing and metallization,compared to wetting,resulted in defective bonding of Sn-Ti/Si C and few amounts of interfacial products(thin Ti C layer or partial covered Ti C layer with Ti5Si3).All of the Si C/Si C joints possess a similar shear strength of 27–32 MPa and rupture through?-Sn matrix in ductile fracture.

关键词： Microstructures Wettability Brazing Metallization SiC Sn Ti

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Brazing of C/C composite and Ti-6Al-4V with graphene strengthened AgCuTi filler:Effects of graphene on wettability,microstructure and mechanical properties

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Chinese Journal of Aeronautics 2018年第7期31卷 1602-1608页

作者： Duo LIU Yanyu SONG Yinghao ZHOU Xiaoguo SONG Wei FU jicai feng State Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology Shandong Provincial Key Laboratory of Special Welding Technology Harbin Institute of Technology at Weihai

Graphene nanosheets（GNSs） strengthened AgCuTi composite filler（AgCuTiG） was used to braze C/C composite and Ti-6Al-4V. The effects of GNSs on the wettability of AgCuTiG filler on the C/C composite surface and the interfacial microstructure and mechanical properties of brazed joints were investigated. The results indicate that the addition of GNSs reduced the wettability of AgCuTiG. The interfacial microstructure of brazed joints evolved with the addition of GNSs, where Ti3Cu4 and TiCu4 were converted to TiCu and the thickness of the reaction layer adjacent to the base material decreased. The maximum shear strength of joints brazed at 0.3 wt% GNSs was 23.3 MPa（880℃/10 min）. Further adding GNSs deteriorated the shear strength of the joints. Fracture of the joints occurred in the C/C composite substrate and the TiC layer adjacent to C/C composite.

关键词： Brazing Graphene nanosheets Mechanical properties Microstructure Wetting

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Vacuum brazing of GH99 superalloy using graphene reinforced BNi-2 composite filler

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Journal of Materials Science & Technology 2018年第10期34卷 1843-1850页

作者： Duo Liu Yanyu Song Bin Shi Qi Zhang Xiaoguo Song Hongwei Niu jicai feng State Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology Shandong Provincial Key Laboratory of Special Welding Technology Harbin Institute of Technology at Weihai

A novel graphene reinforced BNi-2 composite filler was developed for brazing GH99 superalloy. The interracial microstructure of brazed joints was analyzed by field emission scanning electron microscope and a transmission electron microscope. The effects of graphene addition on the microstructure evolu-tion and mechanical properties of brazed joints were investigated, and the strengthening mechanism of graphene was analyzed. The results revealed that due to the addition of graphene, M23（C,B）6 compounds were synthesized in the y solid solution and brittle boride precipitates near the brazing seam decreased. Graphene was effective in retarding solute atoms diffusion thus impeding the precipitation of borides. Furthermore, the low coefficient of thermal expansion （CTE） of graphene was conducive to relieve stress concentration of the brazed joints during the cooling process. The shear strengths of brazed joints were significantly improved by exerting the strengthening effect of graphene. The maximum shear strengths of the brazed joints were 410.4 MPa and 329.7 MPa at room temperature and 800 ℃, respectively.

关键词： Graphene GH99 superalloy Brazing Microstructure Mechanical properties

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