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Cardboard Eco-Bundle as an Alternative for Collation Shrink Film
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Open Journal of Applied Sciences 2023年 第1期13卷 94-108页
作者: jannes roman Gilles Verschueren Ward Nica Peter Slaets Marc Juwet Department of Mechanical Engineering KU Leuven Campus Gent Belgium Department of Mechanical Engineering KU Leuven Campus Leuven Belgium
Due to increasing pressure on brand owners and distributors to avoid single use plastics such as plastic bundle packaging, a new bundle packaging that consists of corrugated board only, has been designed. Obviously th... 详细信息
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