检索结果-南通市图书馆

Journal of Computational Mathematics 1996年第2期14卷 135-142页

作者： huang l C 中科院计算数学与科学工程计算所北京

Synthesis of CMC-Multipeptide Conjugate

在线全文

学校读者我要写书评

暂无评论

Chinese Chemical letters 1998年第1期9卷 23-24页

作者： Wang, DX huang, l Chinese Acad Med Sci Inst Mat Med Beijing 100050 Peoples R China Peking Union Med Coll Beijing 100050 Peoples R China

The synthesis of carboxymethyl cellulose (CMC)-multipeptide conjugate is reported in the present paper. This new type of peptide-polymer surrogate possesses some merits, such as ease of synthesis, high density of pept... 详细信息

关键词： peptide carboxymethyl cellulose conjugate polymer ligation

Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints

在线全文

学校读者我要写书评

暂无评论

Journal of Materials Science & Technology 2015年第3期31卷 252-256页

作者： M.l.huang F.Yang Electronic Packaging Materials laboratory School of Materials Science & Engineering Dalian University of Technology

Solder size effect on early stage interfacial intermetallic compound(IMC) evolution in wetting reaction between Sne3.0Age0.5Cu solder balls and electroless nickel electroless palladium immersion gold(ENEPIG) pads at 250 C was investigated. The interfacial IMCs transformed from initial needle- and rodtype(Cu,Ni)6Sn5to dodecahedron-type(Cu,Ni)6Sn5and then to needle-type(Ni,Cu)3Sn4at the early interfacial reaction stage. Moreover, these IMC transformations occurred earlier in the smaller solder joints, where the decreasing rate of Cu concentration was faster due to the Cu consumption by the formation of interfacial(Cu,Ni)6Sn5. On thermodynamics, the decrease of Cu concentration in liquid solder changed the phase equilibrium at the interface and thus resulted in the evolution of interfacial IMCs; on kinetics, larger solder joints had sufficient Cu flux toward the interface to feed the(Cu,Ni)6Sn5growth in contrast to smaller solder joints, thus resulted in the delayed IMC transformation and the formation of larger dodecahedron-type(Cu,Ni)6Sn5grains. In smaller solders, no spalling but the consumption of(Cu,Ni)6Sn5grains by the formation of(Ni,Cu)3Sn4grains occurred where smaller discrete(Cu,Ni)6Sn5grains formed at the interface.

关键词： Size effect lead-free solder Interfacial reaction

Active elastic metamaterials for subwavelength wave propagation control

在线全文

学校读者我要写书评

暂无评论

Acta Mechanica Sinica 2015年第3期31卷 349-363页

作者： Y.Y.Chen G.l.huang Department of Mechanical and Aerospace Engineering University of Missouri

Recent research activities in elastic metamaterials demonstrate a significant potential for subwavelength wave propagation control owing to their interior locally resonant mechanism. The growing technological developments in electro/magnetomechanical couplings of smart materials have introduced a controlling degree of freedom for passive elastic metamaterials. Active elastic metamaterials could allow for a fine control of material physical behavior and thereby induce new functional properties that cannot be produced by passive approaches. In this paper, two types of active elastic metamaterials with shunted piezoelectric materials and electrorheological elastomers are proposed. Theoretical analyses and numerical validations of the active elastic metamaterials with detailed microstructures are pre- sented for designing adaptive applications in band gap structures and extraordinary waveguides. The active elastic metamaterial could provide a new design methodology for adaptive wave filters, high signal-to-noise sensors, and structural health monitoring applications.

关键词： Active elastic metamaterials Subwavelengthwave control Adaptive metastructures Smart materials

Effect of Ni Content on Mechanical Properties and Corrosion Behavior of Al/Sn－9Zn－xNi/Cu Joints

在线全文

学校读者我要写书评

暂无评论

Journal of Materials Science & Technology 2012年第9期28卷 844-852页

作者： M.l.huang N.Kang Q.Zhou Y.Z.huang Key laboratory of liaoning Advanced Welding and Joining Technology School of Materials Science&EngineeringDMian University of TechnologyDalian 116024China

The effects of Ni content on the microstructure and the wetting behavior of Sn-9Zn-xNi solders on Al and Cu substrates, as well as the mechanical properties and electrochemical corrosion behavior of Al/Sn-9Zn-xNi/Cu solder joints, were investigated. The microstructure of Sn-gZn-xNi revealed that tiny Zn and coarsened Ni5Zn21 phases dispersed in theβ-Sn matrix. The wettability of Sn-9Zn-xNi solders on Al substrate was much better than that on Cu substrate. With increasing Ni content, the wettability on Cu substrate was slightly improved but became worse on Al substrate. In the Al/Sn-9Zn-xNi/Cu joints, an Al4.2Cu3.2Zn0.7 intermetallic compound （IMC） layer formed at the Sn-gZn-xNi/Cu interfaces, while an Al-Zn-Sn solid solution layer formed at the Sn-9Zn-xNi/Al interface. The mixed compounds of Ni3Sna and Al3Ni dispersed in the solder matrix and coarsened with increasing Ni content, thus leading to a reduction in shear strength of the Al/Sn-9Zn- xNi/Cu joints. Al particles were segregated at both interfaces in the solder joints. The corrosion potentials of Sn-9Zn-xNi solders continuously increased with increasing Ni content. The Al/Sn-9Zn-0.25Ni/Cu joint was found to have the best electrochemical corrosion resistance in 5% NaCl solution.

关键词： Al-Cu disslmilar-metal solder joint Sn-9Zn-xNi Microstructure Mechanicalproperties Electrochemical corrosion Corrosion potential

More Feasible Way to Cleave Photo-labile Resin

在线全文

学校读者我要写书评

暂无评论

Chinese Chemical letters 1996年第10期7卷 909-910页

作者： Wang, DX Guo, YH huang, l CHINESE ACAD MED SCI INST MAT MEDBEIJING 100050PEOPLES R CHINA XUANWU HOSP BEIJING GERIATR INSTBEIJING 100053PEOPLES R CHINA

A combinatorial cleavage, acidolysis-saponification, after solid phase peptide synthesis on photo-labile resin was stated in present paper. Peptide (Gly-Asp-Ala-lys-Gly)(2)>lys-OH was liberated with high yield(92.1%) and excellent purity(91.6%) from its protected peptidyl nitro-resin precursor by a new orthorgonal protocol: 1) Hi-TFMSA, 2) 0.2N NaOH/90% EtOH.

关键词：

Improving the Input of Classified Neural Networks Through Feature Construction

在线全文

学校读者我要写书评

暂无评论

Journal of Systems Engineering and Electronics 2001年第3期12卷 85-89页

作者： Yang, l. Yu, Z. huang, l. School of Economics and Management Tongji University Shanghai 200092 China

A general classification algorithm of neural networks is unable to obtain satisfied results because of the uncertain problems existing among the features in moot classification programs, such as interaction. With new features constructed by optimizing decision trees of examples, the input of neural networks is improved and an optimized classification algorithm based on neural networks is presented. A concept of dispersion of a classification program is also introduced too in this paper. At the end of the paper, an analysis is made with an example.

关键词： Feature construction Neural networks Dispersion Decision trees Hyperplane.

Irradiation-induced homogeneous plasticity in amorphous/amorphous nanolaminates

在线全文

学校读者我要写书评

暂无评论

Journal of Materials Science & Technology 2020年第22期54卷 70-77页

作者： l.huang Z.Q.Chen P.huang X.K.Meng F.Wang State Key laboratory for Mechanical Behavior of Material School of Materials Science and EngineeringXi'an Jiaotong UniversityXi'an710049China Institute of Materials Engineering National Laboratory of Solid State MicrostructuresCollaborative Innovation Center of Advanced MicrostructuresNanjing UniversityNanjing 210023China State Key laboratory for Strength and Vibration of Mechanical Structures School of Aerospace EngineeringXi'an Jiaotong UniversityXi'an710049China

Achieving homogeneous plastic deformation in metallic glasses is a long-standing goal yet to be solved in materials science. Here we investigate the effect of ion irradiation on the plastic deformation behavior of ZrCu/ZrCuNiAlSi amorphous/amorphous nanolaminates(A/ANls) via nanoindentation testing. The experimental results indicate a dramatic change in deformation mode from multiple shear banding events to homogeneous compressive deformation before and after ion irradiation on the A/ANls in the areas underneath the indenter. Ion irradiation-induced changes of both fraction and distribution of free volume inside each constituent layer and interfacial state in the A/ANls may be responsible for the unusual homogeneous deformation behavior. Our results suggest that the mechanical property of A/ANls could be modified by tuning both the inner and interfacial structure via ion irradiation.

关键词： Metallic glasses Ion irradiation Plastic deformation Nanolaminates Interface

QUINOlONE AlKAlOIDS FROM EVODIA RUTAECARPA BENTHAM

在线全文

学校读者我要写书评

暂无评论

Chinese Chemical letters 1995年第10期6卷 877-878页

作者： Tang, YQ Feng, XZ huang, l Chinese Acad Med Sci Inst Mat Med Beijing 100050 Peoples R China

A new quinolone alkaloid was isolated from the fruit of Evodia rutaecarpa Bentham (Rutaceae) with three known alkaloids, and their structures were determined on the basis of spectral data and chemical transformations.

关键词：

Different Diffusion Behavior of Cu and Ni Undergoing liquidesolid Electromigration

在线全文

学校读者我要写书评

暂无评论

Journal of Materials Science & Technology 2014年第12期30卷 1235-1242页

作者： M.l.huang Z.J.Zhang H.T.Ma l.D.Chen Electronic Packaging Materials laboratory School of Materials Science & Engineering Dalian University of Technology IC Packaging Department Xi'an Institute of Microelectronic Technology

The diffusion behavior of Cu and Ni atoms undergoing liquidesolid electromigration（l-S EM） was investigated using Cu/Sn/Ni interconnects under a current density of 5.0 103A/cm2 at 250℃. The flowing direction of electrons significantly influences the cross-solder interaction of Cu and Ni atoms, i.e., under downwind diffusion, both Cu and Ni atoms can diffuse to the opposite interfaces; while under upwind diffusion,Cu atoms but not Ni atoms can diffuse to the opposite interface. When electrons flow from the Cu to the Ni, only Cu atoms diffuse to the opposite anode Ni interface, resulting in the transformation of interfacial intermetallic compound（IMC） from Ni3Sn4into（Cu,Ni）6Sn5and further into [（Cu,Ni）6Sn5t Cu6Sn5], while no Ni atoms diffuse to the opposite cathode Cu interface and thus the interfacial Cu6Sn5 *** electrons flow from the Ni to the Cu, both Cu and Ni atoms diffuse to the opposite interfaces,resulting in the interfacial IMC transformation from initial Cu6Sn5into（Cu,Ni）6Sn5and further into[（Cu,Ni）6Sn5t（Ni,Cu）3Sn4] at the anode Cu interface while that from initial Ni3Sn4into（Cu,Ni）6Sn5and further into（Ni,Cu）3Sn4at the cathode Ni interface. It is more damaging with electrons flowing from the Cu to the Ni than the other way.

关键词： Cu/Sn/Ni Electromigration Cross-solder interaction Interfacial reaction Diffusion