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Flexible Strain Sensors with Ultra-High Sensitivity and Wide Range Enabled by Crack-Modulated Electrical Pathways

NANO-MICRO LETTERS 2025年第1期17卷 1-19页

作者： Bai, Yunzhao Zhou, Yunlei Wu, Xuanyu Yin, Mengfei Yin, Liting Qu, Shiyuan Zhang, Fan Li, Kan huang, yongan Huazhong Univ Sci & Technol State Key Lab Intelligent Mfg Equipment & Technol Wuhan 430074 Peoples R China Huazhong Univ Sci & Technol Flexible Elect Res Ctr Wuhan 430074 Peoples R China Xidian Univ Hangzhou Inst Technol Hangzhou 311200 Peoples R China Xidian Univ Sch Mechanoelect Engn Xian 710071 Peoples R China Univ Southern Calif Dept Aerosp & Mech Engn Los Angeles CA 90089 USA

This study presents a breakthrough in flexible strain sensor technology with the development of an ultra-high sensitivity and wide-range sensor, addressing the critical challenge of reconciling sensitivity with measurement range. Inspired by the structure of bamboo slips, we introduce a novel approach that utilises liquid metal to modulate the electrical pathways within a cracked platinum fabric electrode. The resulting sensor demonstrates a gauge factor greater than 108 and a strain measurement capability exceeding 100%. The integration of patterned liquid metal enables customisable tuning of the sensor's response, while the porous fabric structure ensures superior comfort and air permeability for the wearer. Our design not only optimises the sensor's performance but also enhances the electrical stability that is essential for practical applications. Through systematic investigation, we reveal the intrinsic mechanisms governing the sensor's response, offering valuable insights for the design of wearable strain sensors. The sensor's exceptional performance across a spectrum of applications, from micro-strain to large-strain detection, highlights its potential for a wide range of real-world uses, demonstrating a significant advancement in the field of flexible electronics.

关键词： Flexible strain sensor Fabric Crack Response regulation Epidermal device

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Flexible hybrid electronics:Enabling integration techniques and applications

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Science China(Technological Sciences) 2022年第9期65卷 1995-2006页

作者： WU Hao huang yongan YIN ZhouPing Flexible Electronics Research Center State Key Laboratory of Digital Manufacturing Equipment and TechnologySchool of Mechanical Science and EngineeringHuazhong University of Science and TechnologyWuhan 430074China

The conventional electronic systems enabled by rigid electronic are prone to malfunction under deformation,greatly limiting their application *** an emerging platform for applications in healthcare monitoring and human-machine interface(HMI),flexible electronics have attracted growing attention due to its remarkable advantages,such as stretchability,flexibility,conformability,and wearing ***,to realize the overall electronic systems,rigid components are also required for functions such as signal acquisition and ***,flexible hybrid electronics(FHE),which simultaneously possesses the desirable flexibility and enables the integration of rigid components for functionality,has been emerging as a promising *** paper reviews the enabling integration techniques for FHE,including technologies for two-dimensional/three-dimensional(2 D/3 D) interconnects,bonding of rigid integrated circuit(IC) chips to soft substrate,stress-isolation structures,and representative applications of *** addition,future challenges and opportunities involved in FHE-based systems are also discussed.

关键词： deformation electronics bonding

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Preface:Celebrating the 70th Anniversary of School of Mechanical Science and Engineering,Huazhong University of Science and Technology

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Science China(Technological Sciences) 2022年第9期65卷 1913-1914页

作者： huang yongan YIN ZhouPing State Key Laboratory of Digital Manufacturing Equipment and Technology School of Mechanical Science and EngineeringHuazhong University of Science and TechnologyWuhan 430074China

Huazhong University of Science and Technology (HUST) is a key research-based comprehensive university in Wuhan, China,under the direct supervision of the Ministry of Education of China. Renowned as the epitome of the development of higher education in new China, it is a “211” Project,“985” Project,“Double First-Class” university in China.

关键词： owned China education

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Conformable,programmable and step-linear sensor array for large-range wind pressure measurement on curved surface

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Science China(Technological Sciences) 2020年第10期63卷 2073-2081页

作者： XIONG WenNan GUO DongLiang YANG ZhaoXi ZHU Chen huang yongan State Key Laboratory of Digital Manufacturing Equipment and Technology Huazhong University of Science and TechnologyWuhan 430074China Flexible Electronics Research Center Huazhong University of Science and TechnologyWuhan 430074China

The wind pressure measurement,especially on curved surfaces is imperative in revealing flow *** flexible sensor with high linear sensitivity over large pressure range is still a significant challenge,especially for commutatively positive and negative pressure ***,we propose a conformable,range-programmable capacitive sensor that can extremely extend the measuring range but with high linear *** key point is to precisely control the reference pressure of the flexible capacitive sensor array through microchannel *** proposed sensor with reference pressure 0 kPa keeps stable at a highly-linear sensitivity of 0.28 kPa-1 in an initial measurement regime from 0 to 3 kPa,beyond which the linearity changes *** the tunable reference pressure,the linear ranges can be customized arbitrarily according to different flight conditions and measured positions,but without any deterioration of *** theoretical model is built for the flexible capacitive sensor with tunable reference pressure,agreeing well with the experimental and finite element method ***,the bending effect is discovered when the flexible sensor is conformed on curved *** surface-mounted sensor skin is tested on a plate and is integrated with acquisition circuits on a standard airfoil NACA0012 in a wind tunnel and compares with the standard destructive method of pressure *** shows great potential applications in measuring wind pressure on curved surfaces,such as for"Fly-by-Feel"of unmanned aerial vehicles and wind tunnel test.

关键词： capacitive sensor flexible electronics smart sensing skin wind tunnel test unmanned aerial vehicles

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Machine learning-assisted sparse observation assimilation for real-time aerodynamic field perception

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Science China(Technological Sciences) 2024年第5期67卷 1458-1469页

作者： ZHAO QingYu huang Jun GUO YuXin PAN YuXuan JI JingJing huang yongan State Key Laboratory of Intelligent Manufacturing Equipment and Technology School of Mechanical Science and EngineeringHuazhong University of Science and TechnologyWuhan 430074China

Accurate aerodynamic distribution perception and real-time flight state evaluation are crucial for flight safety,e.g.,stall ***,the observations are usually sparse due to limitations in sensor mounting space and cost,and a reconstruction technology is urgently ***,a machine learning-assisted assimilation method based on sparse observations has been *** from the traditional reconstruction methods focusing on boundary condition correction,the proposed method formulates the flow field pressure distribution as a linear superposition of flow field modes,thereby forming a real-time reconstruction pattern that combines offline modal extraction using computational fluid dynamics(CFD)with real-time determination of modal weights using a neural *** this study,CFD simulations were conducted under 800different operating conditions for common modal extraction and model *** weights of these modes were determined online based on merely five observations for reconstructing the full pressure field.A pressure reconstruction with a relative error of 6.1%and a mean square error of 0.003 was achieved within the prescribed condition *** computational cost was just2 ms for each reconstruction run,significantly faster than the 20 min required by the classical reconstruction ensemble transform Kalman *** also showed that the method maintains almost the same accuracy amidst 1.5%measurement *** practical examples,shock waves and the change of lift coefficient were analyzed using the proposed method,providing remarkable evidence for the capability of the method in supporting stall *** validate the method’s effectiveness and explore its potential in real-time and accurate monitoring of an aircraft.

关键词： aerodynamic force sparse observation neural networks pressure field reconstruction

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Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex(UTCOF) assembly

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Science China(Technological Sciences) 2016年第11期59卷 1646-1655页

作者： CHEN JianKui XU ZhouLong huang yongan DUAN YongQing YIN ZhouPing State Key Laboratory of Digital Manufacturing Equipment and Technology Flexible Electronics Research Center Huazhong University of Science and Technology

The serious warpage issues of ultrathin chip-on-flex(UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technology. Currently, a theoretical prediction as a convenient and straightforward approach is still lacked for describing effectively the thermal-mechanical behavior of UTCOF during the adhesive curing and cooling process. In consideration of the adhesive thickness approximating to ultrathin chip and flexible substrate thickness, we develop a layerwise-model of ultrathin chip-adhesive-flex structure under plain strain condition, where the behavior of thick adhesive bonding can be described precisely through increasing the subdivided mathematical plies. Further, the analytical results show that the concave and convex forms of ultrathin chip warpage yield at the end of the curing and cooling process respectively. Meanwhile, the effects of its structure dimensions and material properties are also revealed for discussing a way to relieve the extent of ultrathin chip warpage. Additionally, in order to verify the validity of the theoretical prediction, we also introduce the corresponding numerical technique and experimental method. These results suggest that a kind of rigid and ultrathin flexible substrate such as metal foil should be adopted for small warpage of ultrathin assembly.

关键词： microelectronic packaging warpage layerwise theory ultrathin chip

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Driving force planning in shield tunneling based on Markov decision processes

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Science China(Technological Sciences) 2012年第4期55卷 1022-1030页

作者： HU XiangTao huang yongan YIN ZhouPing XIONG YouLun State Key Laboratory of Digital Manufacturing Equipment&Technology Huazhong University of Science&TechnologyWuhan 430074China

In shield tunneling, the control system needs very reliable capability of deviation rectifying in order to ensure that the tunnel trajectory meets the permissible criterion. To this goal, we present an approach that adopts Markov decision process (MDP) theory to plan the driving force with explicit representation of the uncertainty during excavation. The shield attitudes of possi- ble world and driving forces during excavation are scattered as a state set and an action set, respectively. In particular, an evaluation function is proposed with consideration of the stability of driving force and the deviation of shield attitude. Unlike the deterministic approach, the driving forces based on MDP model lead to an uncertain effect and the attitude is known only with an imprecise probability. We consider the case that the transition probability varies in a given domain estimated by field data, and discuss the optimal policy based on the interval arithmetic. The validity of the approach is discussed by comparing the driving force planning with the actual operating data from the field records of Line 9 in Tianjin. It is proved that the MDP model is reasonable enough to predict the driving force for automatic deviation rectifying.

关键词： shield tunneling Markov decision process automatic deviation rectifying interval arithmetic driving force planning

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Real-time adaptive particle image velocimetry for accurate unsteady flow field measurements

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Science China(Technological Sciences) 2022年第9期65卷 2143-2155页

作者： OUYANG ZhenXing YANG Hua LU Jin huang yongan YIN ZhouPing State Key Laboratory of Digital Manufacturing Equipment and Technology School of Mechanical Science and EngineeringHuazhong University of Science and TechnologyWuhan 430074China

Almost all conventional open-loop particle image velocimetry(PIV) methods employ fixed-interval-time optical imaging technology and the time-consuming cross-correlation-based PIV measurement algorithm to calculate the velocity *** this study,a novel real-time adaptive particle image velocity(RTA-PIV) method is proposed to accurately measure the instantaneous velocity field of an unsteady flow *** the proposed closed-loop RTA-PIV method,a new correlation-filter-based PIV measurement algorithm is introduced to calculate the velocity field in real ***,a Kalman predictor model is established to predict the velocity of the next time instant and a suitable interval time can be *** adaptively adjust the interval time for capturing two particle images,a new high-speed frame-straddling vision system is developed for the proposed RTA-PIV *** fully analyze the performance of the RTA-PIV method,we conducted a series of numerical experiments on ground-truth image pairs and on real-world image sequences.

关键词： real-time adaptive particle image velocimetry flow field measurement high-speed vision correlation filter

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Flexible electronics manufacturing technology and equipment

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Science China(Technological Sciences) 2022年第9期65卷 1940-1956页

作者： YIN ZhouPing huang yongan YANG Hua CHEN JianKui DUAN YongQing CHEN Wei State Key Laboratory of Digital Manufacturing Equipment and Technology School of Mechanical Science and EngineeringHuazhong University of Science and TechnologyWuhan 430074China Flexible Electronics Research Center Huazhong University of Science and TechnologyWuhan 430074China

Flexible electronics such as mechanically compliant displays,sensors and solar cells,have important applications in the fields of energy,national defence and biomedicine,*** types of flexible electronics have been proposed or developed by the improvements in structural designs,material properties and device ***,the manufacturing of flexible electronics receives little attention,which limits its mass production and *** increasing demands on the size,functionality,resolution ratio and reliability of flexible electronics bring several significant challenges in their manufacturing *** work aims to report the state-of-art technologies and applications of flexible electronics *** key technologies including electrohydrodynamic direct-writing,flip chip and automatic optical inspection are *** mechanism and developments of these technologies are discussed in *** on these technologies,the present work develops three kinds of manufacturing equipment,i.e.,inkjet printing manufacturing equipment,robotized additive manufacturing equipment,and roll-to-roll manufacturing *** advanced manufacturing processes,equipment and systems for flexible electronics pave the way for applications of new displays,smart sensing skins and epidermal electronics,*** reviewing the developments of flexible electronics manufacturing technology and equipment,it can be found that the existing advances greatly promote the applications and commercialization of flexible *** flexible electronics manufacturing contains many multi-disciplinary problems,the current investigations are confronted with great ***,further developments of the reviewed manufacturing technology and equipment are necessary to break the current limitations of manufacturing resolution,efficiency and reliability.

关键词： flexible electronics micro/nano manufacturing electrohydrodynamic direct-writing flip chip automatic optical inspection

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Inkjet printing for flexible electronics:Materials,processes and equipments

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Chinese Science Bulletin 2010年第30期55卷 3383-3407页

作者： YIN ZhouPing huang yongan BU NingBin WANG XiaoMei XIONG YouLun State Key Laboratory of Digital Manufacturing Equipment and Technology Huazhong University of Science and Technology Wuhan 430074China

Inkjet printing, known as digital writing technique, can directly deposit functional materials to form pattern onto substrate. This paper provides an overview of inkjet printing technologies for flexible electronics. Firstly, we highlight materials challenges in implementing flexible devices into practical application, especially for inkjet printing process. Then the micro/nano-patterning technologies of inkjet printing are discussed, including conventional inkjet printing techniques and electrohydrodynamic printing techniques. Thirdly, the related equipments on inkjet printing are shown. Finally, challenges for its future development are also discussed. The main purpose of the work is to condense the basic knowledge and highlight the challenges associated with the burgeoning and exciting field of inkjet printing for flexible electronics.

关键词：喷墨印刷技术功能材料电子设备软性喷墨打印技术工艺高压直流电

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