检索结果-南通市图书馆

FORMATION AND CHANGE OF AuSn_4 COMPOUNDS AT INTERFACE BETWEEN PBGA SOLDER BALL AND Au/Ni/Cu METALLIZATION DURING LASER AND INFRA-RED REFLOW SOLDERING

在线全文

学校读者我要写书评

暂无评论

Acta Metallurgica Sinica(English Letters) 2004年第2期17卷 199-204页

作者： Y.H.Tian C.Q.wang state key laboratory of advanced welding production technology,harbin institute of technology,harbin 150001,china lab. of Adv. welding Technol. Harbin Inst. of Technol. Harbin 150001 China

Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) duringlaser and infrared reflow soldering were studied. During laser reflow soldering process,a thin layer of AuSn_4 was observed at the interface of the solder bumps, its morphologywas strongly dependent on the laser reflow power and heating time. The solder bumpsformed by the first laser reflow was reflowed again to form the solder joints. TheAuSn_4 compounds formed in the first laser reflow process dissolved into the bulk solderafter the secondary infrared reflow process. The needle-like AuSn_4 changed into rod-like, and distributed inside the solder near the solder/pad interface.

关键词： laser reflow infrared reflow bump's microstructure solder joint

Controlling of weld hot cracks of aluminum alloy sheets by transverse pre-stressing

在线全文

学校读者我要写书评

暂无评论

Rare Metals 2007年第S1期26卷 157-161页

作者： liu Xuesong,ZHOU Guangtao,wang Ping,and FANG Hongyuan state key laboratory of advanced welding technology production,harbin institute of technology,harbin 150001,china harbin Inst Technol State Key Lab Adv Welding Technol Prod Harbin 150001 Peoples R China

A new ideological and theoretical model—a technology to control weld hot cracks by transverse compressive pre-stress in the welding of aluminum alloy was put forward,which was further proved by the subsequent self-designed test *** are conducted on the fishbone shaped specimen under conventional welding and welding with various pre-stress *** experimental results turn out that,the initiation rate of the weld hot cracks decreases with increasing values of the compressive *** the pre-stress reaches 0.3-0.4 of the yield stress,the cracks even *** mechanical viewpoint,the researches here develop a new way to control weld cracks.

关键词： welding with transverse pre-stress weld hot cracks crack initiation rate

Controlling of stress and distortion in thin copper plate by welding with trailing peening

在线全文

学校读者我要写书评

暂无评论

Rare Metals 2007年第S1期26卷 216-219页

作者： liu Xuesong,wang Ping,ZHOU Guangtao,and FANG Hongyuan state key laboratory of advanced welding production technology,harbin institute of technology,harbin 150001,china harbin Inst Technol State Key Lab Adv Welding Prod Technol Harbin 150001 Peoples R China

welding with trail peening(WTP) is applied in T1 thin copper plate to reduce the residual stress and distortion firstly,which is the very trouble in copper *** main principle for this new technology was *** make a complete comparison,both experiments and numerical simulations of thin copper plate were carried out under WTP as well as conventional welding(CW).The results confirm that WTP can reduce longitudinal residual stress in welding joint *** peak value of flexure distortion decreases from 30mm under CW to only 9mm by WTP,that is to say,only 30% of CW.

关键词： WTP residual stress flexure distortion FEA

Effects of Cu addition on growth of Au-Sn intermetallic compounds at Sn-xCu/Au interface during aging process

在线全文

学校读者我要写书评

暂无评论

Rare Metals 2007年第S1期26卷 331-337页

作者： TIAN Yanhong,wang Chunqing,and liu Wei Microjoining laboratory,state key laboratory of advanced welding production technology,harbin institute of technology,harbin 15000,china harbin Inst Technol Microjoining Lab State Key Lab Adv Welding Prod Technol Harbin 15000 Peoples R China

The growth of Au-Sn intermetallic compounds(IMCs) is a major concern to the reliability of solder joints in microelectronic,optoelectronic and micro-electronic-mechanical system(MEMS) which has a layer of Au metallization on the surface of components or *** paper presented the growth behavior of Au-Sn IMCs at interfaces of Au metallization and Sn-based solder joints with the addition of Cu alloying element during aging process,and growth coefficients of the Au-Sn IMCs were *** on the interfacial reaction between Sn-xCu solders and Au metallization during aging process show that three layers of Au-Sn IMCs including AuSn,AuSn2 and AuSn4 formed at the interface *** thickness of each Au-Sn IMC layer vs square root of aging time follows linear *** of the IMC growth coefficients shows that the diffusion coefficients decrease with the addition Cu elements,which indicates that Cu addition suppresses the growth of Au-Sn IMCs layer.

关键词： Sn-based solder alloys Cu alloying element Au-Sn intermetallic compounds

Phase evolution of tantalum nitride and tantalum carbide films with PBII parameters

在线全文

学校读者我要写书评

暂无评论

Rare Metals 2011年第2期30卷 142-145页

作者： LI Zhongwen GU Le TANG Guangze MA Xinxin SUN Mingren wang Liqin School of Materials Science ＆ Engineering Harbin Institute of Technology Harbin 150001 China School of Mechatronics Engineering Harbm Institute of Technology Harbin 150001 China state key lab of advanced welding production technology Harbin Institute of Technology Harbin 150001 China

Tantalum nitride and tantalum carbide films were fabricated using magnetron sputtering of tantalum followed by nitrogen and carbon plasma-based ion implantation （N-PBII and C-PBII）. The phase evolution and morphology of the films were studied using glancing angle X-ray diffraction （GXRD） and transmission electron microscopy （TEM）. It was found that the main phase in the tantalum nitride films was crystalline TaNo.1 whose grain size increases with increasing implantation voltage and phase content increases with increasing implantation dose. In the tantalum carbide film, the main phase was Ta2C. TaC phase also appeared as the implantation dose increased. XRD results from various glancing angles show that the phases with high nitrogen or carbon content, Ta4N5 and TaC, are present in the surface of the films. X-ray photoelectron spectra （XPS） from the tantalum carbide film reveal that the surface carbon content is higher than that of the inner film.

关键词： thin films tantalum nitride tantalum carbide phase composition magnetron sputtering ion implantation

EFFECT OF LASER INPUT ENERGY ON AuSn_x INTERMETALLIC COMPOUNDS FORMATION IN SOLDER JOINTS WITH DIFFER-ENT THICKNESS OF Au SURFACE FINISH ON PADS

在线全文

学校读者我要写书评

暂无评论

Acta Metallurgica Sinica(English Letters) 2008年第3期21卷 183-190页

作者： W. liu C.Q. wang Y.H. Tian M.Y. Li Department of Electronics Packaging technology State Key Lab of Advanced Welding Production Technology Harbin Institute of Technology Harbin 150001 China Shenzhen Graduate School of harbin institute of technology Shenzhen 518055 China

Formation of AuSnx intermetallic compounds （IMCs） in laser reflowed solder joints was investigated. The results showed that few IMCs formed at the solder/0. 1μm Au interface. Needlelike AuSn4 IMCs were observed at the solder/0.5μm Au interface. In Sn-2.0Ag-O,75Cu-3,0Bi and Sn-3.5Ag-O.75Cu solder joints, when the laser input energy was increased, AuSn4 IMCs changed .from a layer to needlelike or dendritic distribution at the solder/0.9μm Au interface. As for the solder joints with 4.0 μm thickness of Au surface finish on pads, AuSn4 , AuSnx, AuSn IMCs, and Au2Sn phases formed at the interface. Moreover, the content of AuSnx IMCs, such as, AuSn4 and AuSn2, which contained high Sn concentration, would become larger as the laser input energy increased. In the Sn-37Pb solder joints with 0.9 μm or 4.0 μm thickness of the Au surface finish on pads, AuSn4 IMCs were in netlike distribution. The interspaces between them were filled with Pb-rich phases.

关键词： Laser soldering Inlermetallics Au films

EVOLUTION OF MICROSTRUCTURE OF Sn-Ag-Cu LEAD-FREE FLIP CHIP SOLDER JOINTS DURING AGING PROCESS

在线全文

学校读者我要写书评

暂无评论

Acta Metallurgica Sinica(English Letters) 2006年第4期19卷 301-306页

作者： Y.H. Tian C.Q. wang W.F. Zhou state key lab of advanced welding production and technology Harbin Institute of Technology Harbin 150001 China

Flip chip bonding has become a primary technology that has found application in the chip interconnection process in the electronic manufacturing industry in recent years. The solder joints of the flip chip bonding are small and consist of complicated microstructures such as Sn solution, eutectic mixture, and intermetallic compounds （IMCs）, whose mechanical performance is quite different from the original solder bulk. The evolution of microstructure of the flip chip solder joints under thermal aging was analyzed. The results show that with an increase in aging time, coarsening of solder bulk matrix and AuSn4 IMCs occurred within the solder. The IMCs that are formed at the bottom side of the flip chip bond were different from those on the top side during the aging process. （Cu, Ni, Au）0Sn5 were formed at the interfaces of both sides, and large complicated （Au,Ni, Cu）Sn4 IMCs appeared for some time near the bottom interface after aging, but they disappeared again and thus （Cu,Ni, Au ）0Sn5 IMC thickness increased considerably. The influence of reflow times during the flip chip bonding （as-bonded condition） on the characteristics of interfacial IMCs was weakened when subjected to the aging process.

关键词： lead free solder flip chip aging

Influence of melt hydrogenation during induction skull melting process on the solidification microstructure of Ti-6Al-4V alloy

在线全文

学校读者我要写书评

暂无评论

china Foundry 2010年第2期7卷 109-112页

作者： Zhang Yuehong Su Yanqing Ye Xicong wang Liang Guo Jingjie Fu hengzhi National key laboratory of Hot Precision Process of Metal Harbin Institute of Technology Harbin 150001 China

A new method to modify the solidification microstructure of titanium alloys, named melt hydrogenation, by adding TiH2 as additive into the melt of titanium alloys during induction skull melting process (ISM), is put forward and the refining effect of this method on the solidification microstructure of Ti-6Al-4V alloy was studied experimentally. After melt hydrogenation, the grain sizes of as-cast Ti-6Al-4V alloy decreased to 612 μm from 1,072 μm, lath-shaped α phase was also refined and fine α/β lamellar microstructure was formed when 1.0 wt.% TiH2 was added. δ-hydride was found in the X-ray diffraction (XRD) spectra of Ti-6Al-4V alloy that prepared with 1.0 wt.% TiH2 added and the δ-hydride distributes in α phase as acicular precipitations.

关键词： melt hydrogenation Ti-6Al-4V microstructure refinement

Sagging phenomenon observed in micro-solder joints fabricated by laser reflow soldering process

在线全文

学校读者我要写书评

暂无评论

材料科学与工程（中英文版） 2008年第4期2卷 37-42页

作者： liu Wei wang Chun-qing TIAN Yan-hong KONG Ling-chao state key lab of advanced welding production technology Department of Electronics Packaging Technology Harbin Institute of Technology Harbin 150001 China