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A Novel Trident Incurvature Shape DGS to Suppress Radiated Emission in High Speed Printed Circuit Board

Circuits and Systems 2016年第10期7卷 3026-3037页

作者： Anandan Malaiarasan Dr. Suresh Kumar Natarajan Rajeswari Packianathan gobinath arumugam 1Department of Electronics and Communication Engineering Latha Mathavan Engineering College Madurai India Department of Electronics and Communication Engineering Velammal College of Engineering and Technology Madurai India

As per the entail in wireless communication, the ever increasing switching speeds of digital devices pose significant challenges. Signal quality is more important for high speed products and the signal integrity must ensure reliable transmission where signal integrity is a measure of the quality of an electrical signal. A high speed differential signal will result in signal integrity issues such as crosstalk and radiated emission. One of the solutions to suppress radiated emission is defected ground pattern. This paper introduces a novel trident incurvature shaped defected ground structure to suppress radiated emission that arises in high speed differential signal. The proposed defected ground structure is implemented using Ansoft HFSS simulation tool and its performance is quantified in terms of scattering parameters. The proposed trident incurvature shaped defected ground pattern reduces near end coupling and far end coupling by more than 6 dB and 2 dB respectively. It also provides better return loss and insertion loss in the frequency range 1 - 6 GHz.

关键词： Radiated Emission Near End Crosstalk Far End Crosstalk Return Loss Insertion Loss Defected Ground Structure

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