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Some Tools to Model Ground or Supply Bounces Induced in and out of Heterogeneous Integrated Circuits

Computer Technology and Application 2011年第10期2卷 788-800页

作者： Christian Gontrand Olivier Valorge Rabah Dahmanil Fengyuan Sun francis calmon Jacques Verdier Paul Dautriche Universite de Lyon INSA- Lyon INL CNRS-UMR5270 Villeurbanne F-69621 France R3 Logic 50 chemin de l＇Etoile Monbonnot-Saint-Martin 38330 France STMicroelectronics 12 Rue Jules Horowitz 38019 Grenoble Cedex 9 France

Electrical ground looks simple on a schematic; unfortunately, the actual performance of a circuit is dictated by its layout （and by its printed-circuit-board）. When the ground node moves, system performance suffers and the system radiates electromagnetic interferences. But the understanding of the physics of ground noise can provide an intuitive sense for reducing the problem. Ground bounce can produce transients with amplitudes of volts; most often changing magnetic flux is the cause; in this work, the authors use a Finite-Difference Time-Domain to begin to understand such phenomena. Additionally, predicting substrate cross-talks in mixed-signal circuits has become a critical issue to preserve signal integrity in future integrated systems. Phenomena that involve parasitic signal propagation into the substrate are discussed. A simple methodology to predict the substrate cross-talk and some associated tools are presented. Finally, the authors indicate a stochastic method which could grasp both outer or inner RF （Radio-Frequency） radiations and substrate parasites.

关键词： Electromagnetism 3D (three-dimensional) integration noise TSV (through silicon vias) ground or supply bounce mixed analog-digital integrated circuits substrate noise stochastic methodology.

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Analytical and Numerical Model Confrontation for Transfer Impedance Extraction in Three-Dimensional Radio Frequency Circuits

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Circuits and Systems 2012年第2期3卷 126-135页

作者： Olivier Valorge Fengyuan Sun Jean-Etienne Lorival Mohamed Abouelatta-Ebrahim francis calmon Christian Gontrand Faculty of Engineering-Ain Shams University Cairo Egypt R3 Logic Inc. Monbonnot-Saint-Martin France Université de Lyon Villeurbanne France

3D chip stacking is considered known to overcome conventional 2D-IC issues, using through silicon vias to ensure vertical signal transmission. From any point source, embedded or not, we calculate the impedance spread out;our ultimate goal will to study substrate noise via impedance field method. For this, our approach is twofold: a compact Green function or a Transmission Line Model over a multi-layered substrate is derived by solving Poisson’s equation analytically. The Discrete Cosine Transform (DCT) and its variations are used for rapid evaluation. Using this technique, the substrate coupling and loss in IC’s can be analyzed. We implement our algorithm in MATLAB;it permits to extract impedances between any pair of embedded contacts. Comparisons are performed using finite element methods.

关键词： Through Silicon Via (TSV) Green’s Function Transmission Line Model Radio Frequency (RF) Transfer Impedance Extraction

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Insights into Three-Dimensional Radiofrequency Circuits Connections

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Computer Technology and Application 2011年第6期2卷 456-470页

作者： Rabah Dahmani Olivier Valorge Fengyuan Sun Samir Labiod francis calmon Saida Latreche Ian O＇Connor Christian Gontrand INL CNRS-UMR5270 INSA-Lyon Universite de Lyon Villeurbanne F-69621 France R3 Logic 50 chemin de l ＇Etoile Monbonnot-Saint-Martin 38330 France Laboratoire Hyperfrdquence ＆ Semi-conducteur Ddpartement d＇Electronique Facultd des Sciences de l ＇Ingdnieur Universite Mentouri Constantine 25000 Algeria

The authors state briefly the possibility of various simulators to handle propagation of electromagnetic waves along some interconnections, in 3D RF （Radio Frequency） circuits. The studies are first derived in the time domain： a Finite-Difference Time-Domain method is applied, taking spectra via FFTs （Fast Fourier Transform） as post-processors. Electric and magnetic field distributions, pulse propagations along stripline structures or vias are highlighted. The scattering parameters for various cases are extracted and compared. Some original issue of this work is an insight on crosstalk or shielding phenomena between lines.

关键词： Maxwell's equations radio frequency (RF) numerical methods shielding effects through silicon via.

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