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2009 International Conference on Modeling, Simulation and Optimization

作者： chen jin~**,zhou jin,wang zhenhua school of electronic and electrical engineering shanghai second polytechnic university shanghai,{3.,201209 wang huiling school of energy & Power engineering huazhong university of science and {13. wuhan,{3.,43.070

Adoping pan-Boolean algebraic PID control theory, this paper designed a thermal impulse temperature controller based on MCU STC12C2052AD and H-bridge *** Hbridge controlled the electric current direction of the semiconductor cooler and enables the cooler to output thermal *** change rate of the current direction controlled the frequency of the thermal ***,the pan-Boolean algebraic PID control algorithms controlled the temperature amplitude of the thermal impulse by adjusting the duty factor of H-bridge PWM *** experiment test shows that the amplitude range of the exporting thermal impulse signal of the controller is from 0 to 60℃relative error is 1%, the rising time and dropping time of the thermal impulse are less than 50ms.

关键词： thermal impulse pan-Boolean algebra semiconductor cooling temperature control

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Two-dimensional materials for future information technology: status and prospects

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science china(Information sciences) 2024年第6期67卷 1-147页

作者： Hao QIU Zhihao YU Tiange ZHAO Qi ZHANG Mingsheng XU Peifeng LI Taotao LI Wenzhong BAO Yang CHAI Shula chen Yiqi chen Hui-Ming chenG Daoxin DAI Zengfeng DI Zhuo DONG Xidong DUAN Yuhan FENG Yu FU {3.gshu GUO Pengwen GUO Yue HAO Jun HE Xiao HE {3.gyi HU Weida HU Zehua HU Xinyue HUANG Ziyang HUANG Ali IMRAN Ziqiang KONG Jia LI Qian LI Weisheng LI Lei LIAO Bilu LIU Can LIU Chunsen LIU Guanyu LIU Kaihui LIU Liwei LIU Sheng LIU Yuan LIU Donglin LU Likuan MA Feng MIAO zhenhua NI {3.g NING Anlian PAN Tian-Ling REN Haowen SHU Litao SUN Yue SUN Quanyang TAO Zi-Ao TIAN Dong wang Hao wang Haomin wang Jialong wang Junyong wang Wenhui wang Xingjun wang Yeliang wang Yuwei wang Zhenyu wang Yao WE... school of electronic science and {3. Nanjing University school of Integrated Circuits Interdisciplinary Research Center for Future Intelligent Chips (Chip-X)Nanjing University school of Integrated Circuit science and engineering Nanjing University of Posts and Telecommunications State Key Laboratory of Infrared Physics Shanghai Institute of Technical Physics Chinese Academy of Sciences school of Physics and Key Lab of Quantum Materials and Devices of the Ministry of Education School of Electronic Science & EngineeringSoutheast University College of Integrated Circuits State Key Laboratory of Silicon and Advanced Semiconductor MaterialsZhejiang University Suzhou Laboratory State Key Laboratory of Integrated Chips and Systems School of MicroelectronicsFudan University Shaoxin Laboratory Department of Applied Physics The Hong Kong Polytechnic University Key Laboratory for Micro-Nano Physics and technology of Hunan Province College of Materials Science and EngineeringHunan University College of Integrated Circuits Zhejiang University Shenzhen Geim Graphene Center Shenzhen Key Laboratory of Layered Materials for Value-Added ApplicationsTsinghua-Berkeley Shenzhen Institute & Institute of Materials ResearchTsinghua Shenzhen International Graduate SchoolTsinghua University State Key Laboratory of Extreme Photonics and Instrumentation College of Optical Science and EngineeringInternational Research Center for Advanced PhotonicsZijingang CampusZhejiang University National Key Laboratory of Materials for Integrated Circuits Shanghai Institute of Microsystem and Information TechnologyChinese Academy of Sciences CAS Key Laboratory of Nanophotonic Materials and Devices & Key Laboratory of Nanodevices and Applications i-LabSuzhou Institute of Nano-Tech and Nano-Bionics (SINANO)Chinese Academy of Sciences College of Chemistry and Chemical engineering Hunan University Key Laboratory of Quantum State Construction and Manipulation (Ministry of Education) Department of PhysicsRenmin University of China school

Over the past 70 years, the semiconductor industry has undergone transformative changes,largely driven by the miniaturization of devices and the integration of innovative structures and materials. Two-dimensional(2D) materials like transition metal dichalcogenides(TMDs) and graphene are pivotal in overcoming the limitations of silicon-based technologies, offering innovative approaches in transistor design and functionality, enabling atomic-thin channel transistors and monolithic 3. integration. We review the important progress in the application of 2D materials in future information technology, focusing in particular on microelectronics and optoelectronics. We comprehensively summarize the key advancements across material production, characterization metrology, electronic devices, optoelectronic devices, and heterogeneous integration on silicon. A strategic roadmap and key challenges for the transition of 2D materials from basic research to industrial development are outlined. To facilitate such a transition, key technologies and tools dedicated to 2D materials must be developed to meet industrial standards, and the employment of AI in material growth, characterizations, and circuit design will be essential. It is time for academia to actively engage with industry to drive the next 10 years of 2D material research.

关键词： two-dimensional (2D) materials information technology production technology standardization of characterization microelectronicdevices optoelectronic devices multi-functional integration

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The logic analyses of heat transfer process between solids

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Journal of energy and Power engineering 2007年第1期1卷 29-33,40页

作者： chen jin~* wang Hui-ling zhou Zheng-xin HONG Xiao-ou school of electronic ＆ electrical {3. Shanghai Second Polytechnic University Shanghai 201209 China Institute of Refrigeration and Cryogenics Huazhong University of Science and Technology Wuhan 430074 China

The thermal switch algebra method and theory, which is used as a power tool of logic analyses of heat transfer process, is discussed in this paper, it was a practical application of pan-logic algebra in the heat science. As an example of heat switch algebra application, the logic algebra model of interfacial thermal resister between Bi-2223.and AIN were built at the range from 3.K to 200K according to the thermal switch algebra theory. The computer simulation results were agreed greatly with experiment data, the error is less that 5%. The design and analyses of digit heat routes can be described by the thermal switch algebra as well.

关键词： heat transfer thermal switch algebra thermal resister

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Professional English Teaching Practice for electronics Specialty

Professional English Teaching Practice for Electronics Speci...

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2013.教育技术与管理科学国际会议

作者： jin zhou Zhihua Hu Haihui Song Guanling chen school of electronic and electrical {3. shanghai second polytechnic university

This paper examines the existing problems in professional English teaching practice in engineering colleges, especially for electronics specialty. In order to further improve the teaching quality, measures involving four aspects-course setup, teaching methods, course contents, and performance evaluation are discussed. The practical usage of professional English should be the core content of teaching reform.

关键词： Professional English electronics Specialty Teaching Practice

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