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Acta Metallurgica Sinica(English Letters) 2004年第2期17卷 199-204页

作者： Y.H.Tian c.q.wang state key laboratory of advanced welding production technology,harbin institute of technology,harbin 150001,china state key laboratory of advanced welding production technology Harbin Institute of Technology

Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/cu) duringlaser and infrared reflow soldering were studied. During laser reflow soldering process,a thin layer of AuSn_4 was observed at the interface of the solder bumps, its morphologywas strongly dependent on the laser reflow power and heating time. The solder bumpsformed by the first laser reflow was reflowed again to form the solder joints. TheAuSn_4 compounds formed in the first laser reflow process dissolved into the bulk solderafter the secondary infrared reflow process. The needle-like AuSn_4 changed into rod-like, and distributed inside the solder near the solder/pad interface.

关键词： laser reflow infrared reflow bump's microstructure solder joint

cALcULATION　OF　THREE－DIMENSIONAL　SOLDER　JOINT　FORMATION　IN　MIcROELEcTRONIc　SURFAcE　MOUNT　technology

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Acta Metallurgica Sinica(English Letters) 1996年第4期9卷 240-246页

作者： G.Z. wang,c.q.wang and Y.Y qian (National key laboratory of advanced welding production technology, harbin institute of technology,harbin 150001, china )

A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of component on solder joint shapes were investigated. The resonable design ranges of solder volume and pad extension have been put forward.

关键词： surface mount technology chip component,solder joint shape

Phase evolution of tantalum nitride and tantalum carbide films with PBII parameters

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Rare Metals 2011年第2期30卷 142-145页

作者： LI Zhongwen GU Le TANG Guangze MA Xinxin SUN Mingren wang Liqin School of Materials Science ＆ Engineering Harbin Institute of Technology Harbin 150001 China School of Mechatronics Engineering Harbm Institute of Technology Harbin 150001 China state key lab of advanced welding production technology Harbin Institute of Technology Harbin 150001 China

Tantalum nitride and tantalum carbide films were fabricated using magnetron sputtering of tantalum followed by nitrogen and carbon plasma-based ion implantation （N-PBII and c-PBII）. The phase evolution and morphology of the films were studied using glancing angle X-ray diffraction （GXRD） and transmission electron microscopy （TEM）. It was found that the main phase in the tantalum nitride films was crystalline TaNo.1 whose grain size increases with increasing implantation voltage and phase content increases with increasing implantation dose. In the tantalum carbide film, the main phase was Ta2c. Tac phase also appeared as the implantation dose increased. XRD results from various glancing angles show that the phases with high nitrogen or carbon content, Ta4N5 and Tac, are present in the surface of the films. X-ray photoelectron spectra （XPS） from the tantalum carbide film reveal that the surface carbon content is higher than that of the inner film.

关键词： thin films tantalum nitride tantalum carbide phase composition magnetron sputtering ion implantation

Structure and mechanical properties of TiAlSicN coatings deposited by using multi-plasma immersion ion implantation and deposition

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Structure and mechanical properties of TiAlSiCN coatings dep...

Microstructures and wear resistance of high boron and low carbon ferroalloy using hybrid powder/wire overlaying method

第18届国际真空大会

作者： L.P. wang* Z.W. Xie X.F. wang J.c. Yan L. Huang and Y. Lu state key laboratory of advanced welding production technology harbin institute of technology harbin china

TiAlSicN composite coatings with different c and N contents were prepared by multi-plasma immersion ion implantation and deposition （MPIIID） using Ti and SiAl （70:30 wt. %） cathodes in N2 +c2H2 glow discharges. The chemical composition, microstructure, mechanical properties of these coatings were investigated by scanning electron microscopy （SEM）, X-ray diffraction （XRD）, X-ray photoelectron spectroscopy （XPS）, laser Raman spectrometer and nano-indentation tests. XRD patterns reveal that Tic and TiN structure dominates over the coating. XPS results show that AlN, Alcx, Sic, Si3N4, Al2O3 and Ti2O3 structures also exist in the coating. When the c content increase, the hardness of the film decreased gradually from 32Pa to 13GPa, the sp3 content of the film also reduced. The film with relative higher c content showed excellent wear resistance and lower friction coefficient.

关键词： TiAlSicN coating multi-plasma immersion ion implantation and deposition hardness wear

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china welding 2016年第1期25卷 57-63页

作者：庄明辉李慕勤王军蔡丁森周智远齐兆禹 state key laboratory of advanced welding and Joining Harbin Institute of Technology Harbin 150001 School of Material Science and Engineering Jiamusi University Jiamusi 154007

The high boron alloy surfacing layer was easily cracked due to its insufficient toughness by using hybrid powder/ wire overlaying method. In order to explore the cracked mechanism, the microstructures and the wear resistance of the samples with different boron contents were studied. Further, phases analysis, microhardness, macrohardness and wear test were also carried out. The boron content depended microstructures were observed. The precipitation of the Fe2B, Fe3 （ c, B）, Fe23 （c, B）6 were increased with the increase of boron content. It was found that the wear resistance was independent of the macrohardness as the macrohardness increased firstly and then remained steady at -62 HRc. However, the wear resistance was depended on the boron contents, and which increased with the increase of the boron contents. The abrasive loss mechanism changed from plastic deformation removal to fracture removal.

关键词： hybrid powder/wire overlaying method boride abrasive resistance

EVOLUTION OF MIcROSTRUcTURE OF Sn-Ag-cu LEAD-FREE FLIP cHIP SOLDER JOINTS DURING AGING PROcESS

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Acta Metallurgica Sinica(English Letters) 2006年第4期19卷 301-306页

作者： Y.H. Tian c.q. wang W.F. Zhou state key Lab of advanced welding production and technology Harbin Institute of Technology Harbin 150001 China

Flip chip bonding has become a primary technology that has found application in the chip interconnection process in the electronic manufacturing industry in recent years. The solder joints of the flip chip bonding are small and consist of complicated microstructures such as Sn solution, eutectic mixture, and intermetallic compounds （IMcs）, whose mechanical performance is quite different from the original solder bulk. The evolution of microstructure of the flip chip solder joints under thermal aging was analyzed. The results show that with an increase in aging time, coarsening of solder bulk matrix and AuSn4 IMcs occurred within the solder. The IMcs that are formed at the bottom side of the flip chip bond were different from those on the top side during the aging process. （cu, Ni, Au）0Sn5 were formed at the interfaces of both sides, and large complicated （Au,Ni, cu）Sn4 IMcs appeared for some time near the bottom interface after aging, but they disappeared again and thus （cu,Ni, Au ）0Sn5 IMc thickness increased considerably. The influence of reflow times during the flip chip bonding （as-bonded condition） on the characteristics of interfacial IMcs was weakened when subjected to the aging process.

关键词： lead free solder flip chip aging

EFFEcT OF LASER INPUT ENERGY ON AuSn_x INTERMETALLIc cOMPOUNDS FORMATION IN SOLDER JOINTS WITH DIFFER-ENT THIcKNESS OF Au SURFAcE FINISH ON PADS

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Acta Metallurgica Sinica(English Letters) 2008年第3期21卷 183-190页

作者： W. Liu c.q. wang Y.H. Tian M.Y. Li Department of Electronics Packaging technology State Key Lab of Advanced Welding Production Technology Harbin Institute of Technology Harbin 150001 China Shenzhen Graduate School of harbin institute of technology Shenzhen 518055 China

Formation of AuSnx intermetallic compounds （IMcs） in laser reflowed solder joints was investigated. The results showed that few IMcs formed at the solder/0. 1μm Au interface. Needlelike AuSn4 IMcs were observed at the solder/0.5μm Au interface. In Sn-2.0Ag-O,75cu-3,0Bi and Sn-3.5Ag-O.75cu solder joints, when the laser input energy was increased, AuSn4 IMcs changed .from a layer to needlelike or dendritic distribution at the solder/0.9μm Au interface. As for the solder joints with 4.0 μm thickness of Au surface finish on pads, AuSn4 , AuSnx, AuSn IMcs, and Au2Sn phases formed at the interface. Moreover, the content of AuSnx IMcs, such as, AuSn4 and AuSn2, which contained high Sn concentration, would become larger as the laser input energy increased. In the Sn-37Pb solder joints with 0.9 μm or 4.0 μm thickness of the Au surface finish on pads, AuSn4 IMcs were in netlike distribution. The interspaces between them were filled with Pb-rich phases.

关键词： Laser soldering Inlermetallics Au films

On the double-side probeless friction stir spot welding of AA2198 Al-Li alloy

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Journal of Materials Science & technology 2019年第5期35卷 784-789页

作者： q.chu W.Y.Li H.L.Hou X.W.Yang A.Vairis c.wang W.B.wang state key laboratory of Solidification Processing Shaanxi Key Laboratory of Friction Welding Technologies Northwestern Polytechnical University Xi'an 710072 China Beijing Aeronautical Manufacturing technology Research institute Beijing 100024 China Mechanical Engineering Department TEI of Crete HeraklionCrete71004 Greece

Double-side probeless friction stir spot welding (DP-FSSW) of AA2198 alloy was conducted to investigate the microstructure and mechanical properties. compared with common single-side probeless friction stir spot welding (P-FSSW), the plastic strain during DP-FSSW is nearly symmetrical with respect to the bondline to suppress the extension of hook defect, which is detrimental to the joint mechanical strength. With DP-FSSW, a fully metallurgically bonded region has formed due to severe plastic deformation at high temperatures. Tensile/shear tests show that the joint strength could exceed 8 kN, which is comparable to P-FSSW and refill FSSW, and all fractures happen in a shear failure mode as cracks extend along the in terface of two sheets. The microhard ness profile exhibits a uniform distribution along the thick ness direction, in which the hook defect shows the lowest value.

关键词： Friction stir welding Double-side Al-Li alloy Microstructure Mechanical property

Effect of Silver content on Microstructure and Properties of Brass/steel Induction Brazing Joint Using Ag-cu-Zn-Sn Filler Metal

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Journal of Materials Science & technology 2011年第4期27卷 377-381页

作者： J. cao L.X. Zhang H.q. wang L.Z. Wu J.c. Feng state keyLab of advanced welding production technology Harbin Instituteof Technology Harbin 150001 China center for composite Materials and Structures Harbin Institute of Technology Harbin 150001 China

The induction brazing of brass to steel using Ag-cu-Zn-Sn filler metal was investigated in this study. The influence of A8 content on the microstructure and properties were analyzed by means of optical microscopy, scanning electron microscopy and electron probe microanalysis. Defect free joint was achieved using Ag- cu-Zn-Sn filler metal. The microstructure of the joint was mainly composed of Ag-based solid solution and cu-based solid solution. The increase of A8 content and the cooling rate both led to the increase of the needle like eutectic structure. The tensile strength decreased with the increase of Ag content. The tensile strength at room temperature using Ag25cuZnSn filler metal reached 445 MPa. All fractures using Ag-cu-Zn-Sn filler metal presented ductile characteristic.

关键词： Induction brazing Brass Steel Microstructure Tensile strength

FEM SIMULATION FOR LASER FORMING PROcESSING

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Acta Metallurgica Sinica(English Letters) 2004年第3期17卷 317-322页

作者： L.q.Li Y.B.chen X.Y wang S.Y Lin state key laboratory of advanced welding production technology Harbin Institute of Technology Harbin 150001 China Harbin Research Institute of Welding Harbin 150001 ChinaState Key Laboratory of Advanced Welding Production Technology Harbin Institute of Technology Harbin 150001 China Harbin Research Institute of Welding Harbin 150001 ChinaHarbin Research Institute of Welding Harbin 150001 ChinaHarbin Research Institute of Welding Harbin 150001 China

Laser forming involves heating sheet metal workpiece along a certain path with adefocused laser beam directed irradiate to the surface. During laser forming, a tran-sient temperature fields is caused by the irradiation and travelling of a laser beam.consequently, thermal expansion and contraction take place, and allows the thermal-mechanical forming of complex shapes. This is a new manufacturing technique thatforming metal sheet only by thermal stress. Therefore, the analysis of temperaturefields and stress fields are very useful for studying the forming mechanism and con-trolling the accuracy of laser forming. The non--liner finite element solver, MARc, isemployed to solve the thermal--mechanical analysis. Using this model, the stress andstrain distribution of pure aluminum plate with different thickness are analyzed. Theinfluence of scanning speed on temperature fields and plastic strain of metal sheet un-der the condition of constant line energy are also presented. Numerical results agreewell with the experimental results.

关键词： laser forming FEM simulation temperature fields stress distributton