检索结果-南通市图书馆

Surface defects incorporated diamond machining of silicon

International Journal of Extreme Manufacturing 2020年第4期2卷 57-73页

作者： Neha Khatri borad M barkachary b muneeswaran Rajab Al-Sayegh Xichun Luo Saurav Goel Optical Devices&System Division CSIR-CSIOSector 30Chandigarh160030India Department of Mechanical Engineering Jorhat Institute of Science&TechnologyJorhat Assam 785010India Fenner Conveyor belting Pvt.Ltd. Dindigul Road NagriMaduraiVadipatti Taluk 625221India College of Engineering Northern Border UniversityArar 91431Saudi Arabia Centre for Precision Manufacturing DMEMUniversity of StrathclydeGlasgow G11XQUnited Kingdom School of Engineering London South Bank University103 Borough RoadLondon SE10AAUnited Kingdom EPSRC Centre for Doctoral Training in Ultra-Precision Engineering University of Cambridge and Cranfield UniversityCranfieldUnited Kingdom School of Aerospace Transport and ManufacturingCranfield UniversityBedfordshire MK430ALUnited Kingdom Department of Mechanical Engineering Shiv Nadar UniversityGautam Budh Nagar 201314India

This paper reports the performance enhancement benefits in diamond turning of the silicon wafer by incorporation of the surface defect machining(SDM)*** hybrid micromachining methods usually require additional hardware to leverage the added advantage of hybrid technologies such as laser heating,cryogenic cooling,electric pulse or ultrasonic elliptical *** SDM method tested in this paper does not require any such additional baggage and is easy to implement in a sequential micro-machining *** paper made use of Raman spectroscopy data,average surface roughness data and imaging data of the cutting chips of silicon for drawing a comparison between conventional single-point diamond turning(SPDT)and SDM while incorporating surface defects in the(i)circumferential and(ii)radial *** 3D finite element analysis(FEA)was performed to analyse the cutting forces and the evolution of residual stress on the machined *** was found that the surface defects generated in the circumferential direction with an interspacing of 1 mm revealed the lowest average surface roughness(Ra)of 3.2 nm as opposed to 8 nm Ra obtained through conventional SPDT using the same cutting *** observation of the Raman spectroscopy performed on the cutting chips showed remnants of phase transformation during the micromachining process in all *** was used to extract quantifiable information about the residual stress as well as the sub-surface integrity and it was discovered that the grooves made in the circumferential direction gave the best machining *** information being reported here is expected to provide an avalanche of opportunities in the SPDT area for low-cost machining solution for a range of other nominal hard,brittle materials such as SiC,ZnSe and GaAs as well as hard steels.

关键词： surface defect machining silicon finite element analysis surface roughness

来源：

维普期刊数据库

同方期刊数据库

同方期刊数据库评论

在线全文

学校读者我要写书评

暂无评论

欢迎您,

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

在线全文

请选择保存的检索档案：

请选择收藏分类：

通借通还

欢迎您,

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

在线全文

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：