High Performance Electronic Interconnect Materials Characterization–Techniques ＆ Challenges
会议名称：《2018中国高端SMT学术会议》
会议日期：2018年
学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）]
摘 要：High-power and LED devices generate significant heat that,if not efficiently removed from the assembly,leads to lower operating efficiency and/or lower luminous flux and shorter *** the majority of heat is transported through the device interconnect layer,the thermal resistance of the heat path significantly impacts overall device *** thermal conductivity interconnect materials significantly decrease the thermal resistance of the *** effects of high performance interconnect materials are easy to observe and affect end user performance and reliability（*** increasing total luminous flux,efficiency,and color stability）.These effects become more pronounced as these devices are over driven and are particularly important in power electronics and UV LED *** this study,a series of interconnect materials,including sintered nano-silver,SAC305 and a hybrid silver sintering epoxy,were used to assemble high-power AlGaInP/Si LEDs for laboratory *** temperature,thermal resistance,thermal conductivity,total luminous flux,peak wavelength,and efficiency were measured according to JESD51-1 and *** this paper we discuss the technical and design challenges associated with making accurate thermal resistance measurements across a multi-layered *** results of this laboratory study show the comparative performance of identical devices assembled with a variety of interconnect materials.A field example showing enhanced UV LED device performance with high thermal interconnect material is presented.