Analysis of UV Laser Machining Process for High Density Embedded IC Substrates
作者单位：Dept. of Mechanical Engineering Korea National University of Transportation Advanced Convergent Technology R&D GroupKITECH Metal Technology R&D GroupKITECH
会议名称：《2012 International Conference on Manufacturing(Manufacturing 2012)》
会议日期：1000年
学科分类：080903[工学-微电子学与固体电子学] 080901[工学-物理电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080401[工学-精密仪器及机械] 0804[工学-仪器科学与技术] 0803[工学-光学工程]
基 金：supported by a grant from the Academic Research Program of Korea National University of Transportation in 2012 internal project of KITECH
关 键 词：Build-up film Laser processing Embedded pattern
摘 要：New manufacturing process capable of high density patterns has been required. The most popular technique used today to form such fine pitch conductors is Semi-Additive Process（SAP） or variations of semi-additive process. New manufacturing method focus on the technologies designed to produce a smooth interface between resin and copper conductors for advantages in the high frequency application and fine conductor pitch capabilities. In this study, laser microprocessing was investigated for resin materials with various filler size, and was selected by suitable materials with processability and physical characteristics.