Fundamental Study on High-quality Dicing Method for Semiconductor Package by Fiber Laser
作者单位：Graduate School of Natural Science ＆ TechnologyOkayama University 3-1-1 TsushimanakaKita-kuOkayama 700-8530Japan
会议名称：《第十六届国际电加工会议》
会议届次：16th
会议日期：2010年
学科分类：08[工学] 0802[工学-机械工程] 080201[工学-机械制造及其自动化]
关 键 词：Semiconductor package Laser dicing High-quality Single-mode fiber laser Cooled assist gas Heat affected zone
摘 要：正Recently,the laser dicing method has been expected to replace a blade dicing method because of its high ***,in the laser dicing,the heat affected zone yielding heat damage should be reduced in order to prevent the deterioration of semiconductor devices consisting of silicon ***,the reduction of heat affected zone was experimentally investigated by using cooled assist *** is clarified that the combination of nitrogen assist gas in the coaxial direction of laser beam and cooled assist gas from the rear side of cutting direction led to the better cutting results with low heat affected zone.