Ag-nanoparticle Catalyst for Electroless Cu Deposition and Its Adsorption onto Epoxy Substrate
作者单位：Osaka Municipal Technical Research Institute Joto-ku Osaka 536-8553 JAPAN Okuno Chemical Industries Co. Ltd. Osaka 538-0044 JAPAN
会议名称：《2006年上海电子电镀学术报告会》
会议日期：2006年
学科分类：081702[工学-化学工艺] 08[工学] 0817[工学-化学工程与技术]
摘 要：正Introduction Electroless Cu plating on polymer substrate is the key process in the PWB manufacturing. Pd/Sn catalysts are usually used to initiate the electroless deposition. As a more inexpensive alternative, Ag nanoparticles can be used to start electroless Cu plating[1].In this paper, we show the preparation of Ag-nanoparticle catalyst and the enhancement of their adsoprtion onto the epoxy substrate by predipping into cationic surfactant solutions.