SCIENCE AND PACKAGING APPLICATION OF METAL/POLYMER INTERFACES
作者单位：IBM Research DivisionT.J.Watson Research Center Box 218Yorktown HeightsNY 10598
会议名称：《The Second International Conference on Solid State and Integrated Circuit Technology》
会议日期：1989年
学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学]
摘 要：正The drive for performance and density in VLSI microelectronics imposes stringent demands on the interconnect structures of semiconductor devices as well as for *** necessitates the development of complex multilaycrcd interconnect structures with challenging requirements in materials and *** current trend in packaging development is to integrate polymer layers as wiring layers together with glass or ceramic substrate to make optimum use of these two types of *** such structures,an important reliability concern is the mechanical integrity during operation and *** problem has been investigated by studying the chemistry and adhesion at the metal-polymer interface. Results will be summarized.