Evaluation of Thermal Strain on Cylindrical Adhesive Bonded Joints
作者单位：Materials & Processing Technology DepartmentAdvanced Technology R&D CenterMITSUBISHI ELECTRIC CORPORATION 8-1-1Tsukaguchi-HonmachiAmagasakiHyogo661-8661Japan
会议名称：《第三届世界粘接及相关现象大会暨北京粘接学会第十五届学术年会》
会议日期：2006年
学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化]
关 键 词：thermal strain cylindrical adhesive bonded joints distortion curing process circumferential direction lengthwise direction
摘 要：In bonding a cylinder and a column,it is difficult to observe the destructive state of a bonded *** adhesive failure and the material destruction by thermal strain occur,depending on materials and adherents. Then,by the strain gauge bonded outside of the cylinder,we evaluated the adhesive failure and the material destruction at the heat cycle. As a result,it was found that the distortion of the circumferential direction was larger than the lengthwise direction and it was found that the thermal strain changed from the kind of the adhesive,the bonding lap length,the bonding layer thickness and so ***,change of the distortion in curing process was able to be measured.