Fabrication and characterization of Ag flake hybrid circuits with IPL-sintering

作     者：Choong-Jae Lee Kwang-Ho Jung Kyung Deuk Min Bum-Geun Park Seung-Boo Jung Choong-Jae Lee;Kwang-Ho Jung;Kyung Deuk Min;Bum-Geun Park;Seung-Boo Jung

作者机构：School of Advanced Materials Science EngineeringSungkyunkwan University2066 Seobu-roJangan-guSuwon-si16419Republic of Korea Visual Display BusinessSamsung Electronics Co.Ltd.129Samsung-roYeongtong-guSuwon-si16677Republic of Korea 

出 版 物：《Journal of Materials Science & Technology》 (材料科学技术（英文版）)

年 卷 期：2020年第52卷第18期

页      面：13-18页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 0817[工学-化学工程与技术] 0806[工学-冶金工程] 0805[工学-材料科学与工程（可授工学、理学学位）] 0703[理学-化学] 0802[工学-机械工程] 0801[工学-力学（可授工学、理学学位）] 0702[理学-物理学] 

基　　金：supported by the Basic Science Research Program through the National Research Foundation of Korea(NRF)funded by the Ministry of Education(No.2019R1A6A1A03033215) supported by“Human Resources Program in Energy Technology”of the Korea Institute of Energy Technology Evaluation and Planning(KETEP),granted financial resource from the Ministry of Trade,Industry&Energy,Republic of Korea(No.20174030201800)。 

主　　题：Low-temperature sintering Flexibility Flaky powders Adhesion strength Intensive pulsed light 

摘      要：The study of photonic sintering has gained interest based on the advantages of fast processing at room temperature.However,printed electronics made from photonic sintering with an intensive pulsed light(IPL)energy source exhibit more mechanical instability than those made from conventional thermal sintering processes.To solve the mechanical instability problems,we fabricated Ag flake hybrid pastes with a variety of concentrations of Ag flake(0,25,50,75,and 100 wt.%).All of the screen-printed hybrid Ag circuits were fabricated on polyimide substrates and were sintered at 3.5 MW.Surface porosity was analyzed using the Brunauer-Emmett-Teller method.An IPC(Packaging Electronic Circuits)sliding test was performed to analyze the flexibility of the screen-printed Ag flake hybrid circuits.The adhesion strength of the hybrid circuits was evaluated with a roll-type 90°peel test.The hybrid Ag printed circuit showed improvements in both the flexibility and adhesion strength with the addition of Ag flake.