Stability of passive film and antibacterial durability of Cu-bearing L605 alloy in simulated physiological solutions

作     者：Peng-Fei Geng Jin-Long Zhao Tong Xi Chun-Guang Yang Ke Yang Peng-Fei Geng;Jin-Long Zhao;Tong Xi;Chun-Guang Yang;Ke Yang

作者机构：School of Nano Science and Technology InstituteUniversity of Science and Technology of ChinaSuzhou 215300China Institute of Metal ResearchChinese Academy of SciencesShenyang 110016China 

出 版 物：《Rare Metals》 (稀有金属（英文版）)

年 卷 期：2021年第40卷第5期

页      面：1126-1133页

核心收录：

学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 

基　　金：financially supported by the National Natural Science Foundation of China (Nos.51771199, 51631009 and 51501188) the National Key Research and Development Program (No.2016YFB0300205) 

主　　题：L605-Cu alloy Passive film Antibacterial rate Implant 

摘      要：In this work,the stability of passive film for long-time immersed Cu-bearing L605(L605-Cu) alloy in the phosphate buffer solution(PBS) was studied by potentiodynamic polarization and electrochemical impedance *** results showed that the impedance of passive film for L605-Cu alloy experienced an initial increase and subsequent stabilization with the increase in the immersion *** addition,the plate count method was employed to assess the antibacterial durability of L605-Cu alloy against Escherichia coli after long-time *** results indicated that the antibacterial rate of L605-Cu alloy presented a declining tendency with the immersion time prolonging.X-ray photoelectron spectroscopy(XPS) was used to analyze the change of the chemical composition in the passive film on L605-Cu alloy immersed in the PBS for different *** results showed that Cu content and its compounds in the passive film gradually increased with the immersion time prolonging,hinting declined activity of Cu ions penetrating into the passive film,which resulted in a decrease in the antibacterial performance.