Joining of SiC Ceramics by the Flash-Bonding Technique

作     者：Takuro Yoshitake Yoshio Ohta Mikito Kitayama 

作者机构：Department of Life Environment and Applied Chemistry Fukuoka Institute of Technology Fukuoka Japan 

出 版 物：《Journal of Materials Science and Chemical Engineering》 (材料科学与化学工程（英文）)

年 卷 期：2020年第8卷第3期

页      面：52-65页

学科分类：081702[工学-化学工艺] 08[工学] 0817[工学-化学工程与技术] 

主　　题：Silicon Carbide Joining Flash-Bonding Borosilicate Glass 

摘      要：Because Silicon carbide (SiC) ceramics have various excellent properties, the demand for larger and complicated shapes has been increasing. This paper introduces an innovative method that would not require a large furnace, and further, would minimize the production cost and the thermal history, namely the “flash-bonding technique. The borosilicate glass with low thermal expansion coefficient, Pyrex glass, was selected as the brazing material. In this work, as-is or surface-oxidized SiC plates were joined using Pyrex glass as brazing material, and the reaction and wetting of Pyrex glass on as-is or surface-oxidized SiC plate were investigated. It was found that the protective film of the surface-oxidized SiC lowered the oxygen partial pressure, and hence, generated many pores in the interface.