Three-Dimensional Chip Imaging

作     者：Marcus Woo Marcus Woo

作者机构：Senior Technology Writer 

出 版 物：《Engineering》 (工程（英文）)

年 卷 期：2020年第6卷第5期

页      面：485-486页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080203[工学-机械设计及理论] 0802[工学-机械工程] 

主　　题：computer planar verify 

摘      要：A new X-ray imaging technique can penetrate the layers of a computer chip and reveal its secrets—while keeping it *** method,called ptychographic X-ray laminography,should be useful for reverse engineering chips,verifying chip designs,and identifying *** could also be useful in other branches of science and engineering for zooming in on the three-dimensional(3D)structure of any sample with a planar geometry.